EEWORLDEEWORLDEEWORLD

Part Number

Search

BF060-68-G-A-0400-0250-0305-P-D

Description
Board Connector, 68 Contact(s), 2 Row(s), Male, Right Angle, 0.079 inch Pitch, Solder Terminal,
CategoryThe connector    The connector   
File Size141KB,1 Pages
ManufacturerGlobal Connector Technology
Environmental Compliance
Download Datasheet Parametric View All

BF060-68-G-A-0400-0250-0305-P-D Overview

Board Connector, 68 Contact(s), 2 Row(s), Male, Right Angle, 0.079 inch Pitch, Solder Terminal,

BF060-68-G-A-0400-0250-0305-P-D Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresTube
body width0.157 inch
subject depth0.199 inch
body length2.677 inch
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (10)
Contact completed and terminatedTin (Sn) - with Nickel (Ni) barrier
Contact point genderMALE
Contact materialCOPPER ALLOY
contact modeRECTANGULAR
Contact resistance20 mΩ
Contact styleSQ PIN-SKT
Dielectric withstand voltage500VAC V
Durability100 Cycles
maximum insertion force2.0016 N
Insulation resistance1000000000 Ω
insulator materialPOLYBUTYLENE TEREPHTHALATE
JESD-609 codee3
Manufacturer's serial numberBF060
Plug contact pitch0.079 inch
Match contact row spacing0.079 inch
Installation methodRIGHT ANGLE
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
PCB contact patternRECTANGULAR
PCB contact row spacing2.0066 mm
Plating thickness10u inch
Rated current (signal)2 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal length0.098 inch
Terminal pitch2.0066 mm
Termination typeSOLDER
Total number of contacts68
Evacuation force-minimum value.199882 N

