Ultra-low ohmic chip resistors for current detection
PMR series
●
Datasheet
Features
1)Ultra low-ohmic resistance range (1mΩ ~ )
2)Improved current detection accuracy by trimming-less structure.
3)Special low resistance temperature coefficient.
4)The unique chip structure minimizes thermal stress during temperature cycling,
resulting in greater reliability.
5)ROHM resistors have obtained ISO9001 / ISO / TS16949 certification.
6)Corresponds to AEC-Q200. (PMR01 is preparing)
●
Products
½
ist
Size
Part No.
(mm)
PMR01
PMR03
PMR10
PMR18
PMR25
PMR50
PMR100
∗
Rated power
(70
℃
)
(inch)
0402
0603
0805
1206
1210
2010
2512
(W)
0.2
0.25
0.5
1
1
1
2
T
emperature
coefficient
(ppm /
℃
)
0
½
+200
0
½
+150
±150
±100
±100
±100
±150
∗
Resistance
tolerance
(%)
J ( ±5% )
F ( ±1% )
J ( ±5% )
F ( ±1% )
G ( ±2% )
J ( ±5% )
F ( ±1% )
J ( ±5% )
F ( ±1% )
J ( ±5% )
J ( ±5% )
J ( ±5% )
F ( ±1% )
J ( ±5% )
Resistance range
(mΩ)
10
10
2,3,4,5,6,7,8,9,10
1,2,3,4,5,6,7,8,9,10
1,2,3,4,5
1,2,2.5,3,4,5,6,7,8,9,10
1,2,3,4,5,6,7,8,9,10
Operating
temperature
range
(
℃
)
-55
½
+155
-55
½
+155
-55
½
+155
-55
½
+155
-55
½
+155
-55
½
+155
-55
½
+155
1005
1608
2012
3216
3225
5025
6432
: ±150ppm/
℃
(1mΩ, 2mΩ Only)
Design and specifications are subject to change without notice.
Carefully check the specification sheet supplied with the product before using or ordering it.
●
Part Number Description
P M R
Part No.
2 5
Size (mm [inch])
01(1005 [0402])
03(1608 [0603])
10(2012 [0805])
18(3216 [1206])
25(3225 [1210])
50(5025 [2010])
100(6432 [2512])
H Z P
Packaging specifications code
Packaging
Part No. Code specifications Quantity
/ Reel
PMR01
PMR03
PMR10
PMR18
PMR25
PMR50
PMR100
J
Resistance
tolerance
F ( ±1%)
G ( ±2%)
J ( ±5%)
V
Special
part code
U:5
½
10mΩ
V:1
½
4mΩ
2 L 0
Nominal resistance
Resistance code,
3 or 4 digits.
Resistance
value(Ω)
1mΩ
2mΩ
3mΩ
4mΩ
5mΩ
6mΩ
7mΩ
8mΩ
9mΩ
10mΩ
Resistance
tolerance
PMR
(Ultra-low ohmic
chip resistors
for current
detection)
ZZP
EZP
EZP
EZP
HZP
HZP
HZP
Embossed tape
( 2mm pitch)
Paper tape
( 4mm pitch)
Paper tape
( 4mm pitch)
Paper tape
( 4mm pitch)
Embossed tape
( 4mm pitch)
Embossed tape
( 4mm pitch)
Embossed tape
( 4mm pitch)
10,000
5,000
5,000
5,000
2,000
2,000
2,000
J
1L0
2L0
3L0
4L0
5L0
6L0
7L0
8L0
9L0
10L
FG
,
1L00
2L00
3L00
4L00
5L00
6L00
7L00
8L00
9L00
10L0
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
1/4
2017.01 - Rev.G
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
2
,
H
2
S, NH
3
, SO
2
, and NO
2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
The Products are not subject to radiation-proof design.
Please verify and confirm characteristics of the final or mounted products in using the Products.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
Confirm that operation temperature is within the specified range described in the product specification.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
(Note 1)
3.
4.
5.
6.
7.
8.
9.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
2.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
