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SC2200UCL-300

Description
Thin Client On a Chip
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB,433 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

SC2200UCL-300 Overview

Thin Client On a Chip

SC2200UCL-300 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Reach Compliance Code_compli
Is SamacsysN
JESD-30 codeS-PBGA-B432
JESD-609 codee0
Humidity sensitivity level3
Number of terminals432
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA432,31X31,50
Package shapeSQUARE
Package formGRID ARRAY
power supply1.8,3.3 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Base Number Matches1

SC2200UCL-300 Related Products

SC2200UCL-300 SC2200 SC2200UCL-266 SC2200UFH-233 SC2200UFH-266
Description Thin Client On a Chip Thin Client On a Chip Thin Client On a Chip Thin Client On a Chip Thin Client On a Chip
Is it Rohs certified? incompatible - incompatible incompatible incompatible
Maker National Semiconductor(TI ) - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
Reach Compliance Code _compli - _compli _compli _compli
JESD-30 code S-PBGA-B432 - S-PBGA-B432 S-PBGA-B481 S-PBGA-B481
JESD-609 code e0 - e0 e0 e0
Humidity sensitivity level 3 - 3 3 3
Number of terminals 432 - 432 481 481
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA - BGA BGA BGA
Encapsulate equivalent code BGA432,31X31,50 - BGA432,31X31,50 BGA481,31X31,50 BGA481,31X31,50
Package shape SQUARE - SQUARE SQUARE SQUARE
Package form GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1.8,3.3 V - 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
surface mount YES - YES YES YES
technology CMOS - CMOS CMOS CMOS
Terminal surface Tin/Lead (Sn63Pb37) - Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL - BALL BALL BALL
Terminal pitch 1.27 mm - 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM - BOTTOM BOTTOM BOTTOM
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