DFR0.5A~DFR0.5M
Surface Mount Fast Recovery Rectifiers
Major Ratings and Characteristics
0.5 A
I
F(AV)
50 V to 1000 V
V
RRM
15 A
I
FSM
5
μA
I
R
1.3V
V
F
150
°C
T
j
max.
Features
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Low profile space
Ideal for automated placement
Glass passivated chip junctions
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
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Case:
JEDEC SOD-123FL molded plastic
body over glass passivated chip
Terminals:
Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity:
Laser band denotes cathode end
Weight:
0.017gram
Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(T
A
= 25
°C
unless otherwise noted)
DFR- Symbol 0.5A
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
Maximum instantaneous forward voltage at 0.5A
Maximum DC reverse current
at Rated DC blocking voltage
T
A
= 25
℃
T
A
= 100℃
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
t
rr
C
J
T
J
, T
STG
50
35
50
0.5B
100
70
100
0.5D
200
140
200
0.5G
400
280
400
0.5
15
1.3
5.0
50
0.5J
600
420
600
0.5K
800
560
800
0.5M
1000
700
1000
UNIT
V
V
V
A
A
V
μA
Maximum reverse recovery time at I
F
= 0.5 A , I
R
=
1.0 A , I
rr
= 0.25 A
Typical junction capacitance at 4.0 V ,1MHz
Operating junction and storage temperature range
150
15
–55
to +150
250
500
nS
pF
℃
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http://www.trr-jx.com
Embedded System
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