BF130-37C-1-0400-0125-0250-N-E datasheet, PDF

Datasheet> All Categories > The connector> The connector> BF130-37C-1-0400-0125-0250-N-E

BF130-37C-1-0400-0125-0250-N-E: DescriptionBoard Connector, 37 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal, Black Insulator,; CategoryThe connector The connector; File Size193KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BF130-37C-1-0400-0125-0250-N-E Overview

Board Connector, 37 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal, Black Insulator,

BF130-37C-1-0400-0125-0250-N-E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Reach Compliance Code	compliant
ECCN code	EAR99
body width	0.079 inch
subject depth	0.098 inch
body length	2.913 inch
Connector type	BOARD CONNECTOR
Contact to complete cooperation	SN ON NI
Contact completed and terminated	Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	20 mΩ
Contact style	SQ PIN-SKT
Dielectric withstand voltage	500VAC V
Durability	100 Cycles
maximum insertion force	1.99882 N
Insulation resistance	1000000000 Ω
Insulator color	BLACK
insulator material	NYLON
JESD-609 code	e3
Manufacturer's serial number	BF130
Plug contact pitch	0.079 inch
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	1
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PCB contact pattern	STAGGERED
PCB contact row spacing	3.2258 mm
Rated current (signal)	2 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	3.9878 mm
Termination type	SURFACE MOUNT
Total number of contacts	37
Evacuation force-minimum value	.199882 N

Preview

Download Datasheet

View All

2.80

Dimensions

Contacts

Type B1

6.04

4.0

6.0

8.0

10.0

12.0

14.0

16.0

18.0

20.0

22.0

24.0

26.0

28.0

30.0

32.0

34.0

36.0

38.0

40.0

42.0

44.0

46.0

48.0

50.0

52.0

54.0

56.0

58.0

60.0

62.0

64.0

66.0

68.0

70.0

72.0

74.0

76.0

78.0

6.0

8.0

10.0

12.0

14.0

16.0

18.0

20.0

22.0

24.0

26.0

28.0

30.0

32.0

34.0

36.0

38.0

40.0

42.0

44.0

46.0

48.0

50.0

52.0

54.0

56.0

58.0

60.0

62.0

64.0

66.0

68.0

70.0

72.0

74.0

76.0

78.0

80.0

0.90

Pin 1

4.00

Pin 1

2.00

Pin 1

0.90

Pin 1

Type B1

6.04

Type B2

2.80

4.00

2.00

Recommended PCB Layout

Solder Area

2.00

2° Max. Sway

Either direction at the top

2° Max. Toe

Either direction at the top

0.50 sq Pin

2.00

1.50

Type B2

1.50

C ±0.2

E ±0.2

0.15

5.04

D ±0.2

A ±0.20

B ±0.35

Ordering Grid

BF130

Specifications

规格

XX X

XXXX

Request Samples

and Quotation

Current Rating

电流额定值

: 2.0 Amp

Contact Plating

Insulation Resistance

绝缘电阻值

: 1000 MΩ min.

A = Gold Flash All Over

(Standard)

Contact Resistance

接触电阻值

: 20 mΩ max.

B = Selective Gold Flash Contact Area/

Dielectric Withstanding

耐电压

: 500V AC

Tin On Tail

Operating Temperature

工½温度

: -40°C to +105°C

C = Tin All Over

Contact Material

端子物料

: Copper Alloy

G = 10µ" Gold Contact Area/Tin On Tail

Insulator Material

绝缘½物料

I = 30µ" Gold Contact Area/Tin On Tail

Standard

标准物料

: Polyamide, Nylon 6T, UL 94V-0

Type

Options

可选物料

: Polyester, LCP, UL 94V-0

1 = Type B1

Soldering Process

可焊性

Dimension C

(1/100mm)

(Post Height)

2 = Type B2

Nylon 6T (Standard

标准物料

) -

0400 = 4.00mm

(Standard)

IR Reflow

回流焊

: 260°C for 10 sec.

