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SMC6234F

Description
IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,100PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size512KB,7 Pages
ManufacturerSeiko Epson Corporation
Download Datasheet Parametric Compare View All

SMC6234F Overview

IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,100PIN,PLASTIC

SMC6234F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSeiko Epson Corporation
package instructionLQFP, QFP100,.8X1.0
Reach Compliance Codecompliant
Has ADCNO
Address bus width
bit size4
CPU seriesE0C6200/SMC6200
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
Negative supply voltage rating-3 V
Number of I/O lines8
Number of terminals100
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.8X1.0
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
power supply-3 V
Certification statusNot Qualified
RAM (bytes)240
rom(word)4096
ROM programmabilityMROM
speed0.06 MHz
Maximum slew rate0.01 mA
Maximum supply voltage3.5 V
Minimum supply voltage1.8 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULLWING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm

SMC6234F Related Products

SMC6234F SMC62L34F
Description IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,100PIN,PLASTIC IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,100PIN,PLASTIC
Is it Rohs certified? incompatible incompatible
package instruction LQFP, QFP100,.8X1.0 QFP, QFP100,.8X1.0
Reach Compliance Code compliant compliant
bit size 4 4
CPU series E0C6200/SMC6200 E0C6200/SMC6200
JESD-30 code R-PQFP-G100 R-PQFP-G100
JESD-609 code e0 e0
Negative supply voltage rating -3 V -1.5 V
Number of terminals 100 100
Maximum operating temperature 70 °C 70 °C
Minimum operating temperature -20 °C -20 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP QFP
Encapsulate equivalent code QFP100,.8X1.0 QFP100,.8X1.0
Package shape RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK
power supply -3 V -1.5 V
Certification status Not Qualified Not Qualified
RAM (bytes) 240 240
rom(word) 4096 4096
ROM programmability MROM MROM
Maximum slew rate 0.01 mA 0.008 mA
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULLWING GULL WING
Terminal pitch 0.65 mm 0.635 mm
Terminal location QUAD QUAD
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