· Underwriters Laboratory recognition under UL standard
for safety 497B : Isolated loop circuit protection
· Glass passivated junction
· 1500W peak pulse power capability on 10/1000μS
waveform, repetition rate(duty cycle) : 0.05%
· Excellent clamping capability
· Low incremental surge resistance
· Very fast response time
· Includes 1N6267 thru 1N6303A
POWER 1500Watts
VOLTAGE 6.8 to 440 Volts
DO-201AD
0.210(5.3)
0.188(4.8)
DIA.
1.0(25.4)
MIN.
Mechanical Data
· Case : JEDEC DO-201AD molded plastic body
over passivated junction
· Terminals : Solder plated axial leads, solderable per
MIL-STD-750, method 2026
· High temperature soldering guaranteed : 265
℃
/10 seconds,
0.375"(9.5mm) lead length, 5lbs. (2.3Kg) tension
· Polarity : For uni-directional types the color band denotes
cathode, which is positive with respect to the
anode under normal TVS operation
· Mounting Position : Any
· Weight : 0.042 ounce, 0.18 gram
· Flammability : Epoxy is rated UL 94V-0
0.375(9.5)
0.285(7.2)
0.042(1.1)
0.037(0.9)
DIA.
1.0(25.4)
MIN.
Dimensions in inches and (millimeters)
Devices For Bidirectional Applications
· For bi-directional use C or CA suffix for types 1.5KE6.8 thru types K1.5E440(e.g. 1.5KE6.8C, 1.5KE440CA),
electrical characteristics apply in both directions.
Maximum Ratings And Electrical Characteristics
(Ratings at 25℃ ambient temperature unless otherwise specified)
Symbols
Peak power dissipation with a 10/1000μS waveform (Note 1. Fig. 1)
Peak pulse current with a 10/1000μS waveform (Note 1)
Steady state power dissipation at T
L
=75℃ lead length 0.375"(9.5mm) (Note2)
Peak forward surge current, 8.3mm single half sine-wave unidirectional only (Note 3)
Maximum instantaneous forward voltage at 100A for unidirectional only (Note4)
Typical thermal resistance junction to lead
Typical thermal resistance junction to ambient
Operating junction and storage temperature range
P
PPM
I
PPM
P
M(AV)
I
FSM
V
F
Values
1500
See next table
6.5
200
3.5/5.0
20
75
-55 to +175
Units
Watts
Amps
Watts
Amps
Volts
℃/W
℃/W
℃
Rθ
JL
Rθ
JA
T
J
,T
STG
Notes:
(1) Non repetitive current pulse, per Fig.3 and derated above T
A
=25℃ per Fig.2
(2) Mounted on copper pads area of 1.6×1.6"(40×40mm) per Fig.5
(3) Measured on 8.3ms single half sine-wave or equivalent square wave, duty cycle=4 pulse per minute maximum
(4) V
F
=3.5 Volts for 1.5KE220(A) & below; V
F
=5.0 Volts for 1.5KE250(A) & above
ELECTRICAL CHARACTERISTIC at (TA=25℃ unless other specified)
JEDEC
Type
Number
1N6267
(C )
1N6267
(C )
A
1N6268
(C )
1N6268
(C )
A
1N6269
(C )
1N6269
(C )
A
1N6270
(C )
1N6270
(C )
A
1N6271
(C )
1N6271
(C )
A
1N6272
(C )
1N6272
(C )
A
1N6273
(C )
1N6273
(C )
A
1N6274
(C )
1N6274
(C )
A
1N6275
(C )
1N6275
(C )
A
1N6276
(C )
1N6276
(C )
A
1N6277
(C )
1N6277
(C )
A
1N6278
(C )
1N6278
(C )
A
1N6279
(C )
1N6279
(C )
A
1N6280
(C )
1N6280
(C )
A
1N6281
