Standard SRAM, 256X4, 5ns, ECL100K, CDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 5 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 1024 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Negative supply voltage rating | -4.5 V |
| Number of terminals | 24 |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 256X4 |
| Output characteristics | OPEN-EMITTER |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | -4.5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.22 mA |
| surface mount | NO |
| technology | ECL100K |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| MM100E422-5D | MM10E422-5D | MM10E422L-5D | MM10E422L-7D | MM100E422-3D | MM100E422L-5D | MM100E422L-7D | MM10E422-3D | |
|---|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 256X4, 5ns, ECL100K, CDIP24, | Standard SRAM, 256X4, 5ns, ECL10K, CDIP24, | Standard SRAM, 256X4, 5ns, ECL10K, CDIP24, | Standard SRAM, 256X4, 7ns, ECL10K, CDIP24, | Standard SRAM, 256X4, 3ns, ECL100K, CDIP24, | Standard SRAM, 256X4, 5ns, ECL100K, CDIP24, | Standard SRAM, 256X4, 7ns, ECL100K, CDIP24, | Standard SRAM, 256X4, 3ns, ECL10K, CDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 5 ns | 5 ns | 5 ns | 7 ns | 3 ns | 5 ns | 7 ns | 3 ns |
| I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Negative supply voltage rating | -4.5 V | -5.2 V | -5.2 V | -5.2 V | -4.5 V | -4.5 V | -4.5 V | -5.2 V |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| character code | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| organize | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 | 256X4 |
| Output characteristics | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.4 | DIP24,.4 | DIP24,.4 | DIP24,.4 | DIP24,.4 | DIP24,.4 | DIP24,.4 | DIP24,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | -4.5 V | -5.2 V | -5.2 V | -5.2 V | -4.5 V | -4.5 V | -4.5 V | -5.2 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.22 mA | 0.22 mA | 0.15 mA | 0.15 mA | 0.22 mA | 0.15 mA | 0.15 mA | 0.22 mA |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | ECL100K | ECL10K | ECL10K | ECL10K | ECL100K | ECL100K | ECL100K | ECL10K |
| Temperature level | OTHER | COMMERCIAL | COMMERCIAL | COMMERCIAL | OTHER | OTHER | OTHER | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - |
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