Data Sheet
FEATURES
High Accuracy, Ultralow I
Q
, 500 mA,
anyCAP Low Dropout Regulator
ADP3335
FUNCTIONAL BLOCK DIAGRAM
IN
THERMAL
PROTECTION
Q1
OUT
High accuracy over line and load: ±0.9% at 25°C, ±1.8% over
temperature
Ultralow dropout voltage: 200 mV (typical) at 500 mA
Requires only C
O
= 1.0 µF for stability
anyCAP® = stable with any type of capacitor (including MLCC)
Current and thermal limiting
Low noise
Low shutdown current: < 10 nA (typical)
2.6 V to 12 V supply range
–40°C to +85°C ambient temperature range
ADP3335
CC
DRIVER
R1
NR
gm
R2
BANDGAP +
REF –
00147-0-001
SD
GND
Figure 1.
APPLICATIONS
PCMCIA cards
Cellular phones
Camcorders, cameras
Networking systems, DSL/cable modems
Cable set-top box
MP3/CD players
DSP supplies
5
NR
ADP3335
OUT
3
7
IN
OUT
2
OUT
1
GND
4
V
IN
C
IN
1µF
+
8
IN
SD
6
+
C
OUT
1µF
V
OUT
ON
OFF
Figure 2. Typical Application Circuit
GENERAL DESCRIPTION
The
ADP3335
is a member of the
ADP333x
family of precision,
low dropout, anyCAP voltage regulators. It operates with an input
voltage range of 2.6 V to 12 V, and delivers a continuous load
current up to 500 mA. The
ADP3335
stands out from conventional
low dropout regulators (LDOs) by using an enhanced process
enabling it to offer performance advantages beyond its competition.
Its patented design requires only a 1.0 µF output capacitor for
stability. This device is insensitive to output capacitor equivalent
series resistance (ESR), and is stable with any good quality
capacitor—including ceramic (MLCC) types for space-restricted
applications. The
ADP3335
achieves exceptional accuracy of
±0.9% at room temperature and ±1.8% over temperature, line,
and load.
The dropout voltage of the
ADP3335
is only 200 mV (typical) at
500 mA. This device also includes a safety current limit, thermal
overload protection, and a shutdown feature. In shutdown mode,
the ground current is reduced to less than 1 µA. The
ADP3335
has
a low quiescent current of 80 µA (typical) in light load situations.
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
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00147-0-002
ADP3335
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ........................................................................ 9
Data Sheet
Applications Information .............................................................. 10
Output Capacitor Selection....................................................... 10
Input Bypass Capacitor .............................................................. 10
Noise Reduction ......................................................................... 10
Thermal Overload Protection .................................................. 10
Calculating Junction Temperature ........................................... 10
Printed Circuit Board Layout Considerations ....................... 11
LFCSP Layout Considerations .................................................. 11
Shutdown Mode ......................................................................... 11
Outline Dimensions ....................................................................... 12
Ordering Guide .......................................................................... 13
REVISION HISTORY
10/13—Rev. C to Rev. D
Updated Outline Dimensions ....................................................... 12
Changes to Ordering Guide .......................................................... 13
12/12—Rev. B to Rev. C
Changes to Figure 14 and Figure 16 ............................................... 7
Updated Outline Dimensions ....................................................... 12
Changes to Ordering Guide .......................................................... 13
6/10—Rev. A to Rev. B
Added Exposed Pad Notation to Figure 4 and Table 3 ................ 5
Added Exposed Pad Notation to Outline Dimensions ............. 12
Changes to Ordering Guide .......................................................... 13
1/04—Rev. 0 to Rev. A
Format Updated .................................................................. Universal
Renumbered Figures .......................................................... Universal
