LM3204 datasheet, PDF - EEWORLD Datasheet

LM3204: DescriptionMiniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers; File Size864KB，16 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LM3204 Overview

Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers

LM3204 Related Products

	LM3204	LM3204TL	LM3204TLX
Description	Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers	Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers	Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers
Is it Rohs certified?	-	conform to	conform to
Maker	-	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	-	VFBGA, BGA12,3X4,20	VFBGA, BGA12,3X4,20
Reach Compliance Code	-	compli	compli
ECCN code	-	EAR99	EAR99
Analog Integrated Circuits - Other Types	-	SWITCHING REGULATOR	SWITCHING REGULATOR
control mode	-	CURRENT-MODE	CURRENT-MODE
Control Technology	-	PULSE WIDTH MODULATION	PULSE WIDTH MODULATION
Maximum input voltage	-	5.5 V	5.5 V
Minimum input voltage	-	2.7 V	2.7 V
Nominal input voltage	-	3.6 V	3.6 V
JESD-30 code	-	R-PBGA-B10	R-PBGA-B10
JESD-609 code	-	e1	e1
length	-	2.174 mm	2.174 mm
Humidity sensitivity level	-	1	1
Number of functions	-	1	1
Number of terminals	-	10	10
Maximum operating temperature	-	85 °C	85 °C
Minimum operating temperature	-	-30 °C	-30 °C
Maximum output current	-	0.94 A	0.94 A
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	VFBGA	VFBGA
Encapsulate equivalent code	-	BGA12,3X4,20	BGA12,3X4,20
Package shape	-	RECTANGULAR	RECTANGULAR
Package form	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	-	260	260
Certification status	-	Not Qualified	Not Qualified
Maximum seat height	-	0.675 mm	0.675 mm
surface mount	-	YES	YES
Switch configuration	-	BUCK	BUCK
Maximum switching frequency	-	2200 kHz	2200 kHz
Temperature level	-	OTHER	OTHER
Terminal surface	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	-	BALL	BALL
Terminal pitch	-	0.5 mm	0.5 mm
Terminal location	-	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	-	40	40
width	-	1.819 mm	1.819 mm

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