DOCUMENT
REVISION
: SRL40000NH
: A0
: 1 OF 7
SPECIFICATION FOR APPROVAL
1. Scope
PAGE
1/2W, 0805 Low Resistance Chip Resistor (Lead / Halogen free)
This specification applies to 1.2mm x 2.0mm size 1/2W, fixed metal film chip resistors rectangular type
for use in electronic equipment.
2. Type Designation
RLW2012 — 4 —
□□□□
(1)
(2)
(3)
Where
(1) Series No.
(2) Power rating
4 = 1/2W
(3) Resistance value:
For example—
R005 = 0.005
Ω
(4) Resistance tolerance:
F=
±
1%
G=
±
2%
J=
±
5%
□
(4)
3. Construction and Physical Dimensions
Code Letter
L
W
t
a
Dimensions (mm)
1.3
±
0.20
2.0
±
0.20
0.50
±
0.20
0.35
±
0.15
b
0.35
±
0.15
NOTE:
①
Resistive element
( under protection film )
②
Electrode
③
Protection film
④
Substrate
Figure 1.
Structure (No mark)
DOCUMENT
REVISION
: SRL40000NH
: A0
: 2 OF 7
SPECIFICATION FOR APPROVAL
4. Ratings
4-1 Specification
Power Rating*
Resistance Range
Resistance Tolerance
Temperature Coefficient of Resistance
1/2 W
PAGE
0.005Ω~0.030Ω
±1%
,
±2%
,
±5%
0~200ppm/℃
Note*:
Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be
derated in accordance with the following curve.
%
100
Percentage of the
rated dissipation
50
0
-55
70
Ambient temperature
Figure 2
Derating Curve
125
℃
4-2 Rated Voltage
The rated voltage shall be determined by the following expression.
V
=
P
×
R
Where V：Rated voltage (V)
R：Nominal resistance value (Ω)
P：Rated dissipation (W)
4-3 Operating and Storage Temperature Range
-55 to +125℃
DOCUMENT
REVISION
: SRL40000NH
: A0
: 3 OF 7
SPECIFICATION FOR APPROVAL
5. Characteristics
Test Item
Short Time Overload
Condition of Test
5 * Rated power for 5 seconds
Refer to JIS C 5201-1 4.13
PAGE
Requirements
∆R
:
±
(0.5%+0.0005
Ω
)
Without significant damage by
flashover ( spark, arching ), burning
or breakdown etc.
Between Electrode and Protection
Film 100MΩ or over
Between Electrode and Substrate
1,000MΩ or over
Insulation Resistance
The resistor shall be cramped in the
metal block and tested , as shown below.
Test voltage : 100
±
15V
DC
for 1 minute
Refer to JIS C 5201-1 4.6 Mounting
condition G.
Voltage Proof
The voltage : 100V
AC
(rms.) for 1 minute
∆R
:
±
(1.0%+0.0005
Ω
)
Refer to JIS C 5201-1 4.7
Without damage by flashover, fire
or breakdown, as shown below.
-55 ~125℃ 5 cycles, 15 min at each
extreme condition
Refer to JIS C 5201-1 4.19
Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4
∆R
:
±
(1.0%+0.0005
Ω
)
Without distinct damage in
appearance
∆R
:
±
(1.0%+0.0005
Ω
)
Without distinct damage in
appearance
∆R
:
±
(1.0%+0.0005
Ω
)
Without distinct damage in
appearance
Uniform coating of solder cover
minimum of 95% surface being
immersed
∆R
:
±
(0.5%+0.0005
Ω
)
Without distinct deformation in
appearance
Thermal Shock
Low Temperature Storage
High Temperature Exposure
Kept at 125℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2
Temperature of Solder : 245
±
5℃
Immersion Duration : 2
±
0.5 second
Refer to JIS C 5201-1 4.17
Dipped into solder at 270
±
5℃
for 10
±
1 seconds
Refer to JIS C 5201-1 4.18
Solderability
Resistance to Soldering Heat
DOCUMENT
REVISION
: SRL40000NH
: A0
: 4 OF 7
SPECIFICATION FOR APPROVAL
PAGE
Test Item
Load Life
Condition of Test
Rated voltage for 1.5 hours followed by a
pause 0.5 hour at 70
±
2℃.
Cycle repeated 1000 hours
Refer to JIS C 5201-1 4.25
40
±
2℃ with relative humidity 90% to
95%. D.C. rated voltage for 1.5 hours
ON and 30 minutes OFF. Cycle
repeated 1,000 hours
Refer to JIS C 5201-1 4.24
100 G’s for 6milliseconds. 5 pulses
Refer to JIS C 5201-1 4.21
Requirements
∆R
:
±
(1.0%+0.0005
Ω
)
Without distinct damage in
appearance
∆R
:
±
(1.0%+0.0005
Ω
)
Without distinct damage in
appearance
Damp Heat with Load
Mechanical Shock
∆R
:
±
(0.5%+0.0005
Ω
)
Without mechanical damage such
as break
∆R
:
±(1.0%+0.0005
Ω
)
Without mechanical damage such
as break
Bending Test
Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33
DOCUMENT
REVISION
: SRL40000NH
: A0
: 5 OF 7
SPECIFICATION FOR APPROVAL
6. Recommended Solder Pad Dimensions
PAGE
Note :
We recommend there is no circuit design between pads to avoid circuit short
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