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SN74LVC1G32YEAR

Description
Logic Gates Single 2-Input OR Gate
Categorylogic    logic   
File Size3MB,49 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SN74LVC1G32YEAR Overview

Logic Gates Single 2-Input OR Gate

SN74LVC1G32YEAR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDSBGA
package instructionVFBGA, BGA5,2X3,20
Contacts5
Reach Compliance Code_compli
seriesLVC/LCX/Z
JESD-30 codeR-XBGA-B5
length1.4 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeOR GATE
MaximumI(ol)0.024 A
Number of functions1
Number of entries2
Number of terminals5
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Encapsulate equivalent codeBGA5,2X3,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Prop。Delay @ Nom-Su4.5 ns
propagation delay (tpd)8 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width0.9 mm
Base Number Matches1

SN74LVC1G32YEAR Related Products

SN74LVC1G32YEAR SN74LVC1G32YZAR
Description Logic Gates Single 2-Input OR Gate Logic Gates Single 2-Input Pos
Is it Rohs certified? incompatible conform to
Parts packaging code DSBGA DSBGA
package instruction VFBGA, BGA5,2X3,20 VFBGA, BGA5,2X3,20
Contacts 5 5
Reach Compliance Code _compli compli
series LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-XBGA-B5 R-XBGA-B5
length 1.4 mm 1.4 mm
Load capacitance (CL) 50 pF 50 pF
Logic integrated circuit type OR GATE OR GATE
MaximumI(ol) 0.024 A 0.024 A
Number of functions 1 1
Number of entries 2 2
Number of terminals 5 5
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code VFBGA VFBGA
Encapsulate equivalent code BGA5,2X3,20 BGA5,2X3,20
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V
Prop。Delay @ Nom-Su 4.5 ns 4.5 ns
propagation delay (tpd) 8 ns 8 ns
Certification status Not Qualified Not Qualified
Schmitt trigger NO NO
Maximum seat height 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 0.9 mm 0.9 mm
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