50 mA, 40 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-99
| Parameter Name | Attribute value |
| Number of terminals | 6 |
| Minimum breakdown voltage | 40 V |
| Processing package description | HERMETIC SEALED PACKAGE-6 |
| state | ACTIVE |
| packaging shape | round |
| Package Size | cylindrical |
| Terminal form | Wire |
| terminal coating | NOT SPECIFIED |
| Terminal location | BOTTOM |
| Packaging Materials | Metal |
| structure | COMMON source, 2 ELEMENTS |
| Number of components | 2 |
| transistor applications | amplifier |
| Transistor component materials | silicon |
| Maximum ambient power consumption | 0.5250 W |
| Channel type | P channel |
| field effect transistor technology | Metal-OXIDE SEMICONDUCTOR |
| operating mode | ENHANCEMENT |
| Transistor type | Universal small signal |
| Maximum leakage current | 0.0500 A |
| feedback capacitor | 0.7000 pF |
| Maximum drain on-resistance | 300 ohm |
| 3N165 | UC1764 | 3N173 | 3N172 | 3N166 | 3N164 | 3N163 | UC2766 | |
|---|---|---|---|---|---|---|---|---|
| Description | 50 mA, 40 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-99 | 50 mA, 40 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-99 | 50 mA, 40 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-99 | 50 mA, 40 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-99 | 50 mA, 40 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-99 | 50 mA, 40 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-99 | 40 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-72 | 50 mA, 40 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-99 |
| Number of terminals | 6 | 6 | 6 | 4 | 6 | 4 | 4 | 6 |
| Terminal form | Wire | Wire | Wire | WIRE | Wire | WIRE | WIRE | Wire |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Number of components | 2 | 2 | 2 | 1 | 2 | 1 | 1 | 2 |
| Transistor component materials | silicon | silicon | silicon | SILICON | silicon | SILICON | SILICON | silicon |
| Minimum breakdown voltage | 40 V | 40 V | 40 V | - | 40 V | - | - | 40 V |
| Processing package description | HERMETIC SEALED PACKAGE-6 | HERMETIC SEALED PACKAGE-6 | HERMETIC SEALED PACKAGE-6 | - | HERMETIC SEALED PACKAGE-6 | - | - | HERMETIC SEALED PACKAGE-6 |
| state | ACTIVE | ACTIVE | ACTIVE | - | ACTIVE | - | - | ACTIVE |
| packaging shape | round | round | round | - | round | - | - | round |
| Package Size | cylindrical | cylindrical | cylindrical | - | cylindrical | - | - | cylindrical |
| terminal coating | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED |
| Packaging Materials | Metal | Metal | Metal | - | Metal | - | - | Metal |
| structure | COMMON source, 2 ELEMENTS | COMMON source, 2 ELEMENTS | COMMON source, 2 ELEMENTS | - | COMMON source, 2 ELEMENTS | - | - | COMMON source, 2 ELEMENTS |
| transistor applications | amplifier | amplifier | amplifier | - | amplifier | - | - | amplifier |
| Maximum ambient power consumption | 0.5250 W | 0.5250 W | 0.5250 W | - | 0.5250 W | - | - | 0.5250 W |
| Channel type | P channel | P channel | P channel | - | P channel | - | - | P channel |
| field effect transistor technology | Metal-OXIDE SEMICONDUCTOR | Metal-OXIDE SEMICONDUCTOR | Metal-OXIDE SEMICONDUCTOR | - | Metal-OXIDE SEMICONDUCTOR | - | - | Metal-OXIDE SEMICONDUCTOR |
| operating mode | ENHANCEMENT | ENHANCEMENT | ENHANCEMENT | - | ENHANCEMENT | - | - | ENHANCEMENT |
| Transistor type | Universal small signal | Universal small signal | Universal small signal | - | Universal small signal | - | - | Universal small signal |
| Maximum leakage current | 0.0500 A | 0.0500 A | 0.0500 A | - | 0.0500 A | - | - | 0.0500 A |
| feedback capacitor | 0.7000 pF | 0.7000 pF | 0.7000 pF | - | 0.7000 pF | - | - | 0.7000 pF |
| Maximum drain on-resistance | 300 ohm | 300 ohm | 300 ohm | - | 300 ohm | - | - | 300 ohm |