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MB87007AP

Description
Telephone Dialer Circuit, PDIP18, PLASTIC, DIP-18
CategoryWireless rf/communication    Telecom circuit   
File Size720KB,28 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MB87007AP Overview

Telephone Dialer Circuit, PDIP18, PLASTIC, DIP-18

MB87007AP Parametric

Parameter NameAttribute value
MakerFUJITSU
package instructionDIP,
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T18
length22.05 mm
damage rate1:1.6
Number of functions1
Number of terminals18
Maximum operating temperature60 °C
Minimum operating temperature-30 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5 mm
Maximum slew rate5 mA
Nominal supply voltage5 V
surface mountNO
Telecom integrated circuit typesTELEPHONE DIALER CIRCUIT
Temperature levelOTHER
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm

MB87007AP Related Products

MB87007AP MB87008AP
Description Telephone Dialer Circuit, PDIP18, PLASTIC, DIP-18 Telephone Circuit, PDIP18
Maker FUJITSU FUJITSU
package instruction DIP, DIP, DIP18,.3
Reach Compliance Code unknown compliant
JESD-30 code R-PDIP-T18 R-PDIP-T18
Number of terminals 18 18
Maximum operating temperature 60 °C 60 °C
Minimum operating temperature -30 °C -30 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Certification status Not Qualified Not Qualified
Maximum slew rate 5 mA 5 mA
surface mount NO NO
Temperature level OTHER OTHER
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
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