74LVC07A datasheet, PDF - EEWORLD Datasheet

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74LVC07A: DescriptionHex buffer with open-drain outputs; File Size110KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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74LVC07A Overview

Hex buffer with open-drain outputs

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74LVC07A

Hex buffer with open-drain outputs

Rev. 5 — 27 October 2011

Product data sheet

1. General description

The 74LVC07A provides six non-inverting buffers. The outputs are open-drain and can be

connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH

wired-AND functions.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these

devices as translators in mixed 3.3 V and 5 V applications.

2. Features and benefits



5 V tolerant inputs and outputs (open-drain) for interfacing with 5 V logic

Wide supply voltage range from 1.2 V to 5.5 V

CMOS low power consumption

Direct interface with TTL levels

Inputs accept voltages up to 5 V

Complies with JEDEC standard:



JESD8-7A (1.65 V to 1.95 V)



JESD8-5A (2.3 V to 2.7 V)



JESD8-C/JESD36 (2.7 V to 3.6 V)



ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-B exceeds 200 V



CDM JESD22-C101E exceeds 1000 V



Specified from

40 C

to +85

C

and

40 C

to +125

C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range

74LVC07AD

74LVC07APW

74LVC07ABQ

40 C

to +125

C

40 C

to +125

C

40 C

to +125

C

Name

SO14

TSSOP14

Description

plastic small outline package; 14 leads;

body width 3.9 mm

plastic thin small outline package; 14 leads;

body width 4.4 mm

Version

SOT108-1

SOT402-1

SOT762-1

Type number

DHVQFN14 plastic dual in-line compatible thermal enhanced very

thin quad flat package; no leads; 14 terminals;

body 2.5



0.85 mm

74LVC07A Related Products

	74LVC07A	74LVC07AD,112	74LVC07AD,118	74LVC07ABQ	74LVC07APW-T
Description	Hex buffer with open-drain outputs	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14	Hex buffer with open-drain outputs	LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14
Is it Rohs certified?	-	conform to	conform to	conform to	conform to
Maker	-	NXP	NXP	NXP	NXP
Parts packaging code	-	SOIC	SOIC	QFN	TSSOP
package instruction	-	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14	HVQCCN, LCC14,.1X.12,20	TSSOP,
Contacts	-	14	14	14	14
Reach Compliance Code	-	compli	compli	compli	unknown
series	-	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	-	R-PDSO-G14	R-PDSO-G14	R-PQCC-N14	R-PDSO-G14
JESD-609 code	-	e4	e4	e4	e4
length	-	8.65 mm	8.65 mm	3 mm	5 mm
Load capacitance (CL)	-	50 pF	50 pF	50 pF	-
Logic integrated circuit type	-	BUFFER	BUFFER	BUFFER	BUFFER
MaximumI(ol)	-	0.024 A	0.024 A	0.024 A	-
Humidity sensitivity level	-	1	1	1	1
Number of functions	-	6	6	6	6
Number of entries	-	1	1	1	1
Number of terminals	-	14	14	14	14
Maximum operating temperature	-	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	-	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	SOP	SOP	HVQCCN	TSSOP
Encapsulate equivalent code	-	SOP14,.25	SOP14,.25	LCC14,.1X.12,20	-
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	-	TUBE	TAPE AND REEL	TAPE AND REEL	-
Peak Reflow Temperature (Celsius)	-	260	260	260	260
power supply	-	3.3 V	3.3 V	3.3 V	-
Prop。Delay @ Nom-Su	-	4.5 ns	4.5 ns	3.6 ns	-
propagation delay (tpd)	-	6.5 ns	4.5 ns	6.5 ns	6.5 ns
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	-	NO	NO	NO	-
Maximum seat height	-	1.75 mm	1.75 mm	1 mm	1.1 mm
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	-	3.3 V	1.8 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS
Temperature level	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	-	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	-	GULL WING	GULL WING	NO LEAD	GULL WING
Terminal pitch	-	1.27 mm	1.27 mm	0.5 mm	0.65 mm
Terminal location	-	DUAL	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	-	30	30	30	30
width	-	3.9 mm	3.9 mm	2.5 mm	4.4 mm
Base Number Matches	-	1	1	-	1

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