PCIMX535DVV1C datasheet, PDF - EEWORLD Datasheet

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PCIMX535DVV1C: DescriptionSPECIALTY MICROPROCESSOR CIRCUIT, PBGA529; Categorysemiconductor The embedded processor and controller; File Size2MB，204 Pages; ManufacturerFREESCALE (NXP)

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PCIMX535DVV1C Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529

PCIMX535DVV1C Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	529
Maximum supply/operating voltage	1.3 V
Minimum supply/operating voltage	1.2 V
Rated supply voltage	1.25 V
Processing package description	19 × 19 MM, 0.80, MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529
Lead-free	Yes
EU RoHS regulations	Yes
state	ACTIVE
packaging shape	SQUARE
Package Size	GRID array, FINE PITCH
surface mount	Yes
Terminal form	BALL
Terminal spacing	0.8000 mm
terminal coating	Tin copper/tin silver
Terminal location	BOTTOM
Packaging Materials	Plastic/Epoxy
Microprocessor type	microprocessor circuit

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Freescale Semiconductor

Data Sheet: Advance Information

Document Number: IMX53CEC

Rev. 2, 5/2011

MCIMX53xD

i.MX53xD Applications

Processors for Consumer

Products

Package Information

Plastic Package

Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch

Case FC-PBGA PoP 12 x 12 mm

Ordering Information

See

Table 1 on page 3

Introduction

The i.MX53xD multimedia application processor is

Freescale Semiconductor’s latest addition to a growing

family of multimedia-focused products offering high

performance processing optimized for lowest power

consumption.

The i.MX53xD processor features Freescale’s advanced

implementation of the ARM™ core, which operates at

clock speeds as high as 1 GHz and interfaces with

DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800

DRAM memories. This device is suitable for

applications such as the following:

• Tablets, high-end mobile internet devices (MID)

• Smart mobile devices

• Thin clients

• Internet monitors, media phones, high-end

portable media players (PMP) with HD video

capability

• Gaming consoles

The flexibility of the i.MX53xD architecture allows for

its use in a wide variety of applications. As the heart of

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17

4.2. Power Supplies Requirements and Restrictions . 25

4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 28

4.4. Output Buffer Impedance Characteristics . . . . . . 35

4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39

4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 46

4.7. External Peripheral Interfaces Parameters . . . . . . 68

4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 146

Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 147

5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 147

5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 148

5.3. Power setup during Boot . . . . . . . . . . . . . . . . . . 149

Package Information and Contact Assignments . . . . . 150

6.1. 19x19 mm Package Information . . . . . . . . . . . . . 150

6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 169

6.3. PoP 12 x 12 mm Package on Package (PoP)

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

Introduction

the application chipset, the i.MX53xD processor provides all the interfaces for connecting peripherals,

such as WLAN, Bluetooth™, GPS, hard drive, camera sensors, and dual displays.

Features of the i.MX53xD processor include the following:

• Applications processor—The i.MX53xD processors boost the capabilities of high-tier portable

applications by satisfying the ever increasing MIPS needs of operating systems and games.

Freescale’s Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction,

allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as

audio decode.

• Multilevel memory system—The multilevel memory system of the i.MX53xD is based on the L1

instruction and data caches, L2 cache, internal and external memory. The i.MX53xD supports

many types of external memory devices, including DDR2, low voltage DDR2, LPDDR2, DDR3,

NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed

NAND including eMMC up to rev 4.4.

• Smart speed technology—The i.MX53xD device has power management throughout the IC that

enables the rich suite of multimedia features and peripherals to consume minimum power in both

active and various low power modes. Smart speed technology enables the designer to deliver a

feature-rich product requiring levels of power far lower than industry expectations.

• Multimedia powerhouse—The multimedia performance of the i.MX53xD processor ARM core is

boosted by a multilevel cache system, Neon (including advanced SIMD, 32-bit single-precision

floating point support) and vector floating point coprocessors. The system is further enhanced by

a multistandard hardware video codec, autonomous image processing unit (IPU), SD and HD720p

triple video (TV) encoder with triple video DAC, and a programmable smart DMA (SDMA)

controller.

• Powerful graphics acceleration—Graphics is the key to mobile game, navigation, web browsing,

and other applications. The i.MX53xD processors provide two independent, integrated graphics

processing units: an OpenGL

ES 2.0 3D graphics accelerator (33 Mtri/s, 200 Mpix/s, and

800 Mpix/s z-plane performance) and an OpenVG™ 1.1 2D graphics accelerator (200 Mpix/s).

• Interface flexibility—The i.MX53xD processor supports connection to a variety of interfaces,

including LCD controller for two displays and CMOS sensor interface, high-speed USB on-the-go

with PHY, plus three high-speed USB hosts, multiple expansion card ports (high-speed

MMC/SDIO host and others), 10/100 Ethernet controller, and a variety of other popular interfaces

(PATA, UART, I

C, and I

S serial audio, among others).

• Advanced security—The i.MX53xD processors deliver hardware-enabled security features that

enable secure e-commerce, digital rights management (DRM), information encryption, secure

boot, and secure software downloads. For detailed information about the i.MX53xD security

features contact a Freescale representative.

The i.MX53xD application processor is a follow-on to the i.MX51, with improved performance, power

efficiency, and multimedia capabilities.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

PCIMX535DVV1C Related Products

	PCIMX535DVV1C	MCIMX535DVV1C	MCIMX538DZK1C	PCIMX538DZK1C
Description	SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529	SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529	SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529	SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529
Number of functions	1	1	1	1
Number of terminals	529	529	529	529
Maximum supply/operating voltage	1.3 V	1.3 V	1.3 V	1.3 V
Minimum supply/operating voltage	1.2 V	1.2 V	1.2 V	1.2 V
Rated supply voltage	1.25 V	1.25 V	1.25 V	1.25 V
Processing package description	19 × 19 MM, 0.80, MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529	19 × 19 MM, 0.80, MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529	19 × 19 MM, 0.80, MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529	19 × 19 MM, 0.80, MM PITCH, ROHS COMPLIANT, PLASTIC, TEPBGA-529
Lead-free	Yes	Yes	Yes	Yes
EU RoHS regulations	Yes	Yes	Yes	Yes
state	ACTIVE	ACTIVE	ACTIVE	ACTIVE
packaging shape	SQUARE	SQUARE	SQUARE	SQUARE
Package Size	GRID array, FINE PITCH	GRID array, FINE PITCH	GRID array, FINE PITCH	GRID array, FINE PITCH
surface mount	Yes	Yes	Yes	Yes
Terminal form	BALL	BALL	BALL	BALL
Terminal spacing	0.8000 mm	0.8000 mm	0.8000 mm	0.8000 mm
terminal coating	Tin copper/tin silver	Tin copper/tin silver	Tin copper/tin silver	Tin copper/tin silver
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Packaging Materials	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy	Plastic/Epoxy
Microprocessor type	microprocessor circuit	microprocessor circuit	microprocessor circuit	microprocessor circuit

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