TVS Diode Arrays
TVS Avalanche Diode in a Chip Scale Package
SP0501BACT
The product is a silicon P/N structure tailored for ESD protection and is
offered in the standard EIA 0402 size. The single channel Chip Scale
device is used to help protect sensitive digital or analog input circuits on
data, signal, or control lines with voltage levels up to 5VDC. The bipolar
device is ideal for protection where AC signals are present.
The state-of-the-art device is designed to suppress ESD and other
transient over-voltage events to meet the International Electrotechnical
Compatability (EMC transient immunity stantards IEC 61000-4-2 for
Electrosatic Discharge Requirements). The monolithic silicon device is
comprised of specially designed structures for transient voltage suppres-
sion (TVS). The size and shape of these structures has been tailored
for transient protection. The low capacitance and clamp voltage are ideal
for high speed signal line protection.
Ordering Information
Part Number
SP0501BACT
Diode
Channels
1
Bumps
2
Package Size
mils (mm)
40x20 (1x 0.5)
Quantity Per
Reel
3500
5
Schematic
SP0501BAC
Applications
• Cell phone handsets
• Personal Digital Assistants (PDA)
• Portable handheld equipment (Laptop, Palmtop computers)
• Computer port, keyboard (USB1.1)
• Set-Top Box (Audio and Video ports)
Features
• Single channel suppressor in an EIA 0402 device size
• ESD Capability
- IEC 61000-4-2, Direct Discharge .................................30kV (Level 4)
- IEC 61000-4-2, Air Discharge ......................................30kV (Level 4)
- MIL STD 883D (Method 3015.7).................................................30kV
• Signal line protection for applications up to 5VDC
• Fast response time .........................................................................< 1ns
• Low input capacitance .........................................................30pF Typical
• Low clamp voltage (8kV test) ................................................13V Typical
• Low input leakage ....................................................1nA @ 3.3V Typical
• Operating temperature range ............................................-40°C to 85°C
• PCMCIA cards
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TVS Diode Arrays
TVS Avalanche Diode in a Chip Scale Package
SP0501BACT
Electrical Specifications
T
A
= 25°C Unless Otherwise Specified
PARAMETER
Reverse Standoff Voltage
Reverse Standoff Leakage Current
Signal Clamp Voltage
Positive
Negative
Clamp Voltage during ESD
MIL-STD 833D (Method 3015.7)
ESD Test Level
IEC-61000-4-2, Contact discharge
MIL-STD-883D Method 3015 (HBM)
Capacitance
Turn on/off Time
Temperature Range
Operating
Storage
-40
-65
85
150
°C
°C
5V @ 1Mhz
30
30
30
<1
8kV
13
V
V
kV
kV
pF
ns
I = 10mA
I = 10mA
6.0
-9.2
7.5
- 7.5
9.2
- 6.0
V
V
TEST CONDITIONS
I = 10µA
V = 5.5V
MIN
±5.9
TYPICAL
-
1
MAX
-
100
UNITS
V
µA
Typical Device Capacitance vs. Voltage
50
Outline Drawing
40
30
20
0.076
(.003")
1.0 (.04")
0.076 (.003")
0.36
(.014")
0.5 (.02")
10
0
0.36 (.014")
0.076 (.003")
0
1
2
3
4
5
0.15 (.006")
NOTE** Metal Bump: 63/37 (Sn/Pb) alloy
Voltage Across Device (V)
220
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TVS Diode Arrays
TVS Avalanche Diode in a Chip Scale Package
SP0501BACT
Printed Circuit Board Recommendations
Pad Size in PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening
Solder Flux Ratio
Solder Paste Type
Board Trace Finish
14 x 6 mils (0.356 x 0.152mm)
Rectangle
Non Solder Mask Defined Pads (NSMD)
18 x 10 mils (0.457 x 0.254mm)
6 mils (0.152mm)
14 x 6 mils (0356 x 0.152mm)
50/50
No Clean
Organic Solderable Preservative (OSP)
(Enteck: Cu Plus 106A)
28 mils
2 mils
Solder stencil
opening/PCB land
Solder Mask
Opening
5
14 mils 18 mils
2 mils
6 mils
10 mils
Typical Solder Reflow Thermal Profile (No-Clean Flux)
250
EXH
PH
Z2
Z3
Z4
Z
RF
CD
EXH
225
200
Temperature (
o
C)
175
150
125
100
75
50
25
0
48
97
145
194
242
290
339
387
435
Time (s)
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