03028BX562XJUL7189 datasheet, PDF

Datasheet> All Categories > Passive components> capacitor> 03028BX562XJUL7189

03028BX562XJUL7189: DescriptionCeramic Capacitor, Multilayer, Ceramic, 10V, 5% +Tol, 5% -Tol, BX, 15% TC, 0.0056uF, Surface Mount, 0603, CHIP; CategoryPassive components capacitor; File Size560KB，4 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

03028BX562XJUL7189 Overview

Ceramic Capacitor, Multilayer, Ceramic, 10V, 5% +Tol, 5% -Tol, BX, 15% TC, 0.0056uF, Surface Mount, 0603, CHIP

03028BX562XJUL7189 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
package instruction	, 0603
Reach Compliance Code	not_compliant
ECCN code	EAR99
Other features	STANDARD: MIL-PRF-55681
capacitance	0.0056 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.91 mm
JESD-609 code	e0
length	1.6 mm
Manufacturer's serial number	03028
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, PAPER, 7 INCH
positive tolerance	5%
Rated (DC) voltage (URdc)	10 V
Guideline	MIL-PRF-55681
series	03028
size code	0603
surface mount	YES
Temperature characteristic code	BX
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	0.81 mm

Preview

Download Datasheet

View All

Surface Mount Multilayer Ceramic Chip Capacitors

DSCC Approved 03028 (BR/BX Dielectrics)

Overview

KEMET is approved to DSCC (Defense Supply Center, Columbus)

drawing no. 03028 for surface mount EIA 0603 case size multi-

layer ceramic capacitors (MLCCs) in BR and BX dielectrics.

DSCC MLCC control drawings are managed by the Defense

Logistics Agency (DLA) and represent devices with case

sizes, voltage ratings, and capacitance offerings not currently

referenced in a valid military speciﬁcation. Approved devices

must meet the stringent requirements, speciﬁcations and

standards outlined by DSCC.

DSCC drawing no. 03028 was developed in response to the

growing need and demand within the defense and aerospace

industries for EIA 0603 case size MLCCs not currently offered

in MIL-PRF-55681. KEMET’s DSCC approved capacitors

meet the requirements, speciﬁcations and standards outlined

in drawing no. 03028 as well as all referenced provisions per

MIL-PRF-55681.

Beneﬁts

Applications

• EIA 0603 case size

• Defense Supply Center, Columbus approved

• Federal Stock Control Number, Cage Code 31433

• Meets US Department of Defense (USDoD) speciﬁcations

per MIL-PRF-55681

• Meets USDoD standards per MIL-STD-202 & MIL-STD-1285

• High reliability

• Surface mount device

• Non-polar

Typical applications include decoupling, bypass,

ﬁ

ltering, blocking

and energy storage for use in military and aerospace applications.

Outline Drawing

70Sn/30Pb

Nickel Plate

Conductive Metallization

Electrodes

Dimensions - Millimeters (Inches)

EIA SIZE

CODE

0603

METRIC

SIZE CODE

1608

LENGTH^

WIDTH^

BANDWIDTH

THICKNESS

Maximum

0.91 (.036)

1.60 (.063) ± 0.15 (.006) 0.81 (.032) ± 0.15 (.006) 0.36 (.014) ± 0.15 (.006)

^For symbol “U” termination add .20 inches (0.51mm) to the positive length tolerance and .015 inches (0.38mm) to the positive width and thickness tolerances.

Ordering Information

03028

DSCC Drawing

Number

03028 (0603 case size)

Dielectric

104

Capacitance

Code (pF)

2 Sig. Digits +

Number of

Zeros

Voltage

W = 6.3V

X = 10V

Y = 16V

Z = 25V

A = 50V

B = 100V

C = 200V

Capacitance

Tolerance

J = ±5%

K = ±10%

M = ±20%

End

Metallization^

U = SnPb (4% min)

Z = SnPb (4% min)

Group C

Testing Option

Blank = No group C testing

C = Full group C

L = 2,000 hour life test only

M = 1,000 hour life test only

H = Low voltage humidity only

7189

Packaging/Grade

(C-Spec)*

Blank = Wafﬂe Pack

7189 = 7” Reel

^ “U” = Base metallization-barrier metal-solder coated (tin/lead alloy, with a min of 4% lead). Melting point is +200ºC or less. Metallization thickness is

≥

60μ-inches.

^ “Z” = Base metallization-barrier metal-tinned (tin/lead alloy, with a min of 4% lead).

* Additional reeling or packaging options may be available. Contact KEMET for details.

Additional termination options may be available. Contact KEMET for details.

F4004 06/10

Recommended Resources

Basic principles of thermal design in PCB layout

LA4185 power amplifier circuit diagram

500Hz unity gain low pass filter circuit

Color signal amplification circuit diagram

Switched harmonic crystal oscillator

Long period pulse oscillation circuit composed of time base 555

Unboxing - ESP32-S2 and ESP32-S3 Development Boards + Modules: [i=s]This post was last edited by mars4zhu on 2022-7-16 18:50[/i]Dear friends who participated in the event, have you considered the risk of the new coronavirus when you received packages from DigiKey...; mars4zhu DigiKey Technology Zone

LM3S818 interrupt trigger setting: The interrupt has a trigger depth setting, which is very efficient when transmitting large amounts of data. In use, it is found that its depth detection mechanism is similar to the low-level detection...; 淮海的大学 Microcontroller MCU

Principle of Magnetic Latching Relay: [font=仿宋_GB2312][size=4]The magnetic latching relay is attracted after the excitation coil is energized (DC). After the excitation coil is de-energized, it remains attracted due to the residual magnet...; lzcqust Power technology

Is children's programming a waste of money?: In shopping malls, you can often see people promoting children's programming. These salespeople will imply that children's programming is a skill that every child must master nowadays, making parents ...; eric_wang Robotics Development

Questions about VxWorks virtual network card: I wrote a virtual network card, and used FPGA to allocate memory pool. I can view the virtual network card device through ifShow() and muxShow(). In addition, there is a real network card device. Howe...; pengdingbo Real-time operating system RTOS

Robotics: In the 1950s, industrial robots came into being to replace manual labor in monotonous, repetitive physical labor or dangerous work and improve product quality. Since then, robots, as a typical represe...; songrisi Robotics Development

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components