SC2200UFH-233 datasheet, PDF - EEWORLD Datasheet

SC2200UFH-233: DescriptionThin Client On a Chip; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，433 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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SC2200UFH-233 Overview

Thin Client On a Chip

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
Reach Compliance Code	_compli
JESD-30 code	S-PBGA-B481
JESD-609 code	e0
Humidity sensitivity level	3
Number of terminals	481
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA481,31X31,50
Package shape	SQUARE
Package form	GRID ARRAY
power supply	1.8,3.3 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM

	SC2200UFH-233	SC2200	SC2200UCL-266	SC2200UCL-300	SC2200UFH-266
Description	Thin Client On a Chip	Thin Client On a Chip	Thin Client On a Chip	Thin Client On a Chip	Thin Client On a Chip
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Reach Compliance Code	_compli	-	_compli	_compli	_compli
JESD-30 code	S-PBGA-B481	-	S-PBGA-B432	S-PBGA-B432	S-PBGA-B481
JESD-609 code	e0	-	e0	e0	e0
Humidity sensitivity level	3	-	3	3	3
Number of terminals	481	-	432	432	481
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	-	BGA	BGA	BGA
Encapsulate equivalent code	BGA481,31X31,50	-	BGA432,31X31,50	BGA432,31X31,50	BGA481,31X31,50
Package shape	SQUARE	-	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY
power supply	1.8,3.3 V	-	1.8,3.3 V	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	-	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS
Terminal surface	Tin/Lead (Sn63Pb37)	-	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal form	BALL	-	BALL	BALL	BALL
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM

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