CMOS 1.8 V to 5.5 V, 2.5 Ω
2:1 Mux/SPDT Switch in SOT-23
ADG719
FEATURES
1.8 V to 5.5 V single supply
4 Ω (max) on resistance
0.75 Ω (typ) on resistance flatness
−3 dB bandwidth > 200 MHz
Rail-to-rail operation
6-Lead SOT-23 package and 8-Lead MSOP package
Fast switching times:
t
ON
= 12 ns
t
OFF
= 6 ns
Typical power consumption: (< 0.01 μW)
TTL/CMOS compatible
FUNCTIONAL BLOCK DIAGRAM
ADG719
S2
D
S1
IN
08708-001
NOTES
1. SWITCHES SHOWN FOR A LOGIC 1 INPUT.
Figure 1.
APPLICATIONS
Battery-powered systems
Communication systems
Sample-and-hold systems
Audio signal routing
Video switching
Mechanical reed relay replacement
GENERAL DESCRIPTION
The ADG719 is a monolithic CMOS SPDT switch. This switch
is designed on a submicron process that provides low power
dissipation yet gives high switching speed, low on resistance,
and low leakage currents.
The ADG719 can operate from a single-supply range of 1.8 V
to 5.5 V, making it ideal for use in battery-powered instruments
and with the new generation of DACs and ADCs from Analog
Devices, Inc.
Each switch of the ADG719 conducts equally well in both
directions when on. The ADG719 exhibits break-before-make
switching action.
Because of the advanced submicron process, −3 dB bandwidths
of greater than 200 MHz can be achieved.
The ADG719 is available in a 6-lead SOT-23 package and an
8-lead MSOP package.
PRODUCT HIGHLIGHTS
1.
1.8 V to 5.5 V Single-Supply Operation. The ADG719
offers high performance, including low on resistance and
fast switching times, and is fully specified and guaranteed
with 3 V and 5 V supply rails.
Very Low R
ON
(4 Ω Max at 5 V and 10 Ω Max at 3 V). At 1.8 V
operation, R
ON
is typically 40 Ω over the temperature range.
Automotive Temperature Range: −40°C to +125°C.
On Resistance Flatness (R
FLAT(ON)
) (0.75 Ω typ).
−3 dB Bandwidth > 200 MHz.
Low Power Dissipation. CMOS construction ensures low
power dissipation.
Fast t
ON
/t
OFF
.
Tiny, 6-lead SOT-23 and 8-lead MSOP packages.
2.
3.
4.
5.
6.
7.
8.
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2002–2010 Analog Devices, Inc. All rights reserved.
ADG719
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Typical Performance Characteristics ..............................................7
Test Circuits ........................................................................................9
Terminology .................................................................................... 11
Applications Information .............................................................. 12
ADG719 Supply Voltages .......................................................... 12
On Response vs. Frequency ...................................................... 12
Off Isolation ................................................................................ 12
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 14
REVISION HISTORY
3/10—Rev. C to Rev. D
Removed B Version Text............................................... Throughout
Changes to Figure 1 .......................................................................... 1
Deleted Endnote 1 (Table 1)............................................................ 3
Deleted Endnote 1 (Table 2)............................................................ 4
Changes to Figure 2 .......................................................................... 6
Changes to Ordering Guide .......................................................... 14
12/09—Rev. B to Rev. C
Updated Format .................................................................. Universal
Changes to Table 3 ............................................................................ 5
Added Table 4.................................................................................... 6
Changes to Terminology Section.................................................. 11
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 14
7/02—Rev. A to Rev. B.
Changes to Product Name ............................................................... 1
Changes to Features.......................................................................... 1
Additions to Product Highlights .................................................... 1
Changes to Specifications ................................................................ 2
Edits to Absolute Maximum Ratings ............................................. 4
Changes to Terminology.................................................................. 4
Edits to Ordering Guide .................................................................. 4
Added New TPCs 4 and 5 ............................................................... 5
Replaced TPC 10............................................................................... 6
Test Circuits 6, 7, and 8 Replaced ................................................... 7
Updated RM-8 and RT-6 Package Outlines ................................. 9
Rev. D | Page 2 of 16
ADG719
SPECIFICATIONS
V
DD
= 5 V ± 10%, GND = 0 V.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (R
ON
)
+25°C
−40°C to +85°C
−40°C to +125°C
0 V to V
DD
2.5
4
On Resistance Match Between
Channels (ΔR
ON
)
On Resistance Flatness (R
FLAT(ON)
)
LEAKAGE CURRENTS I
S
(Off )
Source Off Leakage
Channel On Leakage I
D
, I
S
(On)
DIGITAL INPUTS
Input High Voltage, V
INH
Input Low Voltage, V
INL
Input Current
I
INL
or I
INH
DYNAMIC CHARACTERISTICS
1
t
ON
t
OFF
Break-Before-Make Time Delay, t
D
Off Isolation
0.75
1.2
±0.01
±0.25
±0.01
±0.25
1.5
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
nA typ
nA max
nA typ
nA max
V min
V max
μA typ
μA max
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
dB typ
dB typ
MHz typ
pF typ
pF typ
V
IN
= V
INL
or V
INH
V
S
= 0 V to V
DD
, I
S
= −10 mA;
See Figure 14
Test Conditions/Comments
5
0.1
0.4
7
V
S
= 0 V to V
DD
, I
S
= −10 mA
V
S
= 0 V to V
DD
, I
S
= −10 mA
V
DD
= 5.5 V
V
S
= 4.5 V/1 V, V
D
= 1 V/4.5 V;
See Figure 15
V
S
= V
D
= 1 V or V
S
= V
D
= 4.5 V;
See Figure 16
0.4
±0.35
±0.35
1
5
2.4
0.8
0.005
±0.1
7
12
3
6
8
1
−67
−87
−62
−82
200
7
27
Channel-to-Channel Crosstalk
Bandwidth −3 dB
C
S
(Off )
C
D
, C
S
(On)
POWER REQUIREMENTS
I
DD
R
L
= 300 Ω, C
L
= 35 pF
V
S
= 3 V; See Figure 17
R
L
= 300 Ω, C
L
= 35 pF
V
S
= 3 V; See Figure 17
RL = 300 Ω, C
L
= 35 pF,
V
S1
= V
S2
= 3 V; See Figure 18
R
L
= 50 Ω, C
L
= 5 pF, f = 10 MHz
R
L
= 50 Ω, C
L
= 5 pF, f = 1 MHz;
See Figure 19
R
L
= 50 Ω, C
L
= 5 pF, f = 10 MHz
R
L
= 50 Ω, C
L
= 5 pF, f = 1 MHz;
See Figure 20
R
L
= 50 Ω, C
L
= 5 pF; See Figure 21
V
DD
= 5.5 V
Digital inputs = 0 V or 5.5 V
0.001
1.0
μA typ
μA max
1
Guaranteed by design, not subject to production test.
