MB87008AP datasheet, PDF - EEWORLD Datasheet

MB87008AP: DescriptionTelephone Circuit, PDIP18; CategoryWireless rf/communication Telecom circuit; File Size720KB，28 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MB87008AP Overview

Telephone Circuit, PDIP18

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	FUJITSU
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	compliant
crystal frequency	3.58 MHz
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
Number of terminals	18
Maximum operating temperature	60 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	3/5 V
Certification status	Not Qualified
Maximum slew rate	5 mA
surface mount	NO
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	MB87008AP	MB87007AP
Description	Telephone Circuit, PDIP18	Telephone Dialer Circuit, PDIP18, PLASTIC, DIP-18
Maker	FUJITSU	FUJITSU
package instruction	DIP, DIP18,.3	DIP,
Reach Compliance Code	compliant	unknown
JESD-30 code	R-PDIP-T18	R-PDIP-T18
Number of terminals	18	18
Maximum operating temperature	60 °C	60 °C
Minimum operating temperature	-30 °C	-30 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified
Maximum slew rate	5 mA	5 mA
surface mount	NO	NO
Temperature level	OTHER	OTHER
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL

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