|
LMC6772AIMM |
LMC6772AIN |
LMC6772AIMM/NOPB |
| Description |
Dual MicroPower Rail-to-Rail Input CMOS Comparator with Open Drain Output 8-VSSOP -40 to 85 |
IC COMP DUAL MICRPWR CMOS 8-DIP |
Output type: Open-Drain Power consumption of each channel: 20uA Propagation delay: 10us Number of comparator groups: 2 Power supply voltage: 2.7V ~ 15V, ±1.35V ~ 7.5V |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| package instruction |
TSSOP, TSSOP8,.19 |
DIP, DIP8,.3 |
TSSOP, TSSOP8,.19 |
| Reach Compliance Code |
_compli |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
| Amplifier type |
COMPARATOR |
COMPARATOR |
COMPARATOR |
| Maximum input offset voltage |
5000 µV |
15000 µV |
5000 µV |
| JESD-30 code |
S-PDSO-G8 |
R-PDIP-T8 |
S-PDSO-G8 |
| JESD-609 code |
e0 |
e0 |
e3 |
| length |
3 mm |
9.817 mm |
3 mm |
| Humidity sensitivity level |
1 |
1 |
1 |
| Number of functions |
2 |
2 |
2 |
| Number of terminals |
8 |
8 |
8 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
| Output type |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSSOP |
DIP |
TSSOP |
| Encapsulate equivalent code |
TSSOP8,.19 |
DIP8,.3 |
TSSOP8,.19 |
| Package shape |
SQUARE |
RECTANGULAR |
SQUARE |
| Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
| power supply |
2.7/15 V |
2.7/15 V |
2.7/15 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Nominal response time |
4000 ns |
4000 ns |
4000 ns |
| Maximum seat height |
1.1 mm |
5.08 mm |
1.1 mm |
| Maximum slew rate |
0.01 mA |
0.025 mA |
0.01 mA |
| Supply voltage upper limit |
16 V |
16 V |
16 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
| surface mount |
YES |
NO |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
| Terminal form |
GULL WING |
THROUGH-HOLE |
GULL WING |
| Terminal pitch |
0.65 mm |
2.54 mm |
0.65 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
3 mm |
7.62 mm |
3 mm |
| Brand Name |
Texas Instruments |
- |
Texas Instruments |
| Parts packaging code |
MSOP |
- |
MSOP |
| Contacts |
8 |
- |
8 |
| Factory Lead Time |
1 week |
- |
1 week |
| Maximum average bias current (IIB) |
4e-7 µA |
- |
4e-7 µA |
| method of packing |
TR |
- |
TR |
| Is it Rohs certified? |
- |
incompatible |
conform to |