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WF128K32-150G1TC5A

Description
Flash Module, 128KX32, 150ns, CQFP68, 23.90 X 23.90 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size388KB,16 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WF128K32-150G1TC5A Overview

Flash Module, 128KX32, 150ns, CQFP68, 23.90 X 23.90 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

WF128K32-150G1TC5A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instruction23.90 X 23.90 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time150 ns
Other featuresALSO CONFIGURABLE AS 512K X 8
Spare memory width16
Data pollingYES
JESD-30 codeS-CQFP-G68
length23.88 mm
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of departments/size8
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
page size128 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Department size16K
Maximum standby current0.0065 A
Maximum slew rate0.2 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width23.88 mm
White Electronic Designs
FEATURES
n
n
WF128K32-XXX5
128K
X
32 5V FLASH MODULE, SMD 5962-94716
Access Times of 50*, 60, 70, 90, 120, 150ns
Packaging:
• 66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
•
68 lead, Hermetic CQFP (G2U), 22.4mm (0.880
inch) square, 3.56mm (0.140 inch) high
(Package 510)
68 lead, Hermetic CQFP (G2L), 22.4mm (0.880
inch) square, 4.06mm (0.160 inch) high (Pack
age 528)
n
100,000 Erase/Program Cycles Typical, 0°C to +70°C
n
n
n
n
n
Organized as 128Kx32
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V ± 10% Supply
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Pins for Low Noise Operation
Control Time
n
Low Power CMOS, 1mA Standby Typical
•
n
Built-in Decoupling Caps and Multiple Ground
n
Page Program Operation and Internal Program
n
• 68 lead, Hermetic CQFP (G1U)
1
, 23.9mm (0.940
inch) square, 3.56mm (0.140 inch) high
(Package 519)
• 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940
inch) square, 4.06mm (0.160 inch) high
(Package 524)
n
Sector Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
Weight
WF128K32-XG2LX5 - 8 grams typical
WF128K32-XG1UX5
1
- 5 grams typical
WF128K32-XG1TX5 - 5 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
Note 1: Package Not Recommended For New Design
Note: For programming information refer to Flash Programming 1M5
Application Note.
* The access time of 50ns is available in Industrial and Commercial
temperature ranges only.
FIG. 1
PIN CONFIGURATION FOR WF128K32N-XH1X5
TOP VIEW
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
WE
2
CS
2
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
V
CC
CS
4
WE
4
I/O
27
A
4
A
5
A
6
WE
3
CS
3
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
PIN DESCRIPTION
I/O
0-31
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
May 2003 Rev. 6
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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