MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC
| Parameter Name | Attribute value |
| package instruction | SIMM, SIM30 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 100 ns |
| I/O type | COMMON |
| JESD-30 code | R-PSMA-N30 |
| memory density | 37748736 bit |
| Memory IC Type | NIBBLE MODE DRAM |
| memory width | 9 |
| Number of terminals | 30 |
| word count | 4194304 words |
| character code | 4000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4MX9 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SIMM |
| Encapsulate equivalent code | SIM30 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 2048 |
| Maximum seat height | 20.32 mm |
| Maximum standby current | 0.009 A |
| Maximum slew rate | 0.585 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 2.54 mm |
| Terminal location | SINGLE |
| MB85286-10PS | MB85286-12PL | MB85286-12PS | MB85286-12PSG | MB85286-10PL | MB85286-10PSG | |
|---|---|---|---|---|---|---|
| Description | MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC | MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIP,30PIN,PLASTIC | MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC | MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC | MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIP,30PIN,PLASTIC | MEMORY MODULE,DRAM,NIBBLE MODE,4MX(8+1),CMOS,SIM,30PIN,PLASTIC |
| package instruction | SIMM, SIM30 | , SIP30,.2 | SIMM, SIM30 | SIMM, SIM30 | , SIP30,.2 | SIMM, SIM30 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 100 ns | 120 ns | 120 ns | 120 ns | 100 ns | 100 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| memory density | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit |
| Memory IC Type | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 |
| Number of terminals | 30 | 30 | 30 | 30 | 30 | 30 |
| word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| character code | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 4MX9 | 4MX9 | 4MX9 | 4MX9 | 4MX9 | 4MX9 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Encapsulate equivalent code | SIM30 | SIP30,.2 | SIM30 | SIM30 | SIP30,.2 | SIM30 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
| Maximum seat height | 20.32 mm | 21.082 mm | 20.32 mm | 20.32 mm | 21.082 mm | 20.32 mm |
| Maximum standby current | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A | 0.009 A |
| Maximum slew rate | 0.585 mA | 0.495 mA | 0.495 mA | 0.495 mA | 0.585 mA | 0.585 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| JESD-30 code | R-PSMA-N30 | - | R-PSMA-N30 | R-PSMA-N30 | - | R-PSMA-N30 |
| encapsulated code | SIMM | - | SIMM | SIMM | - | SIMM |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY |
| Terminal form | NO LEAD | - | NO LEAD | NO LEAD | - | NO LEAD |