Removed Figure 22............................................................................6
Change to Printed Circuit Board Layout Considerations
Section.............................................................................................. 11
Added LFCSP Layout Considerations Section ........................... 11
Added Package Drawing ................................................... Universal
Changes to Ordering Guide .......................................................... 16
Rev. D | Page 2 of 16
Data Sheet
SPECIFICATIONS
ADP3335
All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC) methods. Ambient
temperature of 85°C corresponds to a junction temperature of 125°C under pulsed full-load test conditions. Application stable with no
load. V
IN
= 6.0 V, C
IN
= C
OUT
= 1.0 µF, T
A
= –40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
OUTPUT
Voltage Accuracy
1
Symbol
V
OUT
Conditions
V
IN
= V
OUT(NOM)
+ 0.4 V to 12 V
I
L
= 0.1 mA to 500 mA
T
A
= 25°C
V
IN
= V
OUT(NOM)
+ 0.4 V to 12 V
I
L
= 0.1 mA to 500 mA
T
A
= 85°C
V
IN
= V
OUT(NOM)
+ 0.4 V to 12 V
I
L
= 0.1 mA to 500 mA
T
J
= 150°C
V
IN
= V
OUT(NOM)
+ 0.4 V to 12 V
I
L
= 0.1 mA
T
A
= 25°C
I
L
= 0.1 mA to 500 mA
T
A
= 25°C
V
OUT
= 98% of V
OUT(NOM)
I
L
= 500 mA
I
L
= 300 mA
I
L
= 50 mA
I
L
= 0.1 mA
V
IN
= V
OUT(NOM)
+ 1 V
f = 10 Hz to 100 kHz, C
L
= 10 µF
I
L
= 500 mA, C
NR
= 10 nF
f = 10 Hz to 100 kHz, C
L
= 10 µF
I
L
= 500 mA, C
NR
= 0 nF
I
L
= 500 mA
I
L
= 300 mA
I
L
= 50 mA
I
L
= 0.1 mA
V
IN
= V
OUT(NOM)
– 100 mV
I
L
= 0.1 mA
SD = 0 V, V
IN
= 12 V
ON
OFF
0 ≤ SD ≤ 5 V
V
IN
= 12 V, V
OUT
= 0 V
2.0
1.2
0.01
0.4
3
5
Min
–0.9
Typ
Max
+0.9
Unit
%
–1.8
+1.8
%
–2.3
+2.3
%
Line Regulation
1
0.04
mV/V
Load Regulation
Dropout Voltage
V
DROP
0.04
mV/mA
Peak Load Current
Output Noise
I
LDPK
V
NOISE
200
140
30
10
800
47
95
370
230
110
40
mV
mV
mV
mV
mA
µV rms
µV rms
GROUND CURRENT
In Regulation
I
GND
In Dropout
In Shutdown
SHUTDOWN
Threshold Voltage
SD Input Current
Output Current in Shutdown
1
I
GND
I
GNDSD
V
THSD
I
SD
I
OSD
4.5
2.6
0.5
80
120
0.01
10
6
2.5
110
400
1
mA
mA
mA
µA
µA
µA
V
V
µA
µA
V
IN
= 2.6 V to 12 V for models with V
OUT(NOM)
≤ 2.2 V.
Rev. D | Page 3 of 16
ADP3335
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Input Supply Voltage
Shutdown Input Voltage
Power Dissipation
Operating Ambient Temperature Range
Operating Junction Temperature Range
θ
JA
, 2-layer MSOP-8
θ
JA
, 4-layer MSOP-8
θ
JA
, 2-layer LFCSP-8
θ
JA
, 4-layer LFCSP-8
Storage Temperature Range
Lead Temperature Range (Soldering 10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
–0.3 V to +16 V
–0.3 V to +16 V
Internally Limited
–40°C to +85°C
–40°C to +150°C
220°C/W
158°C/W
62°C/W
48°C/W
–65°C to +150°C
300°C
215°C
220°C
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. D | Page 4 of 16
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
OUT
1
OUT
2
8
ADP3335
IN
IN
00147-0-022
ADP3335
7
6
5
TOP VIEW
OUT
3
(Not to Scale)
GND
4
SD
NR
Figure 3. 8-Lead MSOP
OUT 1
OUT 2
OUT 3
GND 4
8 IN
ADP3335
TOP VIEW
(Not to Scale)
7 IN
6 SD
5 NR
00147-0-025
NOTES
1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
ENHANCES THE THERMAL PERFORMANCE AND IS
ELECTRICALLY CONNECTED TO DIE SUBSTRATE.
THERMAL VIAS MUST BE ISOLATED OR CONNECTED
TO IN. DO NOT CONNECT THE THERMAL PAD TO
GROUND.
Figure 4. 8-Lead LFCSP
Table 3. Pin Function Descriptions
Pin No.
1, 2, 3
4
5
6
7, 8
EP
Mnemonic
OUT
GND
NR
SD
IN
Exposed
Pad
Function
Output of the Regulator. Bypass to ground with a 1.0 µF or larger capacitor. All pins must be connected together
for proper operation.
Ground Pin.
Noise Reduction Pin. Used for further reduction of output noise (see the Noise Reduction section for further
details).
Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shutdown is not used, this
pin should be connected to the input pin.
Regulator Input. All pins must be connected together for proper operation.
The exposed pad on the bottom of the LFCSP package enhances thermal performance and is electrically
connected to the die substrate, which is electrically common with the input pins, IN (Pin 7 and Pin 8), inside the
package.
Rev. D | Page 5 of 16
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