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MB85286-10PL

Description
MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIP,30PIN,PLASTIC
Categorystorage    storage   
File Size318KB,5 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MB85286-10PL Overview

MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIP,30PIN,PLASTIC

MB85286-10PL Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instruction, SIP30,.2
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time100 ns
I/O typeCOMMON
JESD-609 codee0
memory density37748736 bit
Memory IC TypeNIBBLE MODE DRAM
memory width9
Number of terminals30
word count4194304 words
character code4000000
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX9
Package body materialPLASTIC/EPOXY
Encapsulate equivalent codeSIP30,.2
power supply5 V
Certification statusNot Qualified
refresh cycle2048
Maximum seat height21.082 mm
Maximum standby current0.009 A
Maximum slew rate0.585 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal pitch2.54 mm
Terminal locationSINGLE

MB85286-10PL Related Products

MB85286-10PL MB85286-12PL MB85286-12PS MB85286-12PSG MB85286-10PS MB85286-10PSG
Description MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIP,30PIN,PLASTIC MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIP,30PIN,PLASTIC MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC
package instruction , SIP30,.2 , SIP30,.2 SIMM, SIM30 SIMM, SIM30 SIMM, SIM30 SIMM, SIM30
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 100 ns 120 ns 120 ns 120 ns 100 ns 100 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
memory density 37748736 bit 37748736 bit 37748736 bit 37748736 bit 37748736 bit 37748736 bit
Memory IC Type NIBBLE MODE DRAM NIBBLE MODE DRAM NIBBLE MODE DRAM NIBBLE MODE DRAM NIBBLE MODE DRAM NIBBLE MODE DRAM
memory width 9 9 9 9 9 9
Number of terminals 30 30 30 30 30 30
word count 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000 4000000 4000000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 4MX9 4MX9 4MX9 4MX9 4MX9 4MX9
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Encapsulate equivalent code SIP30,.2 SIP30,.2 SIM30 SIM30 SIM30 SIM30
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 2048 2048 2048 2048 2048 2048
Maximum seat height 21.082 mm 21.082 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm
Maximum standby current 0.009 A 0.009 A 0.009 A 0.009 A 0.009 A 0.009 A
Maximum slew rate 0.585 mA 0.495 mA 0.495 mA 0.495 mA 0.585 mA 0.585 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
JESD-30 code - - R-PSMA-N30 R-PSMA-N30 R-PSMA-N30 R-PSMA-N30
encapsulated code - - SIMM SIMM SIMM SIMM
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Terminal form - - NO LEAD NO LEAD NO LEAD NO LEAD
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