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PMK35EP

Description
P-channel TrenchMOS extremely low level FET
CategoryDiscrete semiconductor    The transistor   
File Size126KB,12 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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PMK35EP Overview

P-channel TrenchMOS extremely low level FET

PMK35EP Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOIC
package instructionSMALL OUTLINE, R-PDSO-G8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage30 V
Maximum drain current (Abs) (ID)14.9 A
Maximum drain current (ID)14.9 A
Maximum drain-source on-resistance0.019 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeMS-012AA
JESD-30 codeR-PDSO-G8
JESD-609 codee4
Humidity sensitivity level2
Number of components1
Number of terminals8
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Polarity/channel typeP-CHANNEL
Maximum power dissipation(Abs)6.9 W
Maximum pulsed drain current (IDM)28.8 A
Certification statusNot Qualified
surface mountYES
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature30
transistor applicationsSWITCHING
Transistor component materialsSILICON
PMK35EP
P-channel TrenchMOS extremely low level FET
Rev. 02 — 29 April 2010
Product data sheet
1. Product profile
1.1 General description
Extremely low level P-channel enhancement mode Field-Effect Transistor (FET) in a
plastic package using TrenchMOS technology. This product is designed and qualified for
use in computing, communications, consumer and industrial applications only.
1.2 Features and benefits
Low conduction losses due to low
on-state resistance
1.3 Applications
Battery management
Load switching
1.4 Quick reference data
Table 1.
Symbol
V
DS
I
D
P
tot
Quick reference data
Parameter
drain-source
voltage
drain current
total power
dissipation
drain-source
on-state
resistance
Conditions
25 °C
T
j
150 °C
T
sp
= 25 °C; V
GS
= -10 V; see
Figure 1;
see
Figure 3
T
sp
= 25 °C; see
Figure 2
Min
-
-
-
Typ
-
-
-
Max Unit
-30
-14.
9
6.9
V
A
W
Static characteristics
R
DSon
V
GS
= -10 V; I
D
= -9.2 A;
T
j
= 25 °C; see
Figure 9
-
16
19
mΩ
Dynamic characteristics
Q
GD
gate-drain charge V
GS
= -10 V; I
D
= -9.2 A;
V
DS
= -15 V; T
j
= 25 °C;
see
Figure 11;
see
Figure 12
-
6
-
nC

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