EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K09G133ET-TR

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 133000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP
CategoryPassive components    The resistor   
File Size97KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance  
Download Datasheet Parametric View All

M55342K09G133ET-TR Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 133000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP

M55342K09G133ET-TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
JESD-609 codee4
Manufacturer's serial numberM55342/09
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.71 mm
Package length6.35 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width3.02 mm
method of packingTR
Rated power dissipation(P)1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance133000 Ω
Resistor typeFIXED RESISTOR
seriesM55342/09-THICKFILM
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage200 V
State of the Art, Inc.
Thick Film Chip Resistor
M55342/09 RM2512
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
1000 mW
200 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 09 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /09 = RM2512
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.300
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.250 (.244 - .268)
.119 (.119 - .129)
.028 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.212 (.208 - .216)
.0513 grams
6.35
3.02
0.71
0.51
0.48
5.39
(6.20 - 6.81)
(3.02 - 3.28)
(0.38 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(5.28 - 5.49)
.125
.202
.049
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
Electronic Design Competition Information and Experience
I hope it can help those in need...
崔孝钿 Electronics Design Contest
A small question about structure definition
I have seen someone define a structure like this: typedef struct { int a; int b; }TestStruct, *TestStruct; Does the above structure definition *TestStruct mean TestStruct*? If we define a structure va...
ggch Embedded System
Looking for project cooperation or part-time job
I have been engaged in the electronics industry for more than 10 years. I have a certain foundation in electronics technology. I can skillfully use C language for single-chip microcomputer development...
damafeng Embedded System
Help: Difference between norflash and nand
ARM development boards seem to have both norflash and nandflash. I want to know what the difference is between the two. I searched on Baidu and found that it is about the difference in structure. I wa...
xiaominthere Embedded System
8.Net Workflow: Open Source Architecture E8.HelpDesk: Help Desk Management
E8.Net workflow development framework, rapid development and implementation of software projects: E8.Net workflow is a leading product in the field of domestic business process management (BPM) on the...
竹子 Embedded System
SCR Circuit
I saw a circuit recently and felt that it was not very reasonable. Could you please help me take a look at it?When the capacitor is discharged, will the high voltage generated by the inductor cause th...
netzhang Analog electronics

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 803  2772  1201  519  2561  17  56  25  11  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号