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MX29F100BMC-12

Description
Flash, 64KX16, 120ns, PDSO44, 0.500 INCH, PLASTIC, MO-175, SOP-44
Categorystorage    storage   
File Size444KB,46 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Download Datasheet Parametric Compare View All

MX29F100BMC-12 Overview

Flash, 64KX16, 120ns, PDSO44, 0.500 INCH, PLASTIC, MO-175, SOP-44

MX29F100BMC-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMacronix
Parts packaging codeSOIC
package instructionSOP, SOP44,.63
Contacts44
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time120 ns
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G44
JESD-609 codee0
length28.5 mm
memory density1048576 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size1,2,1,1
Number of terminals44
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX16
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP44,.63
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height3 mm
Department size16K,8K,32K,64K
Maximum standby current0.000005 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width12.6 mm
MX29F100T/B
1M-BIT [128Kx8/64Kx16] CMOS FLASH MEMORY
FEATURES
5V±10% for read, erase and write operation
131072x8/ 65536x16 switchable
Fast access time:90/120ns
Low power consumption
- 40mA maximum active current(5MHz)
- 1
uA
typical standby current
Command register architecture
- Byte/ Word Programming (7us/ 12us typical)
- Erase (16K-Bytex1, 8K-Bytex2, 32K-Bytex1, and
64K-Byte x1)
Auto Erase (chip) and Auto Program
- Automatically erase any combination of sectors or
with Erase Suspend capability.
- Automatically program and verify data at specified
address
Status Reply
- Data polling & Toggle bit for detection of program
and erase cycle completion.
Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
- Superior inadvertent write protection
Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
- Sector protect/unprotect for 5V only system or 5V/
12V system
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1 to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 44-pin SOP
- 48-pin TSOP
Ready/Busy pin(RY/BY)
- Provides a hardware method or detecting program
or erase cycle completion
Erase suspend/ Erase Resume
- Suspend an erase operation to read data from, or
program data to a sector that is not being erased,
then resume the erase operation.
Hardware RESET pin
- Hardware method of resetting the device to reading
the device to reading array data.
20 years data retention
GENERAL DESCRIPTION
The MX29F100T/B is a 1-mega bit Flash memory
organized as 131,072 bytes or 65,536 words.
MXIC's Flash memories offer the most cost-effective
and reliable read/write non-volatile random access
memory. The MX29F100T/B is packaged in 44-pin
SOP and 48-pin TSOP. It is designed to be repro-
grammed and erased in-system or in-standard
EPROM programmers.
The standard MX29F100T/B offers access time 90ns.
To eliminate bus contention, the MX29F100T/B has
separate chip enable (CE) and output enable (OE)
controls.
MXIC's Flash memories augment EPROM function-
ality with in-circuit electrical erasure and
programming. The MX29F100T/B uses a command
register to manage this functionality. The command
register allows for 100% TTL level control inputs and
fixed power supply levels during erase and
P/N:PM0548
programming, while maintaining maximum EPROM
compatibility.
MXIC Flash technology reliably stores memory con-
tents even after 100,000 erase and program cycles.
The MXIC cell is designed to optimize the erase and
programming mechanisms. In addition, the combi-
nation of advanced tunnel oxide processing and low
internal electric fields for erase and programming
operations produces reliable cycling. The
MX29F100T/B uses a 5.0V±10% VCC supply to
perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100
milliamps on address and data pin from -1V to VCC
+ 1V.
REV. 1.4, DEC. 29, 2003
1

MX29F100BMC-12 Related Products

MX29F100BMC-12 MX29F100BTC-90 MX29F100BMC-90 MX29F100BTC-12 MX29F100BTA-90 MX29F100BTA-12
Description Flash, 64KX16, 120ns, PDSO44, 0.500 INCH, PLASTIC, MO-175, SOP-44 Flash, 64KX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, MO-142, TSOP1-48 Flash, 64KX16, 90ns, PDSO44, 0.500 INCH, PLASTIC, MO-175, SOP-44 Flash, 64KX16, 120ns, PDSO48, 12 X 20 MM, PLASTIC, MO-142, TSOP1-48 Flash, 64KX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, MO-142, TSOP1-48 Flash, 64KX16, 120ns, PDSO48, 12 X 20 MM, PLASTIC, MO-142, TSOP1-48
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC TSOP1 SOIC TSOP1 TSOP1 TSOP1
package instruction SOP, SOP44,.63 12 X 20 MM, PLASTIC, MO-142, TSOP1-48 0.500 INCH, PLASTIC, MO-175, SOP-44 TSOP1, TSSOP48,.8,20 TSOP1, TSSOP48,.8,20 TSOP1, TSSOP48,.8,20
Contacts 44 48 44 48 48 48
Reach Compliance Code unknow unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 90 ns 90 ns 120 ns 90 ns 120 ns
Spare memory width 8 8 8 8 8 8
startup block BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
command user interface YES YES YES YES YES YES
Data polling YES YES YES YES YES YES
JESD-30 code R-PDSO-G44 R-PDSO-G48 R-PDSO-G44 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
JESD-609 code e0 e0 e0 e0 e0 e0
length 28.5 mm 18.4 mm 28.5 mm 18.4 mm 18.4 mm 18.4 mm
memory density 1048576 bi 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1
Number of departments/size 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1 1,2,1,1
Number of terminals 44 48 44 48 48 48
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 125 °C 125 °C
organize 64KX16 64KX16 64KX16 64KX16 64KX16 64KX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP TSOP1 SOP TSOP1 TSOP1 TSOP1
Encapsulate equivalent code SOP44,.63 TSSOP48,.8,20 SOP44,.63 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES YES
Maximum seat height 3 mm 1.2 mm 3 mm 1.2 mm 1.2 mm 1.2 mm
Department size 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K
Maximum standby current 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.00002 A 0.00002 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 0.5 mm 1.27 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 12.6 mm 12 mm 12.6 mm 12 mm 12 mm 12 mm
Maker Macronix - - Macronix Macronix Macronix
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