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STRUCTURE
PRODUCT SERIES
TYPE
FEATURES
Silicon Monolithic Integrated Circuit
Motor Driver for electronic camera module
BD6360GUL
・Built
in 2 Full-ON H BridgeDrivers
・Built
in 1 comparator with hysteresis for photo-interrupter output waveform shaping
・Built
in 1 voltage-regulator for photo-interrupter
Absolute
maximum ratings (Ta=+25°C)
Parameter
Symbol
Power supply voltage
VCC
Control input voltage
VIN
Power dissipation
Pd
Operating
Topr
temperature range
Junction temperature
Tjmax
Storage temperature range
Tstg
H-bridge output current
Iout
※
1
※
2
Limit
-0.3 to +6.5
-0.3 to VCC+0.3
730
※
1
-25 to +85
+150
-55 to +150
-500 to +500
※
2
Unit
V
V
mW
°C
°C
°C
mA/ch
Reduced by 5.84mW/°C over 25°C, when mounted on a glass epoxy board (50mm
58mm
1.75mm; 8 layers)
Must not exceed Pd, ASO, or Tjmax of 150°C.
Operating
Conditions (Ta= -25°C to +85°C)
Parameter
Symbol
Power supply voltage
VCC
Control input voltage
VIN
H-bridge output current
Iout
3
※
Must not exceed Pd or ASO.
Min.
2.3
0
-
Typ.
3.0
-
-
Max.
5.5
VCC
3
400
※
Unit
V
V
mA/ch
REV. B
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BD6360GUL
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=3.0V)
Parameter
Overall
Circuit current
during standby operation
Symbol
Limit
Min.
Typ.
Max.
Unit
Conditions
ICCST
ICC
VINH
VINL
IINH
IINL
VUVLO
IBIPI
VLOPI
VHIPI
VTHPI
VHYSPI
RONSW
-
-
0
1.1
5
1.8
μA
mA
V
V
μA
μA
V
μA
V
V
V
mV
Ω
μA
Ω
PS=0V
PS=3V with no signal, and no load
Circuit current
High level input voltage
Low level input voltage
High level input current
Low level input current
Control input (VIN= IN1A, IN1B, IN2A, IN2B, SEL, and PS)
1.5
0
15
-1
-
-
30
0
VCC
0.5
60
-
VINH=3V, pull down resistance typ.100kΩ
VINL=0V
UVLO
UVLO voltage
Input bias current
Output low level voltage
Output high level voltage
1.6
-
2.2
Photo-interrupter (PI) comparator
-3
0
VCC-0.5
1.2
200
0
-
-
1.3
300
3
0.5
VCC
1.4
400
Io=+1mA
Io=-1mA
Lo→Hi threshold voltage
Hi→Lo threshold voltage VTHPI-VHYSPI
Threshold voltage
Hysteresis voltage
ON-Resistance
OFF current
Output ON-Resistance
Output AC characteristic
Turn-on time
Turn-off time
Rise time
Fall time
Photo-interrupter (PI) regulator
-
-1.0
-
0
10
-
Io=-30mA
BIAS=0V
ILSW
RON
ton
toff
tr
tf
Full-ON Drive block (ch1 and ch2)
-
1.00
1.25
Io=+400mA on high and low sides in total
-
-
0.1
-
0.6
0.08
0.15
0.03
2.0
0.5
1.0
0.2
μs
μs
μs
μs
Io=±400mA
Io=±400mA
Io=±400mA
Io=±400mA
Photo-interrupter
I/O Timing Chart
PS
H
L
CIN
1.3V
1.0V
COUT
VCC
0V
Hi impedance
Fig.1 Photo-interrupter I/O Timing Chart
REV. B
3/4
Package
Outline
1PIN
MARK
Pin
Arrangement (Top View)
1
2.1
±
0.1
2
3
4
AAG
Lot No.
2.1
±
0.1
Top View
A
OUT2B
CIN
COUT
BIAS
B
0.1
±
0.05
0.55 MAX
OUT2A
INDEX
POST
IN2A
VCC
S
0.08
S
Side View
C
OUT1B
IN1B
IN2B
SEL
15－φ0.25
±
0.05
φ0.05
A B
0.5
A
D
C
B
A
1
2
3
4
B
0.3
±
0.1
D
OUT1A
GND
IN1A
PS
(φ0.15)INDEX POST
P=0.5×3
Bottom View
Fig.3 BD6360GUL Pin Arrangement (Top View)
0.3
±
0.1
P=0.5×3
Fig.2 VCSP50L2 Package (Unit; mm)
Block
Diagram
VCC
4B
I/O
Truth Table
Tab. 1 BD6360GUL I/O Truth Table
INPUT
OUTPUT
INxB
X
L
H
L
H
L
H
X
OUTxA
Z
H
L
Z
L
H
L
Z
OUTxB
Z
L
H
Z
H
L
L
Z
BandGap
VCC
1D
OUT1A
PS
4D
Power Save
TSD
&
UVLO
MODE
PS
SEL
INxA
L
EN/IN
L
H
H
H
IN/IN
H
H
H
-
L
X
X
L
L
IN1A
3D
IN1B
2C
IN2A
3B
IN2B
3C
SEL
4C
VCC
PS_
H bridge
Logic
Pre Driver
H bridge
1A
OUT2B
2D
GND
BandGap
1C
OUT1B
1B
OUT2A
VREF
4A
BIAS
2A
CIN
3A
COUT
Fig.4 BD6360GUL Block Diagram
L : Low,
H : High,
X : Don’t care,
Z : Hi impedance
REV. B
4/4
I/O
Switching Waveform
100%
VIN
50%
ton
ton
toff
90%
50%
motor current
10%
-10%
-50%
-90%
tf
tr
-10%
-50%
-90%
tf
tr
-100%
toff
50%
10%
0%
90%
100%
50%
0%
Fig.5 BD6360GUL I/O Switching Waveform
Operation
Notes
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range (Topr) may
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such
damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the
IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.
(2)
Power supply lines
Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power
supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the
characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low
temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will
cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed
the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage
clamp diode between the power supply and ground pins.
(3)
(4)
(5)
(6)
(7)
Ground potential
Ensure a minimum GND pin potential in all operating conditions.
Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
ASO
When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO.
Thermal shutdown circuit
This IC incorporates a TSD (thermal shutdown) circuit (TSD circuit). If the temperature of the chip reaches the following
temperature, the motor coil output will be opened. The thermal shutdown circuit (TSD circuit) is designed only to shut the IC
off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to
use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed.
TSD ON temperature [°C] (Typ.)
175
(8)
Ground Wiring Pattern
When using both small signal GND and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations
caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring
pattern of any external components, either.
Hysteresis temperature [°C] (Typ.)
25
REV. B
Notice
Notes
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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