(C )
1N6281
(C )
A
1N6282
(C )
1N6282
(C )
A
1N6283
(C )
1N6283
(C )
A
1N6284
(C )
1N6284
(C )
A
1N6285
(C )
1N6285
(C )
A
1N6286
(C )
1N6286
(C )
A
1N6287
(C )
1N6287
(C )
A
1N6288
(C )
1N6288
(C )
A
1N6289
(C )
1N6289
(C )
A
1N6290
(C )
1N6290
(C )
A
1N6291
(C )
1N6291
(C )
A
1N6292
(C )
General
Semiconductor
Part
Number
1.5K E 6.8
(C )
1.5K E 6.8
(C )
A
1.5K E 7.5
(C )
1.5K E 7.5
(C )
A
1.5K E 8.2
(C )
1.5K E 8.2
(C )
A
1.5K E 9.1
(C )
1.5K E 9.1
(C )
A
1.5K E 10
(C )
1.5K E 10
(C )
A
1.5K E 11
(C )
1.5K E 11
(C )
A
1.5K E 12
(C )
1.5K E 12
(C )
A
1.5K E 13
(C )
1.5K E 13
(C )
A
1.5K E 15
(C )
1.5K E 15
(C )
A
1.5K E 16
(C )
1.5K E 16
(C )
A
1.5K E 18
(C )
1.5K E 18
(C )
A
1.5K E 20
(C )
1.5K E 20
(C )
A
1.5K E 22
(C )
1.5K E 22
(C )
A
1.5K E 24
(C )
1.5K E 24
(C )
A
1.5K E 27
(C )
1.5K E 27
(C )
A
1.5K E 30
(C )
1.5K E 30
(C )
A
1.5K E 33
(C )
1.5K E 33
(C )
A
1.5K E 36
(C )
1.5K E 36
(C )
A
1.5K E 39
(C )
1.5K E 39
(C )
A
1.5K E 43
(C )
1.5K E 43
(C )
A
1.5K E 47
(C )
1.5K E 47
(C )
A
1.5K E 51
(C )
1.5K E 51
(C )
A
1.5K E 56
(C )
1.5K E 56
(C )
A
1.5K E 62
(C )
1.5K E 62
(C )
A
1.5K E 68
(C )
1.5K E 68
(C )
A
1.5K E 75
(C )
Breakdown Voltage
V
(BR)
at I
T
(1)
(V)
Min
6.12
6.45
6.75
7.13
7.38
7.79
8.19
8.65
9.00
9.50
9.90
10.5
10.8
11.4
11.7
12.4
13.5
14.3
14.4
15.2
16.2
17.1
18.0
19.0
19.8
20.9
21.6
22.8
24.3
25.7
27.0
28.5
29.7
31.4
32.4
34.2
35.1
37.1
38.7
40.9
42.3
44.7
45.9
48.5
50.4
53.2
55.8
58.9
61.2
64.6
67.5
Max
7.48
7.14
8.25
7.88
9.02
8.61
10.0
9.55
11.0
10.5
12.1
11.6
13.2
12.6
14.3
13.7
16.5
15.8
17.6
16.8
19.8
18.9
22.0
21.0
24.2
23.1
26.4
25.2
29.7
28.4
33.0
31.5
36.3
34.7
39.6
37.8
42.9
41.0
47.3
45.2
51.7
49.4
56.1
53.6
61.8
58.8
68.2
65.1
74.8
71.4
82.5
Test
Current
I
T
(mA)
10
10
10
10
10
10
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Stand-off
Voltage
V
WM
(V)
5.50
5.80
6.05
6.40
6.63
7.02
7.37
7.78
8.10
8.55
8.92
9.40
9.72
10.2
10.5
11.1
12.1
12.8
12.9
13.6
14.5
15.3
16.2
17.1
17.8
18.8
19.4
20.5
21.8
23.1
24.3
25.6
26.8
28.2
29.1
30.8
31.6
33.3
34.8
36.8
38.1
40.2
41.3
43.6
45.4
47.8
50.2
53.0
55.1
58.1
60.7
Maximum
Reverse
Leakage
at V
WM
I
D
(4)
(µA)
1000
1000
500
500
200
200
50
50
10
10
5.0
5.0
5.0
5.0
5.0
5.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Maximum
Peak Pulse
Current
I
PPM
(2)
(A)
139
143
128
133
120
124
109
112
100
103
92.6
96.2
86.7
89.8
78.9
82.4
68.2
70.8
63.8
66.7
56.6
59.5
51.5
54.2
47.0
49.0
43.2
45.2
38.4
40.0
34.5
36.2
31.4
32.8
28.8
30.1
26.6
27.8
24.2
25.3
22.1
23.1
20.4
21.4
18.6
19.5
16.9
17.6
15.3
16.3
13.9
Maximum
Clamping
Voltage
at I
PPM
V
C
(V)
10.8
10.5
11.7
11.3
12.5
12.1
13.8
13.4
15.0
14.5
16.2
15.6
17.3
16.7
19.0
18.2
22.0
21.2
23.5
22.5
26.5
25.2
29.1
27.7
31.9
30.6
34.7
33.2
39.1
37.5
43.5
41.4
47.7
45.7
52.0
49.9
56.4
53.9
61.9
59.3
67.8
64.8
73.5
70.1
80.5
77.0
89.0
85.0
98.0
92.0
109
Maximum
Temp.
