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CAT24C02LE-GA

Description
2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8
Categorystorage    storage   
File Size238KB,21 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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CAT24C02LE-GA Overview

2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8

CAT24C02LE-GA Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerON Semiconductor
Parts packaging codeDIP
package instructionDIP-8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum100
Durability1000000 Write/Erase Cycles
I2C control byte1010DDDR
JESD-30 codeR-PDIP-T8
JESD-609 codee4
length9.27 mm
memory density2048 bi
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize256X8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2/5 V
Certification statusNot Qualified
Maximum seat height5.33 mm
Serial bus typeI2C
Maximum standby current0.000005 A
Maximum slew rate0.002 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
CAT24C01, CAT24C02,
CAT24C04, CAT24C08,
CAT24C16
1-Kb, 2-Kb, 4-Kb, 8-Kb and
16-Kb I
2
C CMOS Serial
EEPROM
Description
http://onsemi.com
PDIP−8
L SUFFIX
CASE 646AA
MSOP−8
Z SUFFIX
CASE 846AD
TSSOP−8
Y SUFFIX
CASE 948AL
SOIC−8
W SUFFIX
CASE 751BD
TDFN−8*
VP2 SUFFIX
CASE 511AK
UDFN8−EP
HU4 SUFFIX
CASE 517AZ
TSOT−23
TD SUFFIX
CASE 419AE
TSOP−5**
TS SUFFIX
CASE 483
WLCSP−4***
C4A SUFFIX
CASE 567DC
WLCSP−5***
C5A SUFFIX
CASE 567DD
The CAT24C01/02/04/08/16 are 1−Kb, 2−Kb, 4−Kb, 8−Kb and
16−Kb respectively CMOS Serial EEPROM devices organized
internally as 8/16/32/64 and 128 pages respectively of 16 bytes each.
All devices support both the Standard (100 kHz) as well as Fast
(400 kHz) I
2
C protocol.
Data is written by providing a starting address, then loading 1 to 16
contiguous bytes into a Page Write Buffer, and then writing all data to
non−volatile memory in one internal write cycle. Data is read by
providing a starting address and then shifting out data serially while
automatically incrementing the internal address count.
External address pins make it possible to address up to eight
CAT24C01 or CAT24C02, four CAT24C04, two CAT24C08 and one
CAT24C16 device on the same bus.
Features
Supports Standard and Fast I
2
C Protocol
1.7 V to 5.5 V Supply Voltage Range
16−Byte Page Write Buffer
Hardware Write Protection for Entire Memory
Schmitt Triggers and Noise Suppression Filters on I
2
C Bus Inputs
(SCL and SDA)
Low power CMOS Technology
More than 1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Range
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
PIN CONFIGURATION
CAT24C__
16 / 08 / 04 / 02 / 01
NC / NC / NC / A
0
/ A
0
NC / NC / A
1
/ A
1
/ A
1
NC / A
2
/ A
2
/ A
2
/ A
2
V
SS
PIN CONFIGURATIONS
SCL
V
SS
SDA
1
2
3
4
V
CC
5
WP
TSOT−23 (TD), TSOP−5** (TS) (Top View)
** TSOP are available for the CAT24C02 only.
Pin 1
A
1
V
CC
2
V
SS
Pin 1
1
V
CC
SDA
B
SCL
SDA
WP
SCL
2
3
V
SS
A
B
C
1
2
3
4
8
7
6
5
V
CC
WP
SCL
SDA
WLCSP−4***
(Top Views)
WLCSP−5***
*** WLCSP are available for the CAT24C04,
CAT24C08 and CAT24C16 only.
Pin 1
TOP MARKING FOR WLCSP
(Ball Down)
X
YM
X = Specific Device
X =
Code
4 = 24C04
8 = 24C08
6 = 24C16
Pin 1
PDIP (L), SOIC (W), TSSOP (Y), MSOP (Z),
TDFN, (VP2)*, UDFN−EP (HU4) (Top View)
* The TDFN (VP2) package is not recommended for new designs.
X
YM
WLCSP−5
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 19 of this data sheet.
WLCSP−4
Y = Production Year (Last Digit)
M = Production Month (1−9, O, N, D)
©
Semiconductor Components Industries, LLC, 2013
February, 2013
Rev. 26
1
Publication Order Number:
CAT24C01/D