BF060-68-G-A-0400-0250-0305-P-D Preview

3
1
2
4
Global Connector Technology Ltd. - BF060: 2.0mm Pitch Pin Header, Dual Row, Through Hole, Horizontal
A
B ±0.38
A ±0.25
PIN 0.50±0.02 SQ (Typ.)
5
6
7
8
Ø0.90
(Typ.)
CONTACTS
4
6
8
10
DIMENSIONS
A
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
32.0
34.0
36.0
38.0
40.0
42.0
44.0
46.0
48.0
50.0
52.0
54.0
56.0
58.0
60.0
62.0
64.0
66.0
68.0
70.0
72.0
74.0
76.0
78.0
B
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
32.0
34.0
36.0
38.0
40.0
42.0
44.0
46.0
48.0
50.0
52.0
54.0
56.0
58.0
60.0
62.0
64.0
66.0
68.0
70.0
72.0
74.0
76.0
78.0
80.0
A
2.00
2.00
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
B
Typ. (Non-Accum)
B
RECOMMENDED PCB LAYOUT
C
W
C±0.2
C
D
2.00 (Typ.)
FEATURES
特点
EASILY BREAKABLE NOTCHES
易折断驳口
CUSTOM PIN LENGTH, GOLD, SELECTIVE GOLD OR TIN PLATED.
STANDOFFS FACILITATE POST SOLDER CLEANING.
支脚设计易于清洁定½焊接点
4.00
2.00
D
2.00
E±0.2
E
D±0.2
Ordering Grid
E
F
G
SPECIFICATIONS
规格
CURRENT RATING
电流额定值:
2 Amp
No. of Contacts
INSULATOR RESISTANCE
绝缘电阻值:
1000 MΩ min.
04 to 80
CONTACT RESISTANCE
接触电阻值:
20 mΩ max.
Contact Plating
DIELECTRIC WITHSTANDING
耐电压:
AC 500 V
A = Gold Flash All Over
(Standard)
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
B = Selective Gold Flash Contact Area/
CONTACT MATERIAL
端子物料:
COPPER ALLOY
Tin On Tail
INSULATOR MATERIAL
绝缘½物料
:
C = Tin All Over
STANDARD
标准物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94V-0
OPTIONS
可选物料
: POLYESTER
聚酯
, LCP, UL 94V-0
G = 10µ" Gold Contact Area/Tin On Tail
OR POLYESTER
聚酯
, PBT, UL94V-0
I = 30µ" Gold Contact Area/Tin On Tail
SOLDERING PROCESS
可焊性
:
NYLON 6T (STANDARD
标准物料
) -
Insulator Width'W'
IR REFLOW
回流焊
: 260°C for 10 sec.
B = 2.00mm
(Standard)
WAVE
波峰焊
:230°C for 5-10 sec.
D
A = 1.50mm
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
PBT (OPTION
可选物料
) - MANUAL SOLDER
人工焊接
: 330°C for 3-5 sec.
Dimension C (1/100mm) (Post Height)
(NOT SUITABLE FOR HI-TEMP PROCESS
不适合高温处理
)
0400 = 4.00mm
(Standard)
LCP (OPTION
可选物料
) -
Or specify Dimension C
IR REFLOW
回流焊
: 260°C for 10 sec.
E
eg 0250 = 2.50mm
WAVE
波峰焊
:250°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
E
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
F
BF065
BF080
BF095
BF100
BF115
BF120
By
LYH
CB
PACKING
OPTIONS
B
27/04/09
PN
ORDERING
GRID
C
10/06/09
PN
INSULATOR
HEIGHT
D
22/06/09
DR
SOLDER
TEMP.
E
30/07/09
AJO
"MATES WITH"
OPTIONS
F
18/06/13
BF060
XX X
X
XXXX
XXXX
XXXX
X
X
REQUEST SAMPLES
AND QUOTATION
58
60
62
64
66
68
70
72
74
76
78
80
Packing Options
B
G = Plastic Box
(Standard)
D = Tube
E = Tube with Cap
Insulator Material
N = Nylon 6T
(Standard)
L = LCP
P = PBT
C
F
Dimension D (1/100mm)
(Tail Length)
0280 = 2.80mm
(Standard)
Or specify Dimension D
eg 0250 = 2.50mm
Dimension E (1/100mm)
(Centre of Pin to Top of Insulator)
0305 = 3.05mm
(Standard)
Or specify Dimension E
eg 0250 = 2.50mm
G
Tolerances
(Except as noted)
Part Number:-
Date:-
Dimensions in mm
BF060
Description:-
31 OCT 07
H
DRAWING
DETAIL
RELEASE
REV
DATE
A
31/10/07
X.°±5°
X.X ± 0.20
.X°±2°
X.XX ± 0.15 .XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
Third Angle Projection
X. ± 0.30
2.0mm PITCH PIN HEADER, DUAL ROW,
THROUGH HOLE, HORIZONTAL
GC
Scale
NTS
H
Sheet No.
E & OE
1/1
www.gct.co
Material
Drawn by
LYH
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Revision
F
See Note
1
2
3
4
5
6
7
8
Guidance on a problem related to composite fields in Galois fields!!!
I am currently working on a BCH decoder, and my boss requires me to use a table lookup method to replace the multiplier in the Galois Field. Since it is an m=14 Galois Field, the table needs more than...
eeleader FPGA/CPLD
Cortex-M3 USB module and SST25 series Flash storage
Cortex-M3 USB module and SST25 series Flash storage 1. The Cortex-M3 core LM3S37xx series microprocessors have built-in USB interfaces for Device/Host/OTG, which is very convenient. Generally, when us...
hansonhe Microcontroller MCU
51 has two 32K RAMs externally expanded. Now I can only access one. How can I access the other one?
I am using W77E58, and I have two 32K RAMs externally expanded. I use P3.4 as the chip select for both RAMs, but now I can only access one RAM. How can I access the other RAM?...
二战幸存者 Embedded System
Dear bosses: How is ARM developed and used? Please explain in detail...
Now there are many businesses that make ARM development boards, they just make money by selling development boards. How much can they ship? Can they make target boards (that can be used on devices) fo...
sunbine ARM Technology
TI's 433 or 470 chip packaging problem
It seems to be the same package as shown in the picture. I don't know what it is called. How do I solder the AGND in the middle? How do I solder it by hand?...
lidonglei1 Wireless Connectivity
Mobile phone antenna design - Harbin Institute of Technology microwave major graduation thesis.pdf
Mobile phone antenna design - Harbin Institute of Technology microwave major graduation thesis.pdf...
mzxiang8 RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1903  161  2533  1113  2602  39  4  51  23  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号