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WS512K32-35G1TQA

Description
SRAM Module, 512KX32, 35ns, CMOS, CQFP68, 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Categorystorage    storage   
File Size486KB,13 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS512K32-35G1TQA Overview

SRAM Module, 512KX32, 35ns, CMOS, CQFP68, 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WS512K32-35G1TQA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instruction23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time35 ns
Other featuresIT CAN ALSO BE CONFIGURED AS 2M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CQFP-G68
length23.88 mm
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height4.06 mm
Maximum standby current0.028 A
Minimum standby current2 V
Maximum slew rate0.66 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width23.88 mm
White Electronic Designs
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
n
Access Times of 15*, 17, 20, 25, 35, 45, 55ns
n
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400).
• 68 lead, 40mm Hermetic Low Profile CQFP,
3.5mm (0.140") (Package 502)
1
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880")
square (Package 510) 3.56mm (0.140") height.
• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880")
square, 5.08mm (0.200") high (Package 528).
• 68 lead, Hermetic CQFP (G1U) , 23.9mm (0.940")
square (Package 519) 3.57mm (0.140") height.
Designed to fit JEDEC 68 lead 0.990" CQFJ
footprint (Fig. 3).
1
WS512K32-XXX
n
Organized as 512Kx32, User Configurable as
1Mx16 or 2Mx8
n
Commercial, Industrial and Military Temperature
Ranges
n
TTL Compatible Inputs and Outputs
n
5 Volt Power Supply
n
Low Power CMOS
n
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
• 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940")
square (Package 524) 4.06mm (0.160") height.
n
Weight
WS512K32N-XH1X - 13 grams typical
WS512K32-XG2UX - 8 grams typical
WS512K32-XG1UX
1
- 5 grams typical
WS512K32-XG1TX - 5 grams typical
WS512K32-XG4TX
1
- 20 grams typical
WS512K32-XG2LX - 8 grams typical
*15ns Access Time available only in Commercial and Industrial
Temperature. This speed is not fully characterized and is subject to
change without notice.
Note 1: Package Not Recommended For New Design
FIG. 1
PIN CONFIGURATION FOR WS512K32N-XH1X
T
OP
V
IEW
P
IN
D
ESCRIPTION
I/O
0-31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
May 2003, Rev 12
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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