No. STSE-CC2008A
<Cat.No.020719>
SPECIFICATIONS FOR NICHIA CHIP TYPE
BLUE
LED
MODEL :
NSCB100AT
NICHIA CORPORATION
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Nichia STSE-CC2008A
<Cat.No.020719>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Reverse Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
I
F
I
FP
V
R
P
D
T
opr
T
stg
T
sld
Absolute Maximum Rating
25
80
5
100
-30 ~ + 85
-40 ~ +100
Reflow Soldering : 260°C
Hand Soldering : 350°C
(Ta=25°C)
Unit
mA
mA
V
mW
°C
°C
for 10sec.
for 3sec.
I
FP
Conditions : Pulse Width
<
10msec. and Duty
<
1/10
=
=
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
V
F
Reverse Current
I
R
Rank T
Iv
Luminous Intensity Rank S
Iv
Rank R
Iv
Condition
I
F
=20[mA]
V
R
= 5[V]
I
F
=20[mA]
I
F
=20[mA]
I
F
=20[mA]
Min.
-
-
124
88
62
Typ.
3.6
-
148
104
74
(Ta=25°C)
Max.
Unit
4.0
V
50
µA
178
mcd
124
mcd
88
mcd
!
Measurement Uncertainty of the Luminous Intensity : ± 10%
Color Rank
x
y
0.11
0.04
(I
F
=20mA,Ta=25°C)
Rank W
0.11
0.15
0.15
0.10
0.10
0.04
!
Measurement Uncertainty of the Color Coordinates : ± 0.01
!
One delivery will include up to one color rank and three luminous intensity ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ;
Package
:
Encapsulating Resin :
Electrodes
:
Ceramics
Silicone Resin
Au Plating
-1-
Nichia STSE-CC2008A
<Cat.No.020719>
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
According to the total delivery amount,
cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation.
Please refer to figure’s page.
The label on the minimum packing unit bag shows;
Part Number, Lot Number, Ranking, Quantity
· The boxes are not water resistant and therefore must be kept away from water and moisture.
5.LOT NUMBER
The first six digits number shows
lot number.
The lot number is composed of the following characters;
!"####
-
!$
!
- Year
( 1 for 2001, 2 for 2002 )
"
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
####
- Nichia's Product Number
!
- Ranking by Color Coordinates
$
- Ranking by Luminous Intensity
B for Nov.)
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Nichia STSE-CC2008A
<Cat.No.020719>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
Ta=25°C, I
F
=20mA
Ta=85°C, I
F
=5mA
60°C, RH=90%, I
F
=15mA
Ta=-30°C, I
F
=20mA
JEITA ED-4701
400 403
JEITA ED-4702
JEITA ED-4702
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3direction, 4cycles
3mm, 5 ± 1 sec.
5N,
10 ± 1 sec.
Note
2 times
Number of
Damaged
0/50
1 time
over 95%
20 cycles
100 cycles
10 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
1000 hrs.
48min.
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
Substrate Bending
Stick
1 time
1 time
0/50
0/50
(2) CRITERIA FOR JUDGING THE DAMAGE
Item
Symbol
Test Conditions
Criteria for Judgement
Min.
Max.
Forward Voltage
V
F
Reverse Current
I
R
Luminous Intensity
I
V
*) U.S.L. : Upper Standard Level
I
F
=20mA
-
U.S.L.*)# 1.1
V
R
=5V
-
U.S.L.*)# 2.0
I
F
=20mA
L.S.L.**)# 0.7
-
**) L.S.L. : Lower Standard Level
-3-
Nichia STSE-CC2008A
<Cat.No.020719>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag with a zipper.
A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel).
It is also recommended to return the LEDs to the original moisture proof
bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrode sections are comprised of a gold plated. The gold surface may be
affected by environments which contain corrosive gases and so on. Please avoid conditions which
may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty
during soldering operations. It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of LEDs.
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