EEWORLDEEWORLDEEWORLD

Part Number

Search

LPC2364FET100

Description
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flashnull
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size446KB,69 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

LPC2364FET100 Overview

Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flashnull

LPC2364FET100 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeBGA
package instruction9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100
Contacts100
Manufacturer packaging codeSOT-926-1
Reach Compliance Codecompliant
Has ADCYES
Address bus width
bit size32
CPU seriesARM7
maximum clock frequency25 MHz
DAC channelYES
DMA channelYES
External data bus width16
JESD-30 codeS-PBGA-B100
JESD-609 codee1
length9 mm
Humidity sensitivity level3
Number of I/O lines70
Number of terminals100
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA100,10X10,32
Package shapeSQUARE
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Certification statusNot Qualified
RAM (bytes)34816
rom(word)131072
ROM programmabilityFLASH
Maximum seat height1.2 mm
speed72 MHz
Maximum slew rate100 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width9 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash
with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
Rev. 7.1 — 16 October 2013
Product data sheet
1. General description
The LPC2364/65/66/67/68 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S
CPU with real-time emulation that combines the microcontroller with up to 512 kB of
embedded high-speed flash memory. A 128-bit wide memory interface and a unique
accelerator architecture enable 32-bit code execution at the maximum clock rate. For
critical performance in interrupt service routines and DSP algorithms, this increases
performance up to 30 % over Thumb mode. For critical code size applications, the
alternative 16-bit Thumb mode reduces code by more than 30 % with minimal
performance penalty.
The LPC2364/65/66/67/68 are ideal for multi-purpose serial communication applications.
They incorporate a 10/100 Ethernet Media Access Controller (MAC), USB full speed
device with 4 kB of endpoint RAM (LPC2364/66/68 only), four UARTs, two CAN channels
(LPC2364/66/68 only), an SPI interface, two Synchronous Serial Ports (SSP), three
I
2
C-bus interfaces, and an I
2
S-bus interface. This blend of serial communications
interfaces combined with an on-chip 4 MHz internal oscillator, SRAM of up to 32 kB, 16 kB
SRAM for Ethernet, 8 kB SRAM for USB and general purpose use, together with 2 kB
battery powered SRAM make these devices very well suited for communication gateways
and protocol converters. Various 32-bit timers, an improved 10-bit ADC, 10-bit DAC, one
PWM unit, a CAN control unit (LPC2364/66/68 only), and up to 70 fast GPIO lines with up
to 12 edge or level sensitive external interrupt pins make these microcontrollers
particularly suitable for industrial control and medical systems.
2. Features and benefits
ARM7TDMI-S processor, running at up to 72 MHz
Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and
In-Application Programming (IAP) capabilities. Flash program memory is on the ARM
local bus for high performance CPU access.
8 kB/32 kB of SRAM on the ARM local bus for high performance CPU access.
16 kB SRAM for Ethernet interface. Can also be used as general purpose SRAM.
8 kB SRAM for general purpose DMA use also accessible by the USB.
Dual Advanced High-performance Bus (AHB) system that provides for simultaneous
Ethernet DMA, USB DMA, and program execution from on-chip flash with no
contention between those functions. A bus bridge allows the Ethernet DMA to access
the other AHB subsystem.
Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts.
General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP
serial interfaces, the I
2
S port, and the Secure Digital/MultiMediaCard (SD/MMC) card
port, as well as for memory-to-memory transfers.

LPC2364FET100 Related Products

LPC2364FET100 LPC2365FBD100 TFBGA100
Description Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flashnull Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC 32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals
Is it lead-free? Lead free Lead free -
Is it Rohs certified? conform to conform to -
Maker NXP NXP -
Parts packaging code BGA QFP -
package instruction 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 LFQFP, QFP100,.63SQ,20 -
Contacts 100 100 -
Reach Compliance Code compliant compliant -
Has ADC YES YES -
bit size 32 32 -
CPU series ARM7 ARM7 -
maximum clock frequency 25 MHz 25 MHz -
DAC channel YES YES -
DMA channel YES YES -
External data bus width 16 16 -
JESD-30 code S-PBGA-B100 S-PQFP-G100 -
JESD-609 code e1 e3 -
length 9 mm 14 mm -
Humidity sensitivity level 3 3 -
Number of I/O lines 70 70 -
Number of terminals 100 100 -
Maximum operating temperature 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -
PWM channel YES YES -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code TFBGA LFQFP -
Encapsulate equivalent code BGA100,10X10,32 QFP100,.63SQ,20 -
Package shape SQUARE SQUARE -
Package form GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH -
Peak Reflow Temperature (Celsius) 260 260 -
power supply 3.3 V 3.3 V -
Certification status Not Qualified Not Qualified -
RAM (bytes) 34816 59392 -
rom(word) 131072 262144 -
ROM programmability FLASH FLASH -
Maximum seat height 1.2 mm 1.6 mm -
speed 72 MHz 72 MHz -
Maximum slew rate 100 mA 100 mA -
Maximum supply voltage 3.6 V 3.6 V -
Minimum supply voltage 3 V 3 V -
Nominal supply voltage 3.3 V 3.3 V -
surface mount YES YES -
technology CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin (Sn) -
Terminal form BALL GULL WING -
Terminal pitch 0.8 mm 0.5 mm -
Terminal location BOTTOM QUAD -
Maximum time at peak reflow temperature 40 30 -
width 9 mm 14 mm -
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC -
When I program the STC89LE516AD microcontroller, I have to program it 20 times before I can get it in once or twice.
Every time I burn the program, I keep powering on and resetting the MCU, but it just won't enter. It only enters once or twice after 10 or 20 times. I don't know why. Logically, it can burn sometimes,...
wlj082582 Embedded System
Development of Ultrasonic Distance Meter for Parking
Abstract: This paper discusses the basic principle, measurement calculation method and implementation scheme of the ultrasonic rangefinder for parking developed by single-chip microcomputer technology...
canglanghuang Automotive Electronics
Task stack overflow detection mechanism in FreeRTOS
In FreeRTOS, each task has its own stack, the size of which is determined by the function parameters of the xTaskCreate function when the task is created.However, when the stack space used by a task e...
MamoYU Real-time operating system RTOS
Device opening error help
The USB to serial port driver made by someone else has no source code. There are six virtual COMs in total: COM4-COM9. COM5-COM9 can be opened without any problem. When COM4 is opened: unable to open ...
liuqinghua0412 Embedded System
5qzone_Learn avr and c language in 10 days
5qzone_Learn avr and c language in 10 days...
wu170777 Microchip MCU
2012 Interim Measures for the Procurement of Instruments and Equipment for Blood Testing Laboratories of the Municipal Blood Center (Sample)
Chapter I General Provisions Article 1 Blood testing instruments and equipment are an important part of the construction of a blood testing laboratory. The purchasing decision of instruments and equip...
xiaonn Medical Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2625  2384  1812  2115  1220  53  48  37  43  25 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号