Or specify Dimension C (eg 0250 = 2.50mm)

Wave

波峰焊

:230°C for 5-10 sec.

Manual Solder

人工焊接

: 350°C for 3-5 sec

LCP (Option

可选物料

) -

IR Reflow

回流焊

: 260°C for 10 sec.

Wave

波峰焊

: 250°C for 5-10 sec.

Manual Solder

人工焊接

: 350°C for 3-5 sec

Mates with

配套之母座

(Subject to pin length

在端子长度适合的条件下

BF070

BF085

BF086

BF090

BF091

No. of Contacts

03 to 40

Packing Options

B = Tape & Reel with Cap

(Standard)

D = Tube

(Standard where total height

≥25mm)

E = Tube with Cap

Insulator Material

N = Nylon 6T

(Standard)

L = LCP

Dimension E

(1/100mm)

(Stack Height)

0750 = 7.50mm

(Standard)

Or specify Dimension E (eg 0250 = 2.50mm)

Dimension D

(1/100mm)

(PCB to Insulator)

0125 = 1.25mm

(Standard)

Or specify Dimension D (eg 0250 = 2.50mm)

Part Number

Product Description

BF130

Drawing Date

31st October 2007

Detail

Revision

Date

01/12/14

AJO

Length

2.00mm Pitch Elevated Pin Header

Single Row, Surface Mount

Tolerances

(Except as Noted)

Angle

X.° ± 5°

X. ± 0.30

X.X° ± 2°

X.X ± 0.20

X.XX ± 0.15

X.XX° ± 1°

X.XXX ± 0.10 X.XXX° ± 0.5°

Units:

Metric (mm)

3rd Angle Projection

This drawing is confidential and

Technology, Ltd (GCT).

This drawing must not be copied

or disclosed without written

consent. E & OE

Global Connector Technology

Drawn By

LYH

www.gct.co

Not to

Scale

Sheet No.

1/1

Recommended Resources

Special voltage doubler rectifier electronic ballast circuit diagram

Touch type fade-out delay light circuit

LG Electronics MC-5586DTW computerized grill type microwave oven circuit diagram

-9～-l4.5v collector output regulated power supply circuit

Four-phase clock source

Manual contactor Y-△ step-down starting circuit

ARM experts please come in (recommend ARM9 development board): I want to port LINUX2.6 to ARM9, and learn driver programming and system porting through this. Now I have the basics: I can understand the driver and the system. I also hope that those who pass by can...; ganggl ARM Technology

ADI laboratory circuit DIY---------Low power consumption and long distance ISM wireless measurement node: This solution uses ADUC7060 with ARM7 core and 24-bit ADC, and ADF7020 to realize wireless data transmission. For details, please refer to ADI's article: CN-0164. I looked for its information yesterda...; dontium ADI Reference Circuit

Regarding the problem that non-clock pins always appear in the pin planner: Phenomenon: The counting and frequency division method generates a clock ld1_clk, and then clock constraints are applied to the original clock clk_24 and the frequency division clock ld1_clk, but ld1_...; eeleader FPGA/CPLD

USB Driver Issues: I want to make something whose main function is to communicate between a PC application and a USB device. The CPU of the USB device has its own USB interface. Do I need to write a driver for communica...; naebemn Embedded System

[Processing Method] Discussion on DIY processing methods of non-metallic materials—everything starts with design: [align=left][color=#000000][size=3] [Original content, please indicate [/size][url=https://bbs.eeworld.com.cn/][size=3][color=#006699]https://bbs.eeworld.com.cn[/color][/size][/url][size=3]】 [/size][s...; @ZiShi Robotics Development

What to do if the microwave membrane switch fails: I have used the microwave oven for two years, and the membrane switch always has problems. Sometimes the switch does not work, and the machine does not work no matter what I do. I thought it was a pro...; xiaowai90 Integrated technical exchanges

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components