BF030-20A-A1-0400-0220-0600-NB datasheet, PDF

Datasheet> All Categories > The connector> The connector> BF030-20A-A1-0400-0220-0600-NB

BF030-20A-A1-0400-0220-0600-NB: DescriptionBoard Connector, 20 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal, Black Insulator,; CategoryThe connector The connector; File Size94KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BF030-20A-A1-0400-0220-0600-NB Overview

Board Connector, 20 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal, Black Insulator,

BF030-20A-A1-0400-0220-0600-NB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Reach Compliance Code	compliant
ECCN code	EAR99
Board mount options	PEG
body width	0.157 inch
subject depth	0.087 inch
body length	0.795 inch
Connector type	BOARD CONNECTOR
Contact to complete cooperation	AU ON NI
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	20 mΩ
Contact style	SQ PIN-SKT
Dielectric withstand voltage	500VAC V
Durability	100 Cycles
maximum insertion force	2.0016 N
Insulation resistance	1000000000 Ω
Insulator color	BLACK
insulator material	NYLON
JESD-609 code	e4
Manufacturer's serial number	BF030
Plug contact pitch	0.079 inch
Match contact row spacing	0.079 inch
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	3.7592 mm
Plating thickness	FLASH inch
Rated current (signal)	2 A
Guideline	UL
reliability	COMMERCIAL
Terminal pitch	2.0066 mm
Termination type	SURFACE MOUNT
Total number of contacts	20
Evacuation force-minimum value	.199882 N

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BF030: 2.0mm PITCH PIN HEADER, DUAL ROW, SURFACE MOUNT

Ordering Grid

BF030

XX X

XXXX

Packing Options

No. of Contacts

SPECIFICATIONS

规格

B = Tape & Reel with Cap (Standard)

06 to 50

CURRENT RATING

电流额定值

: 2 AMP

D = Tube

INSULATOR RESISTANCE

绝缘电阻值

: 1000 MEGAOHMS MIN.

Contact Plating

E = Tube with Cap

Insulator Material

Locating Peg

CONTACT RESISTANCE

接触电阻值

: 20 mOHMS MAX.

A = Gold Flash All Over

DIELECTRIC WITHSTANDING

耐电压

: AC 500 V

N = Nylon 6T

0 = No Peg

B = Selective Gold Flash Contact Area/

L = LCP (Standard)

1 = With Peg

OPERATING TEMPERATURE

工½温度

: -40°C TO +105°C

Tin On Tail

CONTACT MATERIAL

端子物料

: COPPER ALLOY

Dimension W (1/100mm)

C = Tin All Over

INSULATOR MATERIAL

绝缘½物料

(Footprint Width)

G = 10µ" Gold Contact Area/Tin On Tail

Dimension E (1/100mm)

STANDARD

标准物料

: POLYAMIDE

聚醯胺

, NYLON 6T, UL 94-V0

'H' = 2.00mm: Standard - 6.00mm = 0600

I = 30µ" Gold Contact Area/Tin On Tail

(PCB to Top of Insulator)

OPTIONS

可选物料

: POLYESTER

聚酯

, LCP, UL 94-V0

'H' = 1.50mm: Standard - 5.50mm = 0550

Standard = Gold Flash All Over

'H' = 2.00mm: Standard - 2.77mm = 0277

SOLDERING PROCESS

可焊性

Dimension D (1/100mm)

Or specify Dimension W

'H' = 1.50mm: Standard - 2.20mm = 0220

NYLON 6T (STANDARD

标准物料

) -

(Post Height)

e.g. 5.50mm = 0550

Insulator

Or specify Dimension E

IR REFLOW

回流焊

: 260°C for 10 sec.

Standard - 2.00mm = 0200

TOL +/- 0.2mm

Height 'H'

e.g. 2.50mm = 0250

WAVE

波峰焊

:230°C for 5-10 sec.

Standard - 4.00mm = 0400

A = 1.50mm

TOL +/- 0.2mm

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

Standard - 6.00mm = 0600

B = 2.00mm

LCP (OPTION

可选物料

) -

Or specify Dimension D

Standard = 2.00mm

e.g. 2.50mm = 0250

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

:250°C for 5-10 sec.

TOL +/- 0.2mm

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

Tolerances

Part Number:-

Date:-

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

(Except as noted)

BF065

BF075

BF080

BF095

BF100

26 OCT 07

BF030

Dimensions in mm

BF105

BF115

BF120

DETAIL

REV

DATE

LYH

DRAWING

RELEASE

26/10/07

PACKING OPTIONS

CHANGED

27/04/09

AMENDMENT TO

CHANGE TO SOLDER

TEMP. INFORMATION

STANDARD DIMENSIONS

08/12/09

30/07/09

X.°±5°

Description:-

.X°±2°

2.0mm PITCH PIN HEADER, DUAL ROW,

.XX°±1°

SURFACE MOUNT

X.XXX ± 0.10 .XXX°±0.5°

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Third Angle Projection

X.X ± 0.20

X.XX ± 0.15

X. ± 0.30

www.globalconnectortechnology.com

Scale

NTS

Material

See Note

Revision

Drawn by

LYH

E & OE

Sheet No.

1/1

Recommended Resources

Low power consumption induction cooker switching power supply module

Wide voltage stepper motor controller circuit

Light signal alarm circuit 02

DC booster circuit suitable for use with multimeters

Asymmetric square wave circuit

Single junction transistor sawtooth wave generator

[Mill MYB-YT507 development board trial experience] Serial port output: MYB-YT507H provides a 40-pin header with a 2.54mm pitch, interface J25. Through the TWI interface, Use the PCF8575 chip with a 16-bit quasi-bidirectional input/output (I/O) port to expand the general ...; lugl4313820 Domestic Chip Exchange

The most powerful perpetual calendar source code (supports 24 solar terms, supports all microcontrollers, ARM): The strongest perpetual calendar source code V2.0: 1. Support all MCUs, ARM, AVR, MSP430, PIC, etc. (support C development) 2. Can be embedded in any standard C compiler BC++, VC, ADS, KEIL, etc. 3. S...; tonytong MCU

Memory overflow during FreeRTOS sendto causes system crash: I recently encountered a problem. When a udp program sendto, it crashed. After checking, I found that it was a problem with a task scheduling in the tcpip_apimsg function. The initial analysis should ...; 王达业 Real-time operating system RTOS

Request a Trial: try out...; xingjh FPGA/CPLD

Philips launches Nexperia multimedia processor: Royal Philips Electronics introduces the innovative Nexperia mobile multimedia processor PNX0103, which not only enables ultra-fast downloading of content from mobile phones and portable flash memory ...; fighting DSP and ARM Processors

Component Analysis of the National Undergraduate Electronic Design Competition: [i=s]This post was last edited by paulhyde on 2014-9-15 09:03[/i] The list of components for the National Undergraduate Electronic Design Competition has been released today. Let's talk about it and a...; 青青丁丁 Electronics Design Contest

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components