Coefficient
of V
(BR)
(% /¡ C)
0.057
0.057
0.061
0.061
0.065
0.065
0.068
0.068
0.073
0.073
0.075
0.075
0.076
0.078
0.081
0.081
0.084
0.084
0.086
0.086
0.088
0.089
0.090
0.090
0.092
0.092
0.094
0.094
0.096
0.096
0.097
0.097
0.098
0.098
0.099
0.099
0.100
0.100
0.101
0.101
0.101
0.101
0.102
0.102
0.103
0.103
0.104
0.104
0.104
0.104
0.105
ELECTRICAL CHARACTERISTIC at (TA=25℃ unless other specified)
JEDEC
Type
Number
1N6292
(C )
A
1N6293
(C )
1N6293
(C )
A
1N6294
(C )
1N6294
(C )
A
1N6295
(C )
1N6295
(C )
A
1N6296
(C )
1N6296
(C )
A
1N6297
(C )
1N6297
(C )
A
1N6298
(C )
1N6298
(C )
A
1N6299
(C )
1N6299
(C )
A
1N6300
(C )
1N6300
(C )
A
1N6301
(C )
1N6301
(C )
A
1N6302
(C )
1N6302
(C )
A
1N6303
(C )
1N6303
(C )
A
General
Semiconductor
Part
Number
1.5K E 75
(C )
A
1.5K E 82
(C )
1.5K E 82
(C )
A
1.5K E 91
(C )
1.5K E 91
(C )
A
1.5K E 100
(C )
1.5K E 100
(C )
A
1.5K E 110
(C )
1.5K E 110
(C )
A
1.5K E 120
(C )
1.5K E 120
(C )
A
1.5K E 130
(C )
1.5K E 130
(C )
A
1.5K E 150
(C )
1.5K E 150
(C )
A
1.5K E 160
(C )
1.5K E 160
(C )
A
1.5K E 170
(C )
1.5K E 170
(C )
A
1.5K E 180
(C )
1.5K E 180
(C )
A
1.5K E 200
(C )
1.5K E 200
(C )
A
1.5K E 220
(C )
1.5K E 220
(C )
A
1.5K E 250
(C )
1.5K E 250
(C )
A
1.5K E 300
(C )
1.5K E 300
(C )
A
1.5K E 350
(C )
1.5K E 350
(C )
A
1.5K E 400
(C )
1.5K E 400
(C )
A
1.5K E 440
(C )
1.5K E 440
(C )
A
Breakdown Voltage
V
(BR)
at I
T
(1)
(V)
Min
71.3
73.8
77.9
81.9
86.5
90.0
95.0
99.0
105
108
114
117
124
136
143
144
152
153
162
162
171
180
190
198
209
225
237
270
285
315
333
360
380
396
418
Max
78.8
90.2
86.1
100.0
95.5
110
105
121
116
132
126
143
137
165
158
176
168
187
179
198
189
220
210
242
231
275
263
330
315
385
368
440
420
484
462
Test
Current
I
T
(mA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Stand-off
Voltage
V
WM
(V)
64.1
66.4
70.1
73.7
77.8
81.0
85.5
89.2
94.0
97.2
102
105
111
121
128
130
136
138
145
146
154
162
171
175
185
202
214
243
256
284
300
324
342
356
376
Maximum
Reverse
Leakage
at V
WM
I
D
(4)
(µA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Maximum
Peak Pulse
Current
I
PPM
(2)
(A)
14.6
12.7
13.3
11.5
12.0
10.4
10.9
9.5
9.9
8.7
9.1
8.0
8.4
7.0
7.2
6.5
6.8
6.1
6.4
5.8
6.1
5.2
5.5
4.4
4.6
4.2
4.4
3.5
3.6
3.0
3.1
2.6
2.7
2.4
2.5
Maximum
Clamping
Voltage
at I
PPM
V
C
(V)
104
118
113
131
125
144
137
158
152
173
165
187
179
215
207
230
219
244
234
258
246
287
274
344
328
360
344
430
414
504
482
574
548
631
602
Maximum
Temp.
