CD4050BDWR datasheet, PDF - EEWORLD Datasheet

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CD4050BDWR: DescriptionCMOS Hex Non-Inverting Buffer/Converter 16-SOIC -55 to 125; Categorylogic logic; File Size2MB，38 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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CD4050BDWR Overview

CMOS Hex Non-Inverting Buffer/Converter 16-SOIC -55 to 125

CD4050BDWR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SOIC
package instruction	SOIC-16
Contacts	16
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	1 week
series	4000/14000/40000
JESD-30 code	R-PDSO-G16
JESD-609 code	e4
length	10.3 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.018 A
Humidity sensitivity level	1
Number of functions	6
Number of entries	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	5/15 V
Maximum supply current (ICC)	0.12 mA
Prop。Delay @ Nom-Sup	140 ns
propagation delay (tpd)	140 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	2.65 mm
Maximum supply voltage (Vsup)	15 V
Minimum supply voltage (Vsup)	5 V
Nominal supply voltage (Vsup)	10 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.5 mm
Base Number Matches	1

CD4050BDWR Related Products

	CD4050BDWR	CD4049UBD	CD4049UBDT	CD4049UBPW	CD4049UBPWR	CD4050BD	CD4050BPW
Description	CMOS Hex Non-Inverting Buffer/Converter 16-SOIC -55 to 125	Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin SOIC Tube	Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin SOIC T/R	Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin TSSOP Tube	Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin TSSOP T/R	CMOS Hex Non-Inverting Buffer/Converter 16-SOIC -55 to 125	CMOS Hex Non-Inverting Buffer/Converter 16-TSSOP -55 to 125
Brand Name	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	-	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	-	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	-	-	-	Texas Instruments	Texas Instruments
Parts packaging code	SOIC	SOIC	-	TSSOP	TSSOP	SOIC	TSSOP
package instruction	SOIC-16	SOP, SOP16,.25	-	TSSOP, TSSOP16,.25	TSSOP, TSSOP16,.25	SOIC-16	TSSOP-16
Contacts	16	16	-	16	16	16	16
Reach Compliance Code	compliant	compliant	-	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	-	EAR99	-	EAR99	-
Factory Lead Time	1 week	6 weeks	-	1 week	6 weeks	1 week	1 week
series	4000/14000/40000	-	-	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 code	R-PDSO-G16	-	-	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e4	-	-	e4	e4	e4	e4
length	10.3 mm	-	-	5 mm	5 mm	9.9 mm	5 mm
Load capacitance (CL)	50 pF	-	-	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUFFER	-	-	INVERTER	INVERTER	BUFFER	BUFFER
MaximumI(ol)	0.018 A	-	-	0.018 A	0.018 A	0.018 A	0.018 A
Humidity sensitivity level	1	-	-	1	1	1	1
Number of functions	6	-	-	6	6	6	6
Number of entries	1	-	-	1	1	1	1
Number of terminals	16	-	-	16	16	16	16
Maximum operating temperature	125 °C	-	-	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-	-	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	-	-	TSSOP	TSSOP	SOP	TSSOP
Encapsulate equivalent code	SOP16,.4	-	-	TSSOP16,.25	TSSOP16,.25	SOP16,.25	TSSOP16,.25
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TR	-	-	TUBE	TR	TUBE	TUBE
Peak Reflow Temperature (Celsius)	260	-	-	260	260	260	260
power supply	5/15 V	-	-	5/15 V	5/15 V	5/15 V	5/15 V
Maximum supply current (ICC)	0.12 mA	-	-	0.12 mA	0.12 mA	0.12 mA	0.12 mA
Prop。Delay @ Nom-Sup	140 ns	-	-	120 ns	120 ns	140 ns	140 ns
propagation delay (tpd)	140 ns	-	-	120 ns	120 ns	140 ns	140 ns
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	-	-	NO	NO	NO	NO
Maximum seat height	2.65 mm	-	-	1.2 mm	1.2 mm	1.75 mm	1.2 mm
Maximum supply voltage (Vsup)	15 V	-	-	15 V	15 V	15 V	15 V
Minimum supply voltage (Vsup)	5 V	-	-	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	10 V	-	-	10 V	10 V	10 V	10 V
surface mount	YES	-	-	YES	YES	YES	YES
technology	CMOS	-	-	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	-	-	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	-	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	-	-	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	-	-	0.65 mm	0.65 mm	1.27 mm	0.65 mm
Terminal location	DUAL	-	-	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.5 mm	-	-	4.4 mm	4.4 mm	3.9 mm	4.4 mm
Base Number Matches	1	1	-	1	1	1	1

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