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SN74AUC16245GQLR

Description
Bus Transceivers 16B Bus Trans
Categorylogic    logic   
File Size836KB,15 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SN74AUC16245GQLR Overview

Bus Transceivers 16B Bus Trans

SN74AUC16245GQLR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTexas Instruments
Parts packaging codeBGA
package instructionVFBGA-56
Contacts56
Reach Compliance Code_compli
Factory Lead Time1 week
Control typeCOMMON CONTROL
Counting directionBIDIRECTIONAL
seriesAUC
JESD-30 codeR-PBGA-B56
JESD-609 codee0
length7 mm
Logic integrated circuit typeBUS TRANSCEIVER
MaximumI(ol)0.005 A
Humidity sensitivity level1
Number of digits8
Number of functions2
Number of ports2
Number of terminals56
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA56,6X10,25
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)240
power supply1.2/2.5 V
propagation delay (tpd)3.1 ns
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
translateN/A
width4.5 mm

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Description Bus Transceivers 16B Bus Trans 16-Bit Bus Transceiver with 3-State Outputs 48-TVSOP -40 to 85 16-Bit Bus Transceiver with 3-State Outputs 48-TSSOP -40 to 85 16-Bit Bus Transceiver with 3-State Outputs 56-BGA MICROSTAR JUNIOR -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Contains lead Lead free Lead free Lead free
Is it Rohs certified? incompatible conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA SOIC TSSOP BGA
package instruction VFBGA-56 TSSOP, TSSOP48,.25,16 TSSOP, TSSOP48,.3,20 VFBGA, BGA56,6X10,25
Contacts 56 48 48 56
Reach Compliance Code _compli compli compli compli
Factory Lead Time 1 week 1 week 1 week 1 week
Control type COMMON CONTROL COMMON CONTROL COMMON CONTROL COMMON CONTROL
Counting direction BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
series AUC AUC AUC AUC
JESD-30 code R-PBGA-B56 R-PDSO-G48 R-PDSO-G48 R-PBGA-B56
JESD-609 code e0 e4 e4 e1
length 7 mm 9.7 mm 12.5 mm 7 mm
Logic integrated circuit type BUS TRANSCEIVER BUS TRANSCEIVER BUS TRANSCEIVER BUS TRANSCEIVER
MaximumI(ol) 0.005 A 0.009 A 0.009 A 0.009 A
Humidity sensitivity level 1 1 1 1
Number of digits 8 8 8 8
Number of functions 2 2 2 2
Number of ports 2 2 2 2
Number of terminals 56 48 48 56
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA TSSOP TSSOP VFBGA
Encapsulate equivalent code BGA56,6X10,25 TSSOP48,.25,16 TSSOP48,.3,20 BGA56,6X10,25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TAPE AND REEL TR TR TR
Peak Reflow Temperature (Celsius) 240 260 260 260
power supply 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V 1.2/2.5 V
propagation delay (tpd) 3.1 ns 3.1 ns 3.1 ns 3.1 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1 mm 1.2 mm 1.2 mm 1 mm
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL GULL WING GULL WING BALL
Terminal pitch 0.65 mm 0.4 mm 0.5 mm 0.65 mm
Terminal location BOTTOM DUAL DUAL BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
translate N/A N/A N/A N/A
width 4.5 mm 4.4 mm 6.1 mm 4.5 mm
ECCN code - EAR99 EAR99 EAR99
Maximum supply current (ICC) - 0.02 mA 0.02 mA 0.02 mA
Prop。Delay @ Nom-Su - 3.1 ns 3.1 ns 3.1 ns
Schmitt trigger - N N N
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