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LM2619

Description
500mA Sub-Miniature Step-Down DC-DC Converter
File Size830KB,15 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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LM2619 Overview

500mA Sub-Miniature Step-Down DC-DC Converter

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Description 500mA Sub-Miniature Step-Down DC-DC Converter 500mA Sub-Miniature Step-Down DC-DC Converter 500mA Sub-Miniature Step-Down DC-DC Converter
Is it Rohs certified? - incompatible incompatible
Maker - National Semiconductor(TI ) National Semiconductor(TI )
package instruction - CSP-10 CSP-10
Reach Compliance Code - _compli _compli
ECCN code - EAR99 EAR99
Is Samacsys - N N
Analog Integrated Circuits - Other Types - SWITCHING REGULATOR SWITCHING REGULATOR
control mode - CURRENT-MODE CURRENT-MODE
Control Technology - PULSE WIDTH MODULATION PULSE WIDTH MODULATION
Maximum input voltage - 5.5 V 5.5 V
Minimum input voltage - 2.8 V 2.8 V
Nominal input voltage - 3.6 V 3.6 V
JESD-30 code - R-PBGA-B10 R-PBGA-B10
JESD-609 code - e0 e0
length - 2.504 mm 2.504 mm
Humidity sensitivity level - 1 1
Number of functions - 1 1
Number of terminals - 10 10
Maximum operating temperature - 85 °C 85 °C
Minimum operating temperature - -25 °C -25 °C
Maximum output current - 1 A 1 A
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - VFBGA VFBGA
Encapsulate equivalent code - BGA10,3X4,20 BGA10,3X4,20
Package shape - RECTANGULAR RECTANGULAR
Package form - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) - 260 260
Certification status - Not Qualified Not Qualified
Maximum seat height - 0.675 mm 0.675 mm
surface mount - YES YES
Switch configuration - BUCK BUCK
Maximum switching frequency - 732 kHz 732 kHz
Temperature level - OTHER OTHER
Terminal surface - Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form - BALL BALL
Terminal pitch - 0.5 mm 0.5 mm
Terminal location - BOTTOM BOTTOM
Maximum time at peak reflow temperature - 40 40
width - 2.25 mm 2.25 mm
Base Number Matches - 1 1

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