EEWORLDEEWORLDEEWORLD

Part Number

Search

CDR12BP131AGWM

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CategoryPassive components    capacitor   
File Size147KB,9 Pages
ManufacturerAVX
Related ProductsFound20parts with similar functions to CDR12BP131AGWM
Download Datasheet Parametric View All

CDR12BP131AGWM Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP

CDR12BP131AGWM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAVX
package instructionCHIP
Reach Compliance Code_compli
ECCN codeEAR99
capacitance0.00013 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.979 mm
JESD-609 codee0
length1.4 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance2%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingWAFFLE PACK
positive tolerance2%
Rated (DC) voltage (URdc)50 V
GuidelineMIL-PRF-55681
size code0606
surface mountYES
Temperature characteristic codeBP
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceTin/Lead (Sn/Pb)
Terminal shapeWRAPAROUND
width1.4 mm
Base Number Matches1
Microwave MLC’s
CDR Series — MIL-PRF-55681 (RF/Microwave Chips)
MILITARY DESIGNATION PER MIL-PRF-55681
W
W
T
L
L
T
A 0J
47
10
0J
bw
bw
CDR11/12
CDR13/14
CROSS REFERENCE: AVX/MIL-PRF-55681
Per MIL-C-55681
CDR11
CDR12
CDR13
CDR14
AVX
Style
AQ11
AQ12
AQ13
AQ14
Length (L)
.055±.015
(1.40±.381)
.055±.025
(1.40±.635)
.110±.020
(2.79±.508)
.110 +.035 -0.20
(2.79 +.889 -.508)
Width (W)
.055±.015
(1.40±.381)
.055±.015
(1.40±.381)
.110±.020
(2.79±.508)
.110±.020
(2.79±.508)
Thickness (T)
Max
Min
.057
(1.45)
.057
(1.45)
.102
(2.59)
.102
(2.59)
.020
(.508)
.020
(.508)
.030
(.762)
.030
(.762)
Termination Band (bw)
Max
Min
.020
(.508)
.020
(.508)
.025
(.635)
.025
(.635)
.005
(.127)
.005
(.127)
.005
(.127)
.005
(.127)
HOW TO ORDER
CDR12
MIL Style
CDR11, CDR12,
CDR13, CDR14
BG
101
Capacitance
EIA Capacitance Code in pF.
First two digits = significant figures
or “R” for decimal place.
Third digit = number of zeros or
after “R” significant figures.
A
K
Capacitance
Tolerance Code
B = ±.1 pF
C = ±.25 pF
D = ±.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
U
S
Failure Rate
Level
Termination
Finish (Military
Designations)
Code
M = 1.0%
P = .1%
R = .01%
S = .001%
Voltage
Temperature
Limits
BG = +90±20 ppm/°C with and without
rated voltage from -55°C to + 125°C
BP = 0±30ppm/°C with and without
rated voltage from -55°C to +125°C
Rated Voltage
Code
A = 50V
B = 100V
C = 200V
D = 300V
E = 500V
PACKAGING
Standard Packaging Quanity
CDR11-12 = 100 pcs per waffle pack
CDR13-14 = 80 pcs per waffle pack
M = Palladium/Silver (CDR11 & 13 only)
N = Silver, Nickel, Gold (CDR11 & 13 only)
S = Solder Coated, Final (CDR12 & 14 only)
U = Base Metallization, Barrier Metal, Solder
Coated. (Solder M.P. 200°C or less)
(CDR12 & 14 only)
W = Base Metallization, Barrier Metal,
Tinned (Tin or Tin/Lead Alloy)
(CDR12 & 14 only)
Y = 100% Tin
(CDR12 & 14 only)
Z = Base Metallization, Barrier Metal
(TIn Lead Alloy With 4% Lead Min.)
(CDR12 & 14 only)
7
Not RoHS Compliant
TAPE & REEL:
All tape and reel specifications are in compliance with EIA RS481
(equivalent to IEC 286 part 3).
Sizes SQCA through SQCB, CDR11/12 through 13/14.
—8mm carrier
—7" reel: ≤0.040" thickness = 2000 pcs
≤0.075" thickness = 2000 pcs
—13" reel: ≤0.075" thickness = 10,000 pcs
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
131

CDR12BP131AGWM Similar Products

Part Number Manufacturer Description
CDR11BP131AGMM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGNM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGYP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGZR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AGYS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGYS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGYR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AGWR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGNR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGZP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGYM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGZM AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AGSS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AGSP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AGUP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AGZR AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AGWP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AGZP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGNP AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AGNS AVX Ceramic Capacitor, Multilayer, Ceramic, 50V, 2% +Tol, 2% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
The oscilloscope's six acquisition modes make signal acquisition easier!
The oscilloscope signal acquisition mode is used to control how to generate waveforms from sampling points. The commonly used waveform capture modes of Dingyang oscilloscopes are normal mode and peak ...
博宇讯铭 Test/Measurement
ce5.0 registry autoformat
I would like to ask about the settings in the registry. [】 My nandflash is 64MB, with three partitions, one is the bootloader, the second is reserved for the wince system, and the third is the storage...
沙漠绿洲 Embedded System
Aigek Electrical Science | How to convert AC into DC?
I believe that many of my friends have this question when studying electricity or using a wiring harness tester: how does alternating current become direct current? First, let's understand the basic c...
aigtekatdz Test/Measurement
Urgent Question 7th Floor
Hello, 7th floor, I want to ask about your 2-wire controlled 12864, what is the PSB connected to? Is it grounded? I use an external 5V power supply for the LCD (5V power supply and MSP430g2553 share t...
zhangjianqyh Microcontroller MCU
It is recommended that when searching for inviters, you can press Enter to start the search directly, instead of clicking the search button with the mouse.
I suggest that when searching for inviters, you can press Enter to start the search directly instead of clicking the Find button with your mouse. As shown in the following figure, after I deleted the ...
深圳小花 Suggestions & Announcements
Some Problems in PCB Circuit Design and Production
Some issues in PCB circuit design and production Author: pcbask Avoid vias close to SMT pads If the vias are not covered with oil, we will make the vias too close to the pads of SMT devices during lay...
ohahaha PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 862  999  954  495  1910  18  21  20  10  39 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号