
Power unit ICs for pagers
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ROHM Semiconductor |
| Parts packaging code | SOIC |
| package instruction | SSOP-16 |
| Contacts | 16 |
| Reach Compliance Code | compli |
| JESD-30 code | R-PDSO-G16 |
| JESD-609 code | e3/e2 |
| length | 5 mm |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 60 °C |
| Minimum operating temperature | -15 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP16,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Nominal supply voltage | 1.5 V |
| surface mount | YES |
| technology | BICMOS |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN/TIN COPPER |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 10 |
| width | 4.4 mm |

| BH6113FV | BH6114FV | |
|---|---|---|
| Description | Power unit ICs for pagers | Power unit ICs for pagers |
| Is it lead-free? | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to |
| Maker | ROHM Semiconductor | ROHM Semiconductor |
| Parts packaging code | SOIC | SOIC |
| package instruction | SSOP-16 | SSOP-16 |
| Contacts | 16 | 16 |
| Reach Compliance Code | compli | compli |
| JESD-30 code | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609 code | e3/e2 | e3/e2 |
| length | 5 mm | 5 mm |
| Number of functions | 1 | 1 |
| Number of terminals | 16 | 16 |
| Maximum operating temperature | 60 °C | 60 °C |
| Minimum operating temperature | -15 °C | -15 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | TSSOP |
| Encapsulate equivalent code | TSSOP16,.25 | TSSOP16,.25 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 |
| power supply | 1.5 V | 1.5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.2 mm |
| Nominal supply voltage | 1.5 V | 1.5 V |
| surface mount | YES | YES |
| technology | BICMOS | CMOS |
| Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN/TIN COPPER | TIN/TIN COPPER |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | 10 | 10 |
| width | 4.4 mm | 4.4 mm |