Transient Voltage Suppressors - SMFJ Series
Features
1. For surface mounted applications
2. Low-profile package
3. Optimized for LAN protection applications
4. Ideal for ESD protection of data lines in accordance with IEC 1000-4-2
(IEC801-2)
5. Ideal for EFT protection of data lines in
6. accordance with IEC 1000-4-4 (IEC801-4)
7. Low incremental surge resistance
8. IEC 1000-4-2 (ESD) 15 kV (air) 8 kV (contact)
IEC 1000-4-4 (EFT) 40 A (tp = 5/ 50 ns)
IEC 1000-4-5 (Lightning) 24 A (tp = 8/ 20 μs
9. Low incremental surge resistance, excellent clamping capability
10. 200W peak pulse power capability with a 10/1000μ swaveform,repetition
rate (duty cycle): 0.01%•
11. Very fast response time
12. High temperature soldering guaranteed: 260°C/ 10 seconds at terminals
UNI
Cathode
BI
Anode
BI
UNI
Applications
TVS devices are ideal for the protection of I/O interfaces,VCC bus and other vulnerable circuits used in telecom, computer,
industrial and consumer electronic applications.
Mechanical Characteristics
Rating
Peak Pulse Power Dissipation at TA=25°C by 10x1000μs test
waveform (Fig.1)(Note 1),(Note 2)
Power Dissipation on inifinite heat sink at TA=50°C
Peak Forward Surge Current, 8.3ms Single Half Sine
Wave(Note 3)
Maximum Instantaneous Forward Voltage at 25A for
Unidirectional only (Note 4)
Operating junction and Storage Temperature Range.
Typical Thermal Resistance Junction to Lead
Typical Thermal Resistance Junction
to Ambient
Symbol
P
PPM
P
D
I
FSM
V
F
T
J
,
T
STG
R
uJL
R
uJA
Value
300
2
20
3.5/6.5
-55°C to 150°C
30
120
Units
Watts
Watts
Amps
V
°C
°C/W
°C/W
Notes:
1. Non-repetitive current pulse , per Fig. 3 and derated above TA = 25°C per Fig. 2.
2. Measured on 8.3ms single half sine wave or equivalent square wave, duty cycle=4 perminute maximum.
3. VF<3.5V for devices of VBR _< 200V and VF<5.0V for devices of VBR _> 201V.
Circuit Protection
System
Specifications are subject to change without notice.
Please refer to
http://www.ruilon.com
for current information.
Page:1
Transient Voltage Suppressors - SMFJ Series
Ratings and Characteristic Curves
Figure 1 - Peak Pulse Power Rating Curve
Figure 2 - Pulse Derating Curve
Figure 3 - Pulse Waveform
Figure 4 - Typical Junction Capacitance
Circuit Protection
System
Specifications are subject to change without notice.
Please refer to
http://www.ruilon.com
for current information.
Page:3
Transient Voltage Suppressors - SMFJ Series
Soldering Parameters
Feflow Condition
- Temperature Min (T s(min))
Pre Heat
- Temperature Max (T s(min))
- Time (min to max) (t s)
Average ramp up rate (Liquidus Temp (TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
Peak Temperature (T P)
Time within 5°C of actual peak Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
- Temperature (T L) (Liquidus)
- Time (min to max) (t s)
Lead-free assembly
150°C
200°C
60-180 secs
3°C/second max
3°C/second max
217°C
60-150 seconds
260+0/-5 °C
20-40 seconds
6°C/second max
8 minutes Max.
280°C
T
P
Ramp-up
t
p
one
Critical Z
P
T
L
to T
Physical Specifications
Weight
Case
Polarity
Termina
0.002 ounce,0.061 gram
JEDEC DO-214AC molded plastic body over
passivated junction.
Color band denotes the cathode except Bipolar.
Matte Tin axial leads, solderable per
JESD22-B102D.
t
L
T
L
Temperature (T)
T
s(max)
Ramp-down
T
s(min)
Preheat
t
s
Time (t)
Environmental Specifications
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
Thermal Shock
JESD22-A104
JESD 22-A102
JESD22-A103
JESD22-A108
JESD22-A106
Circuit Protection
System
Specifications are subject to change without notice.
Please refer to
http://www.ruilon.com
for current information.
Page:4
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