CAT24C02LE-GA Related Products

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Description 2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8 2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8 2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8 2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8 2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8 2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8 2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8 2K X 1 I2C/2-WIRE SERIAL EEPROM, PDSO8
memory width 8 16 8 8 8 1 1 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 8 5 8 8 8 8 8 8
Maximum operating temperature 125 °C 85 °C 125 °C 125 °C 125 °C 85 Cel 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 Cel -40 °C -40 °C
organize 256X8 128X16 512X8 1KX8 1KX8 2K × 1 2KX1 512X8
surface mount NO YES YES YES NO Yes YES NO
Temperature level AUTOMOTIVE INDUSTRIAL AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE INDUSTRIAL AUTOMOTIVE AUTOMOTIVE
Terminal form THROUGH-HOLE GULL WING NO LEAD NO LEAD THROUGH-HOLE NO NO LEAD THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL DUAL pair DUAL DUAL
Is it lead-free? Lead free - Lead free Lead free Lead free - - Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to - conform to conform to
Maker ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor - - ON Semiconductor
Parts packaging code DIP - SON SON DIP - SON DIP
package instruction DIP-8 TSSOP, TSOP5/6,.11,37 UDFN-8 HVSON, SOLCC8,.11,20 DIP, DIP8,.3 - HVSON, SOLCC8,.11,20 DIP, DIP8,.3
Contacts 8 - 8 8 8 - 8 8
Reach Compliance Code compli compliant compli compli compliant - unknow unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 - - EAR99
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz - 0.4 MHz 0.4 MHz
Data retention time - minimum 100 100 100 100 100 - 100 100
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010DDDR 1010000R 1010DDMR 1010DMMR 1010DMMR - 1010DDDR 1010DDMR
JESD-30 code R-PDIP-T8 R-PDSO-G5 R-PDSO-N8 R-PDSO-N8 R-PDIP-T8 - R-PDSO-N8 R-PDIP-T8
JESD-609 code e4 - e4 e4 e4 - e4 e4
length 9.27 mm 3 mm 3 mm 3 mm 9.27 mm - 3 mm 9.27 mm
memory density 2048 bi 2048 bit 4096 bi 8192 bi 8192 bit - 2048 bi 4096 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM - EEPROM EEPROM
word count 256 words 128 words 512 words 1024 words 1024 words - 2048 words 512 words
character code 256 128 512 1000 1000 - 2000 512
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSSOP HVSON HVSON DIP - HVSON DIP
Encapsulate equivalent code DIP8,.3 TSOP5/6,.11,37 SOLCC8,.11,20 SOLCC8,.11,20 DIP8,.3 - SOLCC8,.11,20 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL - SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 2/5 V 1.8/5 V 2/5 V 2/5 V 2/5 V - 2/5 V 2/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 5.33 mm 1.1 mm 0.55 mm 0.55 mm 5.33 mm - 0.8 mm 5.33 mm
Serial bus type I2C I2C I2C I2C I2C - I2C I2C
Maximum standby current 0.000005 A 0.000003 A 0.000005 A 0.000005 A 0.000002 A - 0.000005 A 0.000002 A
Maximum slew rate 0.002 mA 0.002 mA 0.002 mA 0.002 mA 0.002 mA - 0.002 mA 0.002 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.7 V 1.8 V 1.8 V 1.8 V - 1.8 V 1.8 V
Nominal supply voltage (Vsup) 3.3 V 5 V 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V
technology CMOS CMOS CMOS CMOS CMOS - CMOS CMOS
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal pitch 2.54 mm 0.95 mm 0.5 mm 0.5 mm 2.54 mm - 0.5 mm 2.54 mm
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 1.5 mm 2 mm 2 mm 7.62 mm - 2 mm 7.62 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms - 5 ms 5 ms
write protect HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE - HARDWARE HARDWARE

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