|
LM3204TL |
LM3204 |
LM3204TLX |
| Description |
Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers |
Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers |
Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers |
| Is it Rohs certified? |
conform to |
- |
conform to |
| Maker |
National Semiconductor(TI ) |
- |
National Semiconductor(TI ) |
| package instruction |
VFBGA, BGA12,3X4,20 |
- |
VFBGA, BGA12,3X4,20 |
| Reach Compliance Code |
compli |
- |
compli |
| ECCN code |
EAR99 |
- |
EAR99 |
| Analog Integrated Circuits - Other Types |
SWITCHING REGULATOR |
- |
SWITCHING REGULATOR |
| control mode |
CURRENT-MODE |
- |
CURRENT-MODE |
| Control Technology |
PULSE WIDTH MODULATION |
- |
PULSE WIDTH MODULATION |
| Maximum input voltage |
5.5 V |
- |
5.5 V |
| Minimum input voltage |
2.7 V |
- |
2.7 V |
| Nominal input voltage |
3.6 V |
- |
3.6 V |
| JESD-30 code |
R-PBGA-B10 |
- |
R-PBGA-B10 |
| JESD-609 code |
e1 |
- |
e1 |
| length |
2.174 mm |
- |
2.174 mm |
| Humidity sensitivity level |
1 |
- |
1 |
| Number of functions |
1 |
- |
1 |
| Number of terminals |
10 |
- |
10 |
| Maximum operating temperature |
85 °C |
- |
85 °C |
| Minimum operating temperature |
-30 °C |
- |
-30 °C |
| Maximum output current |
0.94 A |
- |
0.94 A |
| Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
| encapsulated code |
VFBGA |
- |
VFBGA |
| Encapsulate equivalent code |
BGA12,3X4,20 |
- |
BGA12,3X4,20 |
| Package shape |
RECTANGULAR |
- |
RECTANGULAR |
| Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
- |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
| Certification status |
Not Qualified |
- |
Not Qualified |
| Maximum seat height |
0.675 mm |
- |
0.675 mm |
| surface mount |
YES |
- |
YES |
| Switch configuration |
BUCK |
- |
BUCK |
| Maximum switching frequency |
2200 kHz |
- |
2200 kHz |
| Temperature level |
OTHER |
- |
OTHER |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
- |
BALL |
| Terminal pitch |
0.5 mm |
- |
0.5 mm |
| Terminal location |
BOTTOM |
- |
BOTTOM |
| Maximum time at peak reflow temperature |
40 |
- |
40 |
| width |
1.819 mm |
- |
1.819 mm |