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53RA1683J883B

Description
OTP ROM, 2KX8, TTL, CDIP24,
Categorystorage    storage   
File Size279KB,5 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

53RA1683J883B Overview

OTP ROM, 2KX8, TTL, CDIP24,

53RA1683J883B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP24,.3
Reach Compliance Codeunknown
ECCN codeEAR99
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density16384 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count2048 words
character code2000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

53RA1683J883B Related Products

53RA1683J883B 53RA1683JB 63RA1683J 53RA1683J883C 53RA1683J 53RA1683JC 63RA1683N
Description OTP ROM, 2KX8, TTL, CDIP24, OTP ROM, 2KX8, TTL, CDIP24, OTP ROM, 2KX8, TTL, CDIP24, OTP ROM, 2KX8, TTL, CDIP24, OTP ROM, 2KX8, TTL, CDIP24, OTP ROM, 2KX8, TTL, CDIP24, OTP ROM, 2KX8, TTL, PDIP24,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 code R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-XDIP-T24 R-PDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0 e0
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8
Number of terminals 24 24 24 24 24 24 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000
Maximum operating temperature 125 °C 125 °C 70 °C 125 °C 125 °C 125 °C 70 °C
Minimum operating temperature -55 °C -55 °C - -55 °C -55 °C -55 °C -
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO NO NO NO
technology TTL TTL TTL TTL TTL TTL TTL
Temperature level MILITARY MILITARY COMMERCIAL MILITARY MILITARY MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Filter level 38535Q/M;38534H;883B MIL-STD-883 Class B (Modified) - MIL-STD-883 Class C - MIL-STD-883 Class C -
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