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74LVC07ABQ

Description
Hex buffer with open-drain outputs
Categorylogic    logic   
File Size110KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74LVC07ABQ Overview

Hex buffer with open-drain outputs

74LVC07ABQ Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFN
package instructionHVQCCN, LCC14,.1X.12,20
Contacts14
Reach Compliance Codecompli
ECCN codeEAR99
seriesLVC/LCX/Z
JESD-30 codeR-PQCC-N14
JESD-609 codee4
length3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions6
Number of entries1
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC14,.1X.12,20
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su3.6 ns
propagation delay (tpd)6.5 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width2.5 mm
74LVC07A
Hex buffer with open-drain outputs
Rev. 5 — 27 October 2011
Product data sheet
1. General description
The 74LVC07A provides six non-inverting buffers. The outputs are open-drain and can be
connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH
wired-AND functions.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in mixed 3.3 V and 5 V applications.
2. Features and benefits
5 V tolerant inputs and outputs (open-drain) for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 5.5 V
CMOS low power consumption
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-B exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74LVC07AD
74LVC07APW
74LVC07ABQ
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
Name
SO14
TSSOP14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic thin small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT402-1
SOT762-1
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm

74LVC07ABQ Related Products

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Description Hex buffer with open-drain outputs LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14 LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14 Hex buffer with open-drain outputs LVC/LCX/Z SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO14
Is it Rohs certified? conform to conform to conform to - conform to
Maker NXP NXP NXP - NXP
Parts packaging code QFN SOIC SOIC - TSSOP
package instruction HVQCCN, LCC14,.1X.12,20 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14 - TSSOP,
Contacts 14 14 14 - 14
Reach Compliance Code compli compli compli - unknown
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z - LVC/LCX/Z
JESD-30 code R-PQCC-N14 R-PDSO-G14 R-PDSO-G14 - R-PDSO-G14
JESD-609 code e4 e4 e4 - e4
length 3 mm 8.65 mm 8.65 mm - 5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF - -
Logic integrated circuit type BUFFER BUFFER BUFFER - BUFFER
MaximumI(ol) 0.024 A 0.024 A 0.024 A - -
Humidity sensitivity level 1 1 1 - 1
Number of functions 6 6 6 - 6
Number of entries 1 1 1 - 1
Number of terminals 14 14 14 - 14
Maximum operating temperature 125 °C 125 °C 125 °C - 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN - OPEN-DRAIN
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code HVQCCN SOP SOP - TSSOP
Encapsulate equivalent code LCC14,.1X.12,20 SOP14,.25 SOP14,.25 - -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TUBE TAPE AND REEL - -
Peak Reflow Temperature (Celsius) 260 260 260 - 260
power supply 3.3 V 3.3 V 3.3 V - -
Prop。Delay @ Nom-Su 3.6 ns 4.5 ns 4.5 ns - -
propagation delay (tpd) 6.5 ns 6.5 ns 4.5 ns - 6.5 ns
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified
Schmitt trigger NO NO NO - -
Maximum seat height 1 mm 1.75 mm 1.75 mm - 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V - 1.65 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 1.8 V - 3.3 V
surface mount YES YES YES - YES
technology CMOS CMOS CMOS - CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD
Terminal form NO LEAD GULL WING GULL WING - GULL WING
Terminal pitch 0.5 mm 1.27 mm 1.27 mm - 0.65 mm
Terminal location QUAD DUAL DUAL - DUAL
Maximum time at peak reflow temperature 30 30 30 - 30
width 2.5 mm 3.9 mm 3.9 mm - 4.4 mm
Base Number Matches - 1 1 - 1

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