53RA1683J datasheet, PDF - EEWORLD Datasheet

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53RA1683J: DescriptionOTP ROM, 2KX8, TTL, CDIP24,; Categorystorage storage; File Size279KB，5 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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53RA1683J Overview

OTP ROM, 2KX8, TTL, CDIP24,

53RA1683J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	2048 words
character code	2000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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53RA1683J Related Products

	53RA1683J	53RA1683J883B	53RA1683JB	63RA1683J	53RA1683J883C	53RA1683JC	63RA1683N
Description	OTP ROM, 2KX8, TTL, CDIP24,	OTP ROM, 2KX8, TTL, CDIP24,	OTP ROM, 2KX8, TTL, CDIP24,	OTP ROM, 2KX8, TTL, CDIP24,	OTP ROM, 2KX8, TTL, CDIP24,	OTP ROM, 2KX8, TTL, CDIP24,	OTP ROM, 2KX8, TTL, PDIP24,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8
Number of terminals	24	24	24	24	24	24	24
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000
Maximum operating temperature	125 °C	125 °C	125 °C	70 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-	-55 °C	-55 °C	-
organize	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Filter level	-	38535Q/M;38534H;883B	MIL-STD-883 Class B (Modified)	-	MIL-STD-883 Class C	MIL-STD-883 Class C	-

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