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AM3894BCYG120

Description
Microprocessors - MPU Sitara ARM Microproc
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,313 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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Microprocessors - MPU Sitara ARM Microproc

AM3894BCYG120 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeBGA
package instruction25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031
Contacts1031
Reach Compliance Codecompliant
ECCN code3A991.A.2
Address bus width16
bit size32
boundary scanYES
maximum clock frequency27 MHz
External data bus width16
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B1031
JESD-609 codee1
length25 mm
low power modeYES
Humidity sensitivity level4
Number of terminals1031
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA1031,37X37,25
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius)245
power supply1 V
Certification statusNot Qualified
Maximum seat height3.31 mm
speed1200 MHz
Maximum supply voltage1.05 V
Minimum supply voltage0.95 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1

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Description Microprocessors - MPU Sitara ARM Microproc Microprocessors - MPU Sitara ARM MicroProc Microprocessors - MPU Sitara ARM Microproc Microprocessors - MPU Sitara ARM MCU Microprocessors - MPU Sitara ARM Microproc Microprocessors - MPU Sitara ARM MicroProc
Is it lead-free? Lead free Lead free Lead free - Lead free Lead free
Is it Rohs certified? conform to conform to conform to - conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments - Texas Instruments Texas Instruments
Parts packaging code BGA BGA BGA - BGA BGA
package instruction 25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031 25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031 25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031 - 25 X 25 MM, 0.65 MM PITCH, GREEN, PLASTIC, FCBGA-1031 GREEN, PLASTIC, FCBGA-1031
Contacts 1031 1031 1031 - 1031 1031
Reach Compliance Code compliant compliant compliant - compliant compliant
ECCN code 3A991.A.2 3A991.A.2 3A991.A.2 - 3A991.A.2 3A991.A.2
Address bus width 16 16 16 - 16 28
bit size 32 32 32 - 32 32
boundary scan YES YES YES - YES YES
maximum clock frequency 27 MHz 27 MHz 27 MHz - 27 MHz 27 MHz
External data bus width 16 16 16 - 16 16
Format FLOATING POINT FLOATING POINT FLOATING POINT - FLOATING POINT FLOATING POINT
Integrated cache YES YES YES - YES YES
JESD-30 code S-PBGA-B1031 S-PBGA-B1031 S-PBGA-B1031 - S-PBGA-B1031 S-PBGA-B1031
JESD-609 code e1 e1 e1 - e1 e1
length 25 mm 25 mm 25 mm - 25 mm 25 mm
low power mode YES YES YES - YES YES
Humidity sensitivity level 4 4 4 - 4 4
Number of terminals 1031 1031 1031 - 1031 1031
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA FBGA FBGA - FBGA FBGA
Encapsulate equivalent code BGA1031,37X37,25 BGA1031,37X37,25 BGA1031,37X37,25 - BGA1031,37X37,25 BGA1031,37X37,25
Package shape SQUARE SQUARE SQUARE - SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH - GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) 245 245 245 - 245 245
power supply 1 V 1 V 1 V - 1 V 1 V
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 3.31 mm 3.31 mm 3.31 mm - 3.31 mm 3.31 mm
speed 1200 MHz 1200 MHz 1500 MHz - 1500 MHz 1200 MHz
Maximum supply voltage 1.05 V 1.05 V 1.05 V - 1.05 V 1.05 V
Minimum supply voltage 0.95 V 0.95 V 0.95 V - 0.95 V 0.95 V
Nominal supply voltage 1 V 1 V 1 V - 1 V 1 V
surface mount YES YES YES - YES YES
technology CMOS CMOS CMOS - CMOS CMOS
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL - BALL BALL
Terminal pitch 0.65 mm 0.65 mm 0.65 mm - 0.65 mm 0.65 mm
Terminal location BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 25 mm 25 mm 25 mm - 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC - MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1 1 - 1 1

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