Rev. D | Page 3 of 16
ADG719
V
DD
= 3 V ± 10%, GND = 0 V.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (R
ON
)
On Resistance Match Between
Channels (ΔR
ON
)
On Resistance Flatness (R
FLAT(ON)
)
LEAKAGE CURRENTS
Source Off Leakage I
S
(Off )
Channel On Leakage I
D
, I
S
(On)
DIGITAL INPUTS
Input High Voltage, V
INH
Input Low Voltage, V
INL
Input Current
I
INL
or I
INH
DYNAMIC CHARACTERISTICS
1
t
ON
t
OFF
Break-Before-Make Time Delay, t
D
Off Isolation
+25°C
−40°C to +85°C
−40°C to +125°C
0 V to V
DD
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
nA typ
nA max
nA typ
nA max
V min
V max
μA typ
μA max
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
dB typ
dB typ
MHz typ
pF typ
pF typ
V
IN
= V
INL
or V
INH
Test Conditions/Comments
6
7
10
0.1
0.4
2.5
12
V
S
= 0 V to V
DD
, I
S
= −10 mA;
See Figure 14
V
S
= 0 V to V
DD
, I
S
= −10 mA
V
S
= 0 V to V
DD
, I
S
= −10 mA
V
DD
= 3.3 V
V
S
= 3 V/1 V, V
D
= 1 V/3 V;
See Figure 15
V
S
= V
D
= 1 V or V
S
= V
D
= 3 V;
See Figure 16
0.4
±0.01
±0.25
±0.01
±0.25
±0.35
±0.35
1
5
2.0
0.8
0.005
±0.1
10
15
4
8
8
1
−67
−87
−62
−82
200
7
27
Channel-to-Channel Crosstalk
Bandwidth −3 dB
C
S
(Off )
C
D
, C
S
(On)
POWER REQUIREMENTS
I
DD
R
L
= 300 Ω, C
L
= 35 pF
V
S
= 2 V; See Figure 17
R
L
= 300 Ω, C
L
= 35 pF
V
S
= 2 V; See Figure 17
R
L
= 300 Ω, C
L
= 35 pF
V
S1
= V
S2
= 2 V; See Figure 18
R
L
= 50 Ω, C
L
= 5 pF, f = 10 MHz
R
L
= 50 Ω, C
L
= 5 pF, f = 1 MHz;
See Figure 19
R
L
= 50 Ω, C
L
= 5 pF, f = 10 MHz
R
L
= 50 Ω, C
L
= 5 pF, f = 1 MHz;
See Figure 20
R
L
= 50 Ω, C
L
= 5 pF; See Figure 21
V
DD
= 3.3 V
Digital inputs = 0 V or 3.3 V
0.001
1.0
μA typ
μA max
1
Guaranteed by design, not subject to production test.
Rev. D | Page 4 of 16
ADG719
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter
V
DD
to GND
Analog, Digital Inputs
1
Rating
−0.3 V to +7 V
−0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs
first
100 mA
(Pulsed at 1 ms, 10% duty
cycle max)
30 mA
−40°C to +125°C
−65°C to +150°C
150°C
315 mW
206°C/W
44°C/W
282 mW
229.6°C/W
91.99°C/W
300°C
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one maximum rating may be applied at any one time.
Peak Current, S or D
Continuous Current, S or D
Operating Temperature Range
Storage Temperature Range
Junction Temperature
MSOP Package, Power Dissipation
θ
JA
Thermal Impedance
θ
JC
Thermal Impedance
SOT-23 Package, Power Dissipation
θ
JA
Thermal Impedance
θ
JC
Thermal Impedance
Lead Soldering
Lead Temperature, Soldering
(10 sec)
IR Reflow, Peak Temperature
(<20 sec)
Soldering (Pb-Free)
Reflow, Peak Temperature
Time at Peak Temperature
ESD
1
ESD CAUTION
260(+0/−5)°C
20 sec to 40 sec
1 kV
Overvoltages at IN, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given
Rev. D | Page 5 of 16
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