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TMPN3120FE3M

Description
5 CHANNEL(S), 2.5M bps, LOCAL AREA NETWORK CONTROLLER, PDSO32
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size211KB,12 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TMPN3120FE3M Overview

5 CHANNEL(S), 2.5M bps, LOCAL AREA NETWORK CONTROLLER, PDSO32

TMPN3120FE3M Parametric

Parameter NameAttribute value
MakerToshiba Semiconductor
Parts packaging codeSOIC
package instructionSOP, SOP32,.56
Contacts32
Reach Compliance Codeunknow
Address bus width
boundary scanNO
maximum clock frequency20 MHz
Data encoding/decoding methodsNRZ
Maximum data transfer rate0.3125 MBps
External data bus width
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length20.6 mm
low power modeYES
Number of DMA channels
Number of I/O lines11
Number of serial I/Os5
Number of terminals32
On-chip data RAM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
power supply5 V
Certification statusNot Qualified
RAM (number of words)1024
Maximum seat height2.8 mm
Maximum slew rate55 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width10.7 mm
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, LAN
TMPN3120FE3M/U
TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TMPN3120FE3M,TMPN3120FE3U
Neuron
®
Chip
For Distributed Intelligent Control Networks (L
ON
W
ORKS
®
)
The Neuron Chip (TMPN3120FE3M and TMPN3120FE3U)
provides double the performance of previous Neuron Chips. It
supports a response time of 3 to 4 ms across a LONWORKs
Network and has double the input / output (I / O) performance of
the previous Neuron Chip in terms of both response time and
data transmission speed.
The Neuron Chip (TMPN3120FE3M and TMPN3120FE3U)
features an extra single-chip memory in the form of 2 Kbytes
EEPROM, 2 Kbytes SRAM and 16 Kbytes ROM. It is therefore
suitable for applications which require complex operations and
high speed communication control.
Neuron Chips have all the built-in communications and control
functions required to implement L
ON
W
ORKS
nodes. These nodes
may then be easily integrated into highly-reliable distributed
intelligent control networks.
The typical functions for this chip are explained below.
FEATURES
l
Main features of the 20 MHz Neuron Chip
( In comparison with the TMPN3120E1M and
TMPN3120FE3M / U )
·
Increased communication speed
The maximum transmission speed has been increased
two-fold.
1.25 Mbps
2.5 Mbps
Weight : 1.1g (Typ.)
Weight : 0.6g (Typ.)
·
Shortened response time
The amount of time required from I / O input to I / O output hasbeen greatly reduced.
Maximum speed 7 ms
3~4 ms
·
Increased IO object speed
The execution time for all objects has been halved.
Example ) Serial I / O 9600 bps
Parallel I / O 1.2 µs / byte
000707EBA1
·
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or
damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
·
The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document
shall be made at the customer’s own risk.
·
The products described in this document are subject to the foreign exchange and foreign trade laws.
·
The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or
others.
·
The information contained herein is subject to change without notice.
2001-02-21
1/12

TMPN3120FE3M Related Products

TMPN3120FE3M TMPN3120FE3U
Description 5 CHANNEL(S), 2.5M bps, LOCAL AREA NETWORK CONTROLLER, PDSO32 5 CHANNEL(S), 2.5M bps, LOCAL AREA NETWORK CONTROLLER, PDSO32
Parts packaging code SOIC QFP
package instruction SOP, SOP32,.56 LQFP, QFP44,.47SQ,32
Contacts 32 44
Reach Compliance Code unknow unknow
boundary scan NO NO
maximum clock frequency 20 MHz 20 MHz
Maximum data transfer rate 0.3125 MBps 0.3125 MBps
JESD-30 code R-PDSO-G32 S-PQFP-G44
JESD-609 code e0 e0
length 20.6 mm 10 mm
low power mode YES YES
Number of serial I/Os 5 5
Number of terminals 32 44
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP LQFP
Encapsulate equivalent code SOP32,.56 QFP44,.47SQ,32
Package shape RECTANGULAR SQUARE
Package form SMALL OUTLINE FLATPACK, LOW PROFILE
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum seat height 2.8 mm 1.6 mm
Maximum slew rate 55 mA 55 mA
Maximum supply voltage 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal pitch 1.27 mm 0.8 mm
Terminal location DUAL QUAD
width 10.7 mm 10 mm
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, LAN SERIAL IO/COMMUNICATION CONTROLLER, LAN

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