Coefficient
of V
(BR)
(% /¡ C)
0.105
0.105
0.105
0.106
0.106
0.106
0.106
0.107
0.107
0.107
0.107
0.107
0.107
0.108
0.106
0.106
0.108
0.108
0.108
0.108
0.108
0.108
0.108
0.108
0.108
0.110
0.110
0.110
0.110
0.110
0.110
0.110
0.110
0.110
0.110
Notes : (1)
(2)
(3)
(4)
P uls e tes t: t
p =
50ms
S urge current waveform per F ig. 3 and derate per F ig. 2
All terms and s ymbols are cons is tent with ANS I/IE E E C A62.35
For bidirectional types with V
R
10 volts and les s the I
D
limit is doubled
A pplic ation
¥ T his s eries of S ilicon Trans ient S uppres s ors is us ed in applications where large voltage trans ients can permanently damage voltage-s ens itive components.
¥ T he T V S diode can be us ed in applications where induced lightning on rural or remote trans mis s ion lines pres ents a hazard to electronic circuitry
(ref: R .E .A. s pecification P.E . 60).
¥ T his Trans ient Voltage S uppres s or diode has a puls e power rating of 1500 watts for one millis econd. T he res pons e time of T V S diode clamping action is
effectively ins tantaneous (1 x 10
-9
s econds bidirectional); therefore, they can protect integrated circuits, MOS devices, hybrids, and other voltage s ens itive s emi-
conductors and components. T V S diodes can als o be us ed in s eries or parallel to increas e the peak power ratings.
RATINGS AND CHARACTERISTIC CURVES 1.5KE SERIES AND 1N6267 THRU 1N6303(C)A
Fig. 1Ð P eak P uls e Po wer R ating C ur ve
100
Fig. 2Ð P uls e Derating C ur ve
P eak P uls e P ower (P
P P
) or C urrent (I
P P
)
Derating in P ercentage, %
100
P eak P uls e P ower (kW)
75
10
50
1
P
PPM ,
25
0.1
0.1
μS
1.0
μS
1 0
μS
100
μS
1.0ms
10ms
0
0
25
50
75
100
125
150
o
175
200
t
d ,
P uls e Width (s ec.)
T
A
,
Ambient Temperature ( C )
Fig. 3Ð P uls e Waveform
150
F ig. 4 - Typic al J unc tion C apac itanc e
10,000
P eak P uls e C urrent, % I
R S M
tr = 10
μS
P eak Value
I
P P M
100
C
J
, C apacitance, pF
T
J
= 25 C
P uls e Width (td)
is defined as the point
where the peak current
decays to 50% of I
P P M
o
Unidirectional
B idirectional
V
R
= 0
1,000
Half Value
I
P P M
50
IP P
2
10/1000
μS
W aveform
as defined by R .E .A.
td
100
V
R
= R ated
S tand-off Voltage
f = 1 MHz
V s ig = 50mV p-p
o
T
J
= 25 C
5
10
100
500
I
P P M ,
0
0
1.0
2.0
3.0
4.0
10
t,
Time (ms )
V
(B R )
, B reakdown Voltage (V )
P
M(AV )
, S teady S tate P ower Dissipation (W)
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0
F ig. 5Ð S teady S tate Power
Derating C ur ve
60 H
Z
R es is tive or
Inductive Load
F ig. 6 - Maximum Non-repetitive Peak F orwar d
S urge C urrent Unidirectional Only
200
P eak F orward S urge C urrent (A)
8.3ms S ingle Half S ine-Wave
(J E DE C Method) T
J
= T
J
max.
