CD4049UBDT datasheet, PDF - EEWORLD Datasheet

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CD4049UBDT: DescriptionBuffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin SOIC T/R; CategoryBuffer and line drives; File Size2MB，38 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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CD4049UBDT Overview

Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin SOIC T/R

CD4049UBDT Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.39.00.01
SVHC	Yes
Logic Family	CD4000
Logic Function	Buffer/Converter
Number of Elements per Chip	6
Number of Channels per Chip	6
Number of Inputs per Chip	6
Number of Input Enables per Chip	0
Number of Outputs per Chip	6
Number of Output Enables per Chip	0
Bus Hold	No
Polarity	Inverting
Maximum Propagation Delay Time @ Maximum CL (ns)	120@5V\|65@10V\|50@15V
Absolute Propagation Delay Time (ns)	120
Process Technology	CMOS
Input Signal Type	Single-Ended
Output Type	Push-Pull
Maximum Low Level Output Current (mA)	26(Min)
Maximum High Level Output Current (mA)	-5.2(Min)
Minimum Operating Supply Voltage (V)	-0.5
Typical Operating Supply Voltage (V)	18\|1.8\|2.5\|3.3\|5\|9\|12\|15
Maximum Operating Supply Voltage (V)	20
Typical Quiescent Current (uA)	0.04
Maximum Quiescent Current (uA)	20
Propagation Delay Test Condition (pF)	50
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	125
Supplier Temperature Grade	Military
Packaging	Tape and Reel
Standard Package Name	SOP
Pin Count	16
Supplier Package	SOIC
Mounting	Surface Mount
Package Height	1.5(Max)
Package Length	10(Max)
Package Width	4(Max)
PCB changed	16
Lead Shape	Gull-wing

CD4049UBDT Related Products

	CD4049UBDT	CD4049UBD	CD4049UBPW	CD4049UBPWR	CD4050BD	CD4050BDWR	CD4050BPW
Description	Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin SOIC T/R	Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin SOIC Tube	Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin TSSOP Tube	Buffer/Converter 6-CH Inverting Push-Pull CMOS 16-Pin TSSOP T/R	CMOS Hex Non-Inverting Buffer/Converter 16-SOIC -55 to 125	CMOS Hex Non-Inverting Buffer/Converter 16-SOIC -55 to 125	CMOS Hex Non-Inverting Buffer/Converter 16-TSSOP -55 to 125
Brand Name	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	-	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	conform to
Maker	-	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	-	SOIC	TSSOP	TSSOP	SOIC	SOIC	TSSOP
package instruction	-	SOP, SOP16,.25	TSSOP, TSSOP16,.25	TSSOP, TSSOP16,.25	SOIC-16	SOIC-16	TSSOP-16
Contacts	-	16	16	16	16	16	16
Reach Compliance Code	-	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	-	EAR99	EAR99	-	EAR99	EAR99	-
Factory Lead Time	-	6 weeks	1 week	6 weeks	1 week	1 week	1 week
Base Number Matches	-	1	1	1	1	1	1
series	-	-	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 code	-	-	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	-	-	e4	e4	e4	e4	e4
length	-	-	5 mm	5 mm	9.9 mm	10.3 mm	5 mm
Load capacitance (CL)	-	-	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	-	-	INVERTER	INVERTER	BUFFER	BUFFER	BUFFER
MaximumI(ol)	-	-	0.018 A	0.018 A	0.018 A	0.018 A	0.018 A
Humidity sensitivity level	-	-	1	1	1	1	1
Number of functions	-	-	6	6	6	6	6
Number of entries	-	-	1	1	1	1	1
Number of terminals	-	-	16	16	16	16	16
Maximum operating temperature	-	-	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	TSSOP	TSSOP	SOP	SOP	TSSOP
Encapsulate equivalent code	-	-	TSSOP16,.25	TSSOP16,.25	SOP16,.25	SOP16,.4	TSSOP16,.25
Package shape	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	-	-	TUBE	TR	TUBE	TR	TUBE
Peak Reflow Temperature (Celsius)	-	-	260	260	260	260	260
power supply	-	-	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Maximum supply current (ICC)	-	-	0.12 mA	0.12 mA	0.12 mA	0.12 mA	0.12 mA
Prop。Delay @ Nom-Sup	-	-	120 ns	120 ns	140 ns	140 ns	140 ns
propagation delay (tpd)	-	-	120 ns	120 ns	140 ns	140 ns	140 ns
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	-	-	NO	NO	NO	NO	NO
Maximum seat height	-	-	1.2 mm	1.2 mm	1.75 mm	2.65 mm	1.2 mm
Maximum supply voltage (Vsup)	-	-	15 V	15 V	15 V	15 V	15 V
Minimum supply voltage (Vsup)	-	-	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	-	-	10 V	10 V	10 V	10 V	10 V
surface mount	-	-	YES	YES	YES	YES	YES
technology	-	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	-	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	-	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	-	0.65 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm
Terminal location	-	-	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	-	4.4 mm	4.4 mm	3.9 mm	7.5 mm	4.4 mm

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