SN74LVC1G32YZAR datasheet, PDF

SN74LVC1G32YZAR: DescriptionLogic Gates Single 2-Input Pos; Categorylogic logic; File Size3MB，49 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Logic Gates Single 2-Input Pos

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	DSBGA
package instruction	VFBGA, BGA5,2X3,20
Contacts	5
Reach Compliance Code	compli
Factory Lead Time	1 week
series	LVC/LCX/Z
JESD-30 code	R-XBGA-B5
length	1.4 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	OR GATE
MaximumI(ol)	0.024 A
Number of functions	1
Number of entries	2
Number of terminals	5
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA5,2X3,20
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Prop。Delay @ Nom-Su	4.5 ns
propagation delay (tpd)	8 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.9 mm

	SN74LVC1G32YZAR	SN74LVC1G32YEAR
Description	Logic Gates Single 2-Input Pos	Logic Gates Single 2-Input OR Gate
Is it Rohs certified?	conform to	incompatible
Parts packaging code	DSBGA	DSBGA
package instruction	VFBGA, BGA5,2X3,20	VFBGA, BGA5,2X3,20
Contacts	5	5
Reach Compliance Code	compli	_compli
series	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-XBGA-B5	R-XBGA-B5
length	1.4 mm	1.4 mm
Load capacitance (CL)	50 pF	50 pF
Logic integrated circuit type	OR GATE	OR GATE
MaximumI(ol)	0.024 A	0.024 A
Number of functions	1	1
Number of entries	2	2
Number of terminals	5	5
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	VFBGA	VFBGA
Encapsulate equivalent code	BGA5,2X3,20	BGA5,2X3,20
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V
Prop。Delay @ Nom-Su	4.5 ns	4.5 ns
propagation delay (tpd)	8 ns	8 ns
Certification status	Not Qualified	Not Qualified
Schmitt trigger	NO	NO
Maximum seat height	0.5 mm	0.5 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	0.9 mm	0.9 mm

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