100
L = 0.375" (9.5mm)
Lead Lengths
1.6 x 1.6 x .040"
(40 x 40 x 1mm)
C opper Heat S inks
25
50
75
100
125
150
o
10
175
200
1
10
100
T
L
,
Lead Temperature ( C )
Number of C ycles at 60 H
Z
RATINGS AND CHARACTERISTIC CURVES 1.5KE SERIES AND 1N6267 THRU 1N6303(C)A
Please give me a copy of msp430g2231.h. I accidentally overwrote it and can't find it online. Thanks.[[i] This post was last edited by haphard on 2011-12-1 14:59 [/i]]...
DRAM, dynamic random access memory, needs to be constantly refreshed to save data. Moreover, it reuses row and column addresses, and many have page modes. SRAM, static random access memory, does not n...
[color=black][font=宋体][size=14.0pt]I use [/size][/font][/color][color=black][font=Tahoma][size=14.0pt]ALTERA[/size][/font][/color][color=black][font=宋体][size=14.0pt]EPM240T100C5N,[/size][/font][/color...
I made a board called LM3S6918. After plugging in JLink, I can read the CPU core in both jtag and SW modes. I can also download programs to the CPU flash. But when I do a Dubeg in SW mode, it pops up ...
[color=#333333][font=微软雅黑]Do you understand the difference between the two power supply ripple tests?[/font][/color]{:1_96:}[hide]Figure 1 shows a conventional oscilloscope probe test, and Figure 2 us...
[align=left][size=16px][color=#000000][size=4]Today, I'd like to start a post to talk about the welding and debugging process of the Core Line [font=Calibri]FPGA[/font] development board. The Core Lin...
Emergency hand-held lamps powered by 6V maintenance-free batteries are widely used in rural areas. The charger used is a transformer step-down and single diode half-wave rectifier, and the charging...[Details]
Hardware designers have begun to adopt FPGA technology in high-performance DSP designs because it can provide 10-100 times faster computing than PC-based or microcontroller-based solutions. Previou...[Details]
1. Overview
Will passive devices
produce nonlinear intermodulation distortion? The answer is yes! Although there is no systematic theoretical analysis, it has been found in engineerin...[Details]
1 Introduction
The high temperature tester is mainly used for temperature tracking measurement and data acquisition during the heating process. By systematically analyzing the test data, the...[Details]
1. Introduction to CIF Board
Fieldbus integration based on PC system
Whether it is a master or a slave, fieldbus has won unanimous praise in the field of PC-based automation. For more...[Details]
The concept of state machine
State machine is an important concept in software programming. More important than this concept is its flexible application. In a clear and efficient program, ther...[Details]
Today, with energy becoming increasingly scarce, the utilization of natural energy has become the focus of people's attention. Among various natural energies, the endless solar energy is highly fav...[Details]
1 Introduction
Ultrasound refers to elastic vibration with a frequency higher than the audible frequency limit (i.e., in the frequency band above 20 kHz). The propagation process of this vib...[Details]
Analysis of the three core aspects of digital TV transmission standards
According to the differences in regionality, transmission method and modulation method, the transmission method needs to...[Details]
1 Introduction to LED
With the development of science and technology, people have higher and higher requirements on automobile light sources. LED (Light Emitting Diode) has gradually attracted...[Details]
Portable power applications are broad and varied. Products range from wireless sensor nodes with average power consumption of only a few microwatts to in-vehicle medical or data acquisition systems...[Details]
1 Introduction
Automatic Test
System The ATS (Automatic Test System) integrates all the stimulus and measurement equipment required for testing.
The computer
efficiently comp...[Details]
introduction
The Steyr diesel engine produced by Weifang Diesel Engine Factory has huge power and is one of the main power models widely used in China's heavy machinery and large trucks. In ...[Details]
1. Introduction
Modern modular machine tools are equipped with a large number of electronic devices to meet the requirements of processing accuracy, processing speed, etc. If the conventional ...[Details]
Synchronous buck designs are becoming increasingly difficult, and the selection of suitable ICs is becoming quite narrow. This Design Idea combines a current-mode PWM IC used in a flyback regulator...[Details]
Microcontroller MCU
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