Target data sheet
SPI10N10
SPP10N10,SPB10N10
Feature
SIPMOS
=
Power-Transistor
Product Summary
V
DS
R
DS(on)
I
D
P-TO262-3-1
P-TO263-3-2
•
N-Channel
•
Enhancement mode
•=175°C
operating temperature
•
Avalanche rated
•
dv/dt rated
100
180
10.3
P-TO220-3-1
V
mΩ
A
Type
SPP10N10
SPB10N10
SPI10N10
Package
Ordering Code
Marking
10N10
10N10
10N10
P-TO220-3-1 -
P-TO263-3-2 -
P-TO262-3-1 -
Maximum Ratings,at
T
j
= 25 °C, unless otherwise specified
Parameter
Continuous drain current
T
C
=25°C
T
C
=100°C
Symbol
I
D
Value
10.3
-
Unit
A
Pulsed drain current
T
C
=25°C
I
D puls
E
AS
dv/dt
V
GS
P
tot
T
j ,
T
stg
41.2
60
6
±20
50
-55... +175
55/175/56
mJ
kV/µs
V
W
°C
Avalanche energy, single pulse
I
D
=10.3 A ,
V
DD
=25V,
R
GS
=25Ω
Reverse diode dv/dt
I
S
=10.3A,
V
DS
=80V, di/dt=200A/µs,
T
jmax
=175°C
Gate source voltage
Power dissipation
T
C
=25°C
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Page 1
2001-03-16
Target data sheet
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
SPI10N10
SPP10N10,SPB10N10
Symbol
min.
R
thJC
R
thJA
R
thJA
-
-
-
-
Values
typ.
-
-
-
-
max.
3
100
75
50
Unit
K/W
Electrical Characteristics,
at
T
j
= 25 °C, unless otherwise specified
Parameter
Static Characteristics
Drain-source breakdown voltage
V
GS
=0V,
I
D
=1mA
Symbol
min.
V
(BR)DSS
V
GS(th)
I
DSS
-
-
I
GSS
R
DS(on)
-
-
100
2.1
Values
typ.
-
3
max.
-
4
Unit
V
Gate threshold voltage,
V
GS
=
V
DS
I
D
= 21 µA
Zero gate voltage drain current
V
DS
=100V,
V
GS
=0V,
T
j
=25°C
V
DS
=100V,
V
GS
=0V,
T
j
=125°C
µA
0.01
1
1
tbd
1
100
100
180
nA
mΩ
Gate-source leakage current
V
GS
=20V,
V
DS
=0V
Drain-source on-state resistance
V
GS
=10V,
I
D
=-A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2001-03-16
Target data sheet
Electrical Characteristics,
at
T
j
= 25 °C, unless otherwise specified
Parameter
Dynamic Characteristics
Transconductance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
DD
=50V,
V
GS
=10V,
I
D
=10.3A,
R
G
=28Ω
V
DS
≥2*I
D
*R
DS(on)max
,
I
D
=-A
V
GS
=0V,
V
DS
=25V,
f=1MHz
SPI10N10
SPP10N10,SPB10N10
Symbol
Conditions
min.
tbd
-
-
-
-
-
-
-
Values
typ.
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
max.
-
tbd
tbd
tbd
tbd
tbd
tbd
tbd
Unit
S
pF
ns
Gate Charge Characteristics
Gate to source charge
Gate to drain charge
Gate charge total
Gate plateau voltage
Reverse Diode
Inverse diode continuous
forward current
Inverse diode direct current,
pulsed
Inverse diode forward voltage
Reverse recovery time
Reverse recovery charge
V
SD
t
rr
Q
rr
V
GS
=0V,
I
F
=10.3A
V
R
=50V,
I
F =
l
S
,
di
F
/dt=100A/µs
Q
gs
Q
gd
Q
g
V
DD
=80V,
I
D
=10.3A
-
-
-
-
tbd
tbd
tbd
tbd
tbd
tbd
tbd
-
nC
V
DD
=80V,
I
D
=10.3A,
V
GS
=0 to 10V
V
(plateau)
V
DD
=80V,
I
D
=10.3A
I
S
I
SM
V
T
C
=25°C
-
-
-
-
-
-
-
tbd
tbd
tbd
10.3
41.2
tbd
tbd
tbd
A
V
ns
nC
Page 3
2001-03-16
Target data sheet
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
SPI10N10
SPP10N10,SPB10N10
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Page 4
2001-03-16