|
AM3894BCYG150 |
AM3892BCYG120 |
AM3892BCYG150 |
AM3894ACYG120 |
AM3894BCYG120 |
AM3894BCYGA120 |
| Description |
Microprocessors - MPU Sitara ARM Microproc |
Microprocessors - MPU Sitara ARM MicroProc |
Microprocessors - MPU Sitara ARM Microproc |
Microprocessors - MPU Sitara ARM MCU |
Microprocessors - MPU Sitara ARM Microproc |
Microprocessors - MPU Sitara ARM MicroProc |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
- |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
- |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
BGA |
BGA |
- |
BGA |
BGA |
| package instruction |
25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031 |
25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031 |
25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031 |
- |
25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031 |
GREEN, PLASTIC, FCBGA-1031 |
| Contacts |
1031 |
1031 |
1031 |
- |
1031 |
1031 |
| Reach Compliance Code |
compliant |
compliant |
compliant |
- |
compliant |
compliant |
| ECCN code |
3A991.A.2 |
3A991.A.2 |
3A991.A.2 |
- |
3A991.A.2 |
3A991.A.2 |
| Address bus width |
16 |
16 |
16 |
- |
16 |
28 |
| bit size |
32 |
32 |
32 |
- |
32 |
32 |
| boundary scan |
YES |
YES |
YES |
- |
YES |
YES |
| maximum clock frequency |
27 MHz |
27 MHz |
27 MHz |
- |
27 MHz |
27 MHz |
| External data bus width |
16 |
16 |
16 |
- |
16 |
16 |
| Format |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
- |
FLOATING POINT |
FLOATING POINT |
| Integrated cache |
YES |
YES |
YES |
- |
YES |
YES |
| JESD-30 code |
S-PBGA-B1031 |
S-PBGA-B1031 |
S-PBGA-B1031 |
- |
S-PBGA-B1031 |
S-PBGA-B1031 |
| JESD-609 code |
e1 |
e1 |
e1 |
- |
e1 |
e1 |
| length |
25 mm |
25 mm |
25 mm |
- |
25 mm |
25 mm |
| low power mode |
YES |
YES |
YES |
- |
YES |
YES |
| Humidity sensitivity level |
4 |
4 |
4 |
- |
4 |
4 |
| Number of terminals |
1031 |
1031 |
1031 |
- |
1031 |
1031 |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
FBGA |
FBGA |
FBGA |
- |
FBGA |
FBGA |
| Encapsulate equivalent code |
BGA1031,37X37,25 |
BGA1031,37X37,25 |
BGA1031,37X37,25 |
- |
BGA1031,37X37,25 |
BGA1031,37X37,25 |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
- |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
- |
GRID ARRAY, FINE PITCH |
GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
245 |
245 |
245 |
- |
245 |
245 |
| power supply |
1 V |
1 V |
1 V |
- |
1 V |
1 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
| Maximum seat height |
3.31 mm |
3.31 mm |
3.31 mm |
- |
3.31 mm |
3.31 mm |
| speed |
1500 MHz |
1200 MHz |
1500 MHz |
- |
1200 MHz |
1200 MHz |
| Maximum supply voltage |
1.05 V |
1.05 V |
1.05 V |
- |
1.05 V |
1.05 V |
| Minimum supply voltage |
0.95 V |
0.95 V |
0.95 V |
- |
0.95 V |
0.95 V |
| Nominal supply voltage |
1 V |
1 V |
1 V |
- |
1 V |
1 V |
| surface mount |
YES |
YES |
YES |
- |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
- |
CMOS |
CMOS |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
BALL |
- |
BALL |
BALL |
| Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
- |
0.65 mm |
0.65 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
- |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
25 mm |
25 mm |
25 mm |
- |
25 mm |
25 mm |
| uPs/uCs/peripheral integrated circuit type |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
- |
MICROPROCESSOR, RISC |
MICROPROCESSOR, RISC |
| Base Number Matches |
1 |
1 |
1 |
- |